Patents by Inventor Dave W. Young

Dave W. Young has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of arranging solder balls for ball grid array packages
    Patent number: 7666778
    Abstract: A method of arranging solder balls in a hexagonal array on an integrated circuit package is disclosed. Arranging the solder balls in a hexagonal array may increase the solder ball density, reducing solder ball fatigue. In some embodiments, the solder balls are arranged in the hexagonal array under the die shadow and in an orthogonal array outbound of the die shadow.
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: February 23, 2010
    Assignee: Intel Corporation
    Inventor: Dave W. Young
  • Hexagonal array structure for ball grid array packages
    Patent number: 7259453
    Abstract: Solder balls may be arranged in hexagonal array on an integrated circuit package. The hexagonal array may increase the solder ball density, reducing solder ball fatigue. In some embodiments, the hexagonal array may be utilized under the die shadow and an orthogonal array may be used outbound thereof.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: August 21, 2007
    Assignee: Intel Corporation
    Inventor: Dave W. Young