Abstract: A method and apparatus for determining bulk material constants such as Poisson's ratio and the ratio of shear modulus to bulk modulus for elastomeric materials, including, but not limited to elastomers, rubbers, gels and sealants is disclosed. The bulk material properties are determined by measuring the pressure change of the elastomeric material when the elastomeric material is subjected to an applied pressure. The changes in the bulk material property due to temperature or a the addition of a diluent may also be determined. The apparatus includes a container that holds the elastomeric material. A pressure sensor is located in the container and is positioned to measure the pressure of the elastomeric material. The signal from the pressure sensor along with the applied pressure is used to determine a bulk material property such as Poisson's ratio or the ratio of shear modulus to bulk modulus for the elastomeric material.

Abstract: A method and apparatus for determining bulk material constants such as Poisson's ratio and the ratio of shear modulus to bulk modulus for elastomeric materials, including, but not limited to elastomers, rubbers, gels and sealants is disclosed. The bulk material properties are determined by measuring the pressure change of the elastomeric material when the elastomeric material is subjected to an applied pressure. The changes in the bulk material property due to temperature or a the addition of a diluent may also be determined. The apparatus includes a container that holds the elastomeric material. A pressure sensor is located in the container and is positioned to measure the pressure of the elastomeric material. The signal from the pressure sensor along with the applied pressure is used to determine a bulk material property such as Poisson's ratio or the ratio of shear modulus to bulk modulus for the elastomeric material.

Abstract: Polyamide substrates are pre-conditioned for electroless plating by contact with an aqueous alkaline solution having a pH of at least about 10 and etched with an aqueous acid etch solution of an organic acid containing at least two carbon atoms, in combination with from 1 to 10 percent by weight of an inorganic acid which is nondeleteriously reactive with the organic acid. Trichloroacetic acid is the preferred organic acid and sulfuric, hydrochloric and/or nitric the preferred inorganic acids. Contact with the aqueous alkaline solution can be eliminated where the polyamide is caprolactam.

Abstract: Filled polyester substrates are conditioned for electroless plating by contact with an alkaline conditioner having a pH of at least 8, followed by contact with an aqueous acid fluoride etch solution having a pH less than about 5 and a fluoride concentration of at least 1 mole per liter of solution.

Abstract: Filled polycarbonate resin substrates are conditioned for electroless plating by contact with an alkaline conditioner having a pH of at least 8, followed by contact with an aqueous acid fluoride etch solution having a pH less than about 5 and a fluoride concentration of at least 1 mole per liter of solution.

Abstract: Polyamide substrates are pre-conditioned for electroless plating by contact with an alkaline aqueous solution having a pH of at least about 10 and etched with an aqueous acid etch solution. The aqueous acid etch solution is preferably an aqueous solution of an organic acid containing at least two carbon atoms, particularly an acetic acid compound, such as trichloroacetic acid.

Abstract: Caprolactam polymeric substrates are conditioned for electroless plating by etching with an aqueous solution of organic acid containing from 2 to 4 carbon atoms, preferably an acetic acid compound, such as trichloroacetic acid.