Abstract: An example mold assembly includes a first core, a second core, and a retaining cap. The first core defines an insert seat configured to receive a mold insert. The first core and the second core are configured to define a mold volume adjacent the mold insert. The retaining cap is disposed about a curved end portion defined by the second core, and defines a curved cap surface in contact with the curved end portion. The retaining cap is configured to secure the second core at a predetermined orientation relative to the first core within predetermined tolerances. An example technique includes positioning a mold insert in the mold assembly, disposing the retaining cap about the second core, securing the second core at a predetermined orientation relative to the first core within predetermined tolerances, and depositing mold material within the mold volume.

Abstract: An example mold assembly includes a first core, a second core, and a retaining cap. The first core defines an insert seat configured to receive a mold insert. The first core and the second core are configured to define a mold volume adjacent the mold insert. The retaining cap is disposed about a curved end portion defined by the second core, and defines a curved cap surface in contact with the curved end portion. The retaining cap is configured to secure the second core at a predetermined orientation relative to the first core within predetermined tolerances. An example technique includes positioning a mold insert in the mold assembly, disposing the retaining cap about the second core, securing the second core at a predetermined orientation relative to the first core within predetermined tolerances, and depositing mold material within the mold volume.

Abstract: A connector assembly for an implantable medical device with hardware components placed in established physical locations within the polymer of the connector, and a method of making the assembly. One embodiment includes a method that involves forming a first shot, coupling at least one hardware component to the first shot to form a subassembly, placing the subassembly between a set of opposing areas of a mold, moving at least one of the areas of the set of opposed areas of the mold to constrain the subassembly within the mold, and introducing a second shot over at least a portion of the subassembly to form the connector.

Abstract: A connector assembly for an implantable medical device with hardware components placed in established physical locations within the polymer of the connector, and a method of making the assembly. One embodiment includes a method that involves forming a first shot, coupling at least one hardware component to the first shot to form a subassembly, placing the subassembly between a set of opposing areas of a mold, moving at least one of the areas of the set of opposed areas of the mold to constrain the subassembly within the mold, and introducing a second shot over at least a portion of the subassembly to form the connector.

Abstract: A connector assembly for an implantable medical device with hardware components placed in established physical locations within the polymer of the connector, and a method of making the assembly. One embodiment includes a method that involves forming a first shot, coupling at least one hardware component to the first shot to form a subassembly, placing the subassembly between a set of opposing areas of a mold, moving at least one of the areas of the set of opposed areas of the mold to constrain the subassembly within the mold, and introducing a second shot over at least a portion of the subassembly to form the connector.

Abstract: A breastpump is provided with a universal suction hood base that can be used with a set of different shields. An improved shield is further disclosed which is more flexible and conforms more readily to the breast, and also provides massage.

Abstract: A surface mount ceramic package, e.g. for a microwave or millimeter wave integrated circuit device, has outer conductive pads that are available for direct connection with traces on the printed circuit board. A metal core or base has spaces at one or more sides, e.g., voids or cutouts, where the outer pads are located. There is a first ceramic layer disposed on the core, with a central cavity for the die, and an upper or second ceramic layer. Printed traces are buried between the two layers, and vias connect the traces with the outer pads. Inner pads are located on a ledge of the first layer adjacent the cavity for connection with electrodes of the die. Each of the first and second ceramic layers may be stacked ceramic tape. The package may be LTCC or HTCC. This construction avoids inductive losses, especially at higher frequencies.

Abstract: A surface mount ceramic package, e.g. for a microwave or millimeter wave integrated circuit device, has outer conductive pads that are available for direct connection with traces on the printed circuit board. A metal core or base has spaces at one or more sides, e.g., voids or cutouts, where the outer pads are located. There is a first ceramic layer disposed on the core, with a central cavity for the die, and an upper or second ceramic layer. Printed traces are buried between the two layers, and vias connect the traces with the outer pads. Inner pads are located on a ledge of the first layer adjacent the cavity for connection with electrodes of the die. Each of the first and second ceramic layers may be stacked ceramic tape. The package may be LTCC or HTCC. This construction avoids inductive losses, especially at higher frequencies.

Abstract: An improved vacuum adjustment mechanism for controlling airflow into a chamber which is subject to negative pressure, such as the chamber of a diaphragm pump which is generating vacuum for a breast shield assembly, has an air inlet conduit communicating with the chamber. A channel is formed in a base member, with the channel having a longitudinal length and a dimension perpendicular to that length. The perpendicular dimension varies from a minimum to a maximum. The channel has a bottom and is open, such as along a channel top. An airhole is formed in the channel bottom at the point of the maximum dimension. A rotary member is mounted on the base member, and has an internal channel extending across the longitudinal length of the base member channel, and overlies the channel top. The internal channel of the rotary member communicates with an air source, such as ambient air.

Abstract: A breastpump is provided with a universal suction hood base that can be used with a set of different shields. An improved shield is further disclosed which is more flexible and conforms more readily to the breast, and also provides massage.

Abstract: A breastpump is provided with a universal suction hood base that can be used with a set of different shields. An improved shield is further disclosed which is more flexible and conforms more readily to the breast, and also provides massage.

Abstract: A standing axial-leaded surface mount capacitor is formed of a dielectric chip capacitor sandwiched between first and second blocks. The end blocks have profiles to match the profile of said chip capacitor. The end blocks are conductive at least on their outer surfaces and serve as leads to attaching to metallic surface traces of a printed circuit. In one preferred embodiment, the end blocks are ceramic cubes with metallic surfaces on its faces. The metallized cubes give the device rotational symmetry about its long axis, so that the capacitor will have identical performance in any orientation. This feature makes it possible to automatically pick and place the device onto a circuit board. Preferably, the dielectric chip has a square profile of the same dimension as the ceramic cubes. The profile of the cubes and the chip can be 20 to 25 mils to match the width of a typical printed circuit trace. The capacitors can be of any typical value, i.e., between 0.05 and 300 pf.

Abstract: A device for holding an endotracheal tube in various positions in alignment with the mouth of a patient. The tube holder has a tube holding support engaged on a frame for the holder in alignment with the mouth of a patient. The support is adjustable along the frame to position the support in various locations along the frame while still in alignment with the patient's mouth. The frame is shaped to engage the chin of a patient, and is pliant in order to conform to the chin.

Abstract: The electrical operating characteristics of a microwave circuit are modified by providing a dielectric layer on the circuit in a pattern which modifies the electrical characteristics of an overlay responsive portion of the circuit in a manner which results in the overall circuit having a desired electrical operating characteristic within a tolerance. Adjustment of the operating characteristics may be done in an iterative manner of measuring the characteristics, modifying the distribution of dielectric material and remeasuring the operating characteristics until satisfactory operating characteristics are obtained.

Abstract: By employing High Density Interconnect (HDI) multi-chip modules (MCMs) having elements of a distributed power supply embedded in the MCM itself, the functions of an MCM and a power converter are combined. The embedded power supply elements include DC-DC or AC-DC converters to convert an input voltage and input current to a relatively lower output voltage and relatively higher output current, thereby decreasing the current requirements of external power supply lines connected to the multi-chip module. The current and voltage outputs may be connected to chip power inputs through relatively short, low-impedance power distribution conductors comprising copper strips direct bonded to a ceramic substrate; alternatively, or in combination with direct bonded copper conductors, the low-impedance power distribution conductors may be situated within an HDI overcoat structure. The power supply elements may be placed within cavities formed in the substrate, or on a thinner portion of the substrate.

Abstract: A test fixture for testing microwave components enables components to be tested with high correlation between the component's test results and its operation in a system. The test fixture provides for non-destructive mounting of and connection of the component to the test fixture in the same manner as it will be connected in the final system and also provides for tailoring of the test connections as may be desired.

Abstract: A projection-type male connector component includes a buttress of insulative polymeric material surrounded by a number of electrically conductive contacts electrically isolated from each other. The male component is designed to mate with an equal number of female cantilever beam contacts. The buttress is provided with a tapered end and the male contacts are bent over this tapered end so that the female contacts touch the male contacts when the male and female contacts are mated rather than the insulative material from which the buttress is made. In this way, excessive wear of the female contacts is avoided.

Abstract: A system for holding and delivery a plurality of disposable cannula adaptors. A dispenser is provided with a dispensing surface having a series of posts or other means for retaining a plurality of disposable cannula adaptors in a spaced relationship. The posts extend upwardly, and preferably two or more adaptors can be accommodated on each post. A plurality of the dispensers can be employed in a stacked relationship, with the dispensers having the posts extending from one side thereof and one or more post retainers formed on the opposite side and in alignment with a post on the next lower dispenser. In an alternative form, the dispenser has an adhesive dispensing surface, and the cannula adaptors are applied in a spaced relationship to the adhesive surface.

Abstract: Microwave components are prepackaged and pretested to provide standard microwave components or subsystems. A dielectric overlay interconnection structure enables accurate testing and rework of out of specification packages. Microwave systems are formed of a plurality of such prepackaged components with a high yield.

Abstract: A conductively enclosed hybrid integrated circuit assembly for use with microwave and millimeter wave signals is disclosed. The enclosure utilizes a silicon substrate into which recesses are formed by conventional silicon etching processes to support individual MMIC chips with their surfaces flush with the unetched substrate surfaces. The assembly is covered with a thin solid dielectric layer, perforated over points of connection and followed by a metallization to provide point-to-point connections. The arrangement provides one or more levels of patterned metallizations with additional levels being provided either by additional dielectric layers or by forming the silicon substrate from three or more laminar elements and providing a patterned metallization on the surface of an intermediate element. Efficiency in signal grounding and in rf transmission line paths is assured by surface metallizations and the provision of low impedance paths through the substrate.