Patents by Inventor Dave Roller

Dave Roller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and circuit board panel for circuit board manufacturing that prevents assembly-line delamination and sagging
    Patent number: 5831218
    Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations eliminate tearing/delamination and substantially reduce sagging.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: November 3, 1998
    Assignee: Motorola, Inc.
    Inventors: Kai X. Hu, Xinyu Dou, Chao-Pin Yeh, Don Dillard, Delbert Juarezl, Gary Mui, Tom Brey, Rich Dlesk, Karl Wyatt, Dave Roller