Abstract: A system is configured to provide guided interfaces and support for users throughout the process of abandoning an oil or gas well, and to create and issue carbon credits corresponding to the abandonment upon completion of the project. The system architecture is configured to ensure that carbon credits issued from the system are transparent and auditable, and that underlying support for the credits is accurate and supports the additionality and permanence of the project. Project information and documentation is stored on a public blockchain and distributed file system to ensure immutability and availability of the records. Carbon credits from a completed project are issued as tokens or other digital assets that may be exchanged between parties, and retired for reporting and emission offset purposes. Each token minted by the system links back to a specific project on the blockchain, allowing for public review of all supporting information and documentation.

Abstract: Marine seismic surveys, including ocean bottom surveys, utilizing marine vibrator arrays that are capable of being driven in anti-phase to produce a directional source gradient. Marine seismic surveys may include activating the vibrator array to emit a plurality of radiation patterns with at least a first radiation pattern that has a first notch at a take-off angle that is not close to vertical. Some marine seismic surveys included emitting directive wavefields from two or more simultaneous seismic source arrays, where the two or more seismic source arrays have a phase that changes from shot-to-shot to allow simultaneous source separation of the directive wavefields.

Abstract: Marine seismic surveys, including ocean bottom surveys, utilizing marine vibrator arrays that are capable of being driven in anti-phase to produce a directional source gradient. Marine seismic surveys may include activating the vibrator array to emit a plurality of radiation patterns with at least a first radiation pattern that has a first notch at a take-off angle that is not dose to vertical. Some marine seismic surveys included emitting directive wavefields from two or more simultaneous seismic source arrays, where the two or more seismic source arrays have a phase that changes from shot-to-shot to allow simultaneous source separation of the directive wavefields.

Abstract: Packages are configured to include an electromagnetic interference (EMI) shield. According to one example, a package includes a substrate, an electrical component, and an EMI shield. The substrate includes a first surface and a second surface. The electrical component may be coupled to the first side of the substrate. The EMI shield is formed with at least one passive device. The at least one passive device is coupled to the first surface of the substrate. The at least one passive device is located laterally to the at least one electrical component, and extends along at least a portion of the electrical component. Other aspects, embodiments, and features are also included.

Abstract: A shipping package (1) comprises an enclosure for receiving content within, a closure (14) for sealing the enclosure, a label comprising shipping information, a network module (380), a sensor module (382), and a battery module (384). The battery module provides power to the network module and the sensor module. The sensor module (382) providing location information to the network module, the network module transmits a shipping status message to an external device.

Abstract: A shipping package (1) comprises an enclosure for receiving content within, a closure (14) for sealing the enclosure, a label comprising shipping information, a network module (380), a sensor module (382), and a battery module (384). The battery module provides power to the network module and the sensor module. The sensor module (382) providing location information to the network module, the network module transmits a shipping status message to an external device.

Abstract: A thermal insulation pad is for attachment between a bracket and substructure in a building cladding assembly. The thermal insulation pad includes a thermal insulation material and at least one spacing member for limiting compression of the thermal insulation material during use.

Abstract: A package that includes a first redistribution portion, a second redistribution portion, a third redistribution portion, a first encapsulation layer coupled to the first redistribution portion and the third redistribution portion, a first discrete device encapsulated by the first encapsulation layer, wherein the first discrete device is located between the first redistribution portion and the third redistribution portion, a second encapsulation layer coupled to the first redistribution portion and the second redistribution portion, and a second discrete device encapsulated by the second encapsulation layer, wherein the second discrete device is located between the first redistribution portion and the second redistribution portion.

Abstract: A package that includes a first substrate, an integrated device coupled to the first substrate, a second substrate coupled to the integrated device, and an encapsulation layer located between the first substrate and the second substrate. The second substrate is configured to operate as a heat spreader. The second substrate is configured to be free of an electrical connection with the integrated device.

Abstract: Examples of semiconductor packages with stacked RDLs described herein may include, for example, a first RDL comprising multiple RDL layers coupled to a second RDL comprising multiple RDL layers using copper pillars and an underfill in place of a conventional substrate. The examples herein may use RDLs instead of substrates to achieve smaller design feature size (x, y dimensions reduction), thinner copper layers and less metal usage (z dimension reduction), flexibility to attach semiconductor dies and surface mount devices (SMD) on either side of the package, and less number of built-up RDL layers.

Abstract: Packages are configured to include an electromagnetic interference (EMI) shield. According to one example, a package includes a substrate, an electrical component, and an EMI shield. The substrate includes a first surface and a second surface. The electrical component may be coupled to the first side of the substrate. The EMI shield is formed with at least one passive device. The at least one passive device is coupled to the first surface of the substrate. The at least one passive device is located laterally to the at least one electrical component, and extends along at least a portion of the electrical component. Other aspects, embodiments, and features are also included.

Abstract: A package that includes a first redistribution portion, a second redistribution portion, a third redistribution portion, a first encapsulation layer coupled to the first redistribution portion and the third redistribution portion, a first discrete device encapsulated by the first encapsulation layer, wherein the first discrete device is located between the first redistribution portion and the third redistribution portion, a second encapsulation layer coupled to the first redistribution portion and the second redistribution portion, and a second discrete device encapsulated by the second encapsulation layer, wherein the second discrete device is located between the first redistribution portion and the second redistribution portion.

Abstract: Integrated circuit (IC) packages employing split, double-sided IC metallization structures to facilitate a semiconductor die (“IC die”) module employing stacked dice, and related fabrication methods are disclosed. Multiple IC dice in the IC package are stacked and bonded together in a back-to-back, top and bottom IC die configuration in an IC die module, which can minimize the overall height of the IC package. The metallization structure is split between separate top and bottom metallization structures adjacent to respective top and bottom surfaces of the IC die module to facilitate die-to-die and external electrical connections to the dice. The top and bottom metallization structures can be double-sided by exposing substrate interconnects on respective inner and outer surfaces for respective die and external electrical interconnections.

Abstract: A package that includes a first substrate, an integrated device coupled to the first substrate, a second substrate coupled to the integrated device, and an encapsulation layer located between the first substrate and the second substrate. The second substrate is configured to operate as a heat spreader. The second substrate is configured to be free of an electrical connection with the integrated device.

Abstract: Marine seismic surveys, including ocean bottom surveys, utilizing marine vibrator arrays that are capable of being driven in anti-phase to produce a directional source gradient. Marine seismic surveys may include activating the vibrator array to emit a plurality of radiation patterns with at least a first radiation pattern that has a first notch at a take-off angle that is not close to vertical. Some marine seismic surveys included emitting directive wavefields from two or more simultaneous seismic source arrays, where the two or more seismic source arrays have a phase that changes from shot-to-shot to allow simultaneous source separation of the directive wavefields.

Abstract: Marine seismic data can be processed to remove or reduce two or more source side acquisition effects jointly when 1) the effects are placed in the same data domain as the received data and 2) the effects are described using the same basis functions which may signify representing the received data and the effects in the same chosen transform domain. The data effects may include source signature removal, source radiation pattern removal, residual shot noise suppression and data regularization, multi-channel reconstruction or regularization, prediction of sea surface multiples, separation of simultaneous sources etc. The joint processing can use iterative or non-iterative inversion technique, where the iterative inversion technique may be a matching pursuit technique.

Abstract: Examples of semiconductor packages with stacked RDLs described herein may include, for example, a first RDL comprising multiple RDL layers coupled to a second RDL comprising multiple RDL layers using copper pillars and an underfill in place of a conventional substrate. The examples herein may use RDLs instead of substrates to achieve smaller design feature size (x, y dimensions reduction), thinner copper layers and less metal usage (z dimension reduction), flexibility to attach semiconductor dies and surface mount devices (SMD) on either side of the package, and less number of built-up RDL layers.

Abstract: Marine seismic surveys, including ocean bottom surveys, utilizing marine vibrator arrays that are capable of being driven in anti-phase to produce a directional source gradient. Marine seismic surveys may include activating the vibrator array to emit a plurality of radiation patterns with at least a first radiation pattern that has a first notch at a take-off angle that is not close to vertical. Some marine seismic surveys includes emitting directive wavefields from two or more simultaneous seismic source arrays, where the two or more seismic source arrays have a phase that changes from shot-to-shot to allow simultaneous source separation of the directive wavefields.

Abstract: A method for processing seismic data may include receiving, via a processor, the seismic data acquired via a seismic survey. The seismic survey may include seismic sources that emit seismic wavefields at different locations. Each of the seismic sources may change a directivity pattern of a respective seismic wavefield based on a respective location of the respective seismic source. The seismic survey may also include seismic receivers that may receive the seismic data. The method may also include generating one or more basis functions that correspond to measurements of the seismic data, modelling a signal component of the seismic data as a sum of the one or more basis functions, and storing the signal component in a storage component. The signal component may be used to acquire an image of a subsurface region of the earth for identifying a feature in the subsurface region of the earth.

Abstract: Methods of acquiring and processing seismic data using derivative sensors, such as strain sensors, that facilitate ground roll noise attenuation with seismic interferometry are disclosed. The methods use both seismic data and their spatial derivatives in computing ground-roll noises which are removed from processed seismic data.