Abstract: A neutralizing composition comprising ascorbic acid as a reducing agent, citric acid as a chelator and a pH adjusting agent applied to microetched copper substrates bussed to stainless steel, which have been cleaned with an agent comprising permanganate ions. Unlike the prior art neutralizing agents comprising oxalic acid, which leave insoluble residue on the surface of the copper substrate, the present neutralizing composition leaves no residue and acts quickly. A surprising reduction in defects of Ni—Au plated copper substrates is achieved by utilization of the neutralization composition in a manufacturing process.