Abstract: Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.

Abstract: A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and bottom surfaces. Top unit terminals are exposed at the top surfaces and bottom unit terminals are exposed at the bottom surfaces. The top and bottom unit terminals are provided at a set of ordered column positions. Each top unit terminal of the set, except the top unit terminals at the highest ordered column position, is connected to a respective bottom unit terminal of the same unit at a next higher ordered column position. Each bottom unit terminal of the set, except the bottom unit terminals of the lowest unit in the stack, is connected to a respective upper unit terminal of the next lower unit in the stack at the same column position.

Abstract: In one embodiment, a construction panel system comprises a first panel of one or more construction panels. The first construction panel comprises a core board, a first insulation layer coupled to a first side of the core board, and a second insulation layer coupled to a second side of the core board, where the core board provides a structural integrity for the first panel, the first insulation layer substantially covers the first side of the core board and the second insulation layer substantially covers the second side of the core board.

Abstract: A method and a system for analyzing a data value of interest in a multidimensional database. The data value of interest is first identified in a structured report. The data source for the structured report is retrieved. A context for the data value of interest in the data source is collected, for example, by extracting a slicer from the structured report, by extracting members of master-detail pages, or by extracting a default measure from the structured report. An analysis specification based on the collected context is then built, and the data value of interest is analyzed using the analysis specification. The result from analyzing the data value of interest may be presented in an analysis view.

Abstract: Embodiments of the invention can provide systems, methods, and apparatus for bidirectional printhead maintenance. One embodiment of the invention can provide a method for providing maintenance to a printhead comprising one or more ink nozzles for dispensing ink. The method can include providing a wiper for a printhead, wherein the wiper can include at least a first edge and a second edge. In addition, the method can include manipulating the first edge of the wiper in a forward or rearward direction across some or all of the ink nozzles during printing, wherein at least a portion of the nozzles can be cleaned by the first edge. Furthermore, the method can include manipulating the second edge of the wiper in a forward or rearward direction across some or all of the ink nozzles based at least in part on a maintenance-type command, wherein at least a portion of the nozzles can be cleaned by the second edge.

Abstract: Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. Additionally, the first heater array and the second heater array are operable to receive heating responsive to the temperature of the region sensed by the temperature sensing element to regulate the temperature of the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor and the heating may occur via non-nucleating heating.

Abstract: A processing system comprising processors and the dynamically configurable communication elements coupled together in an interspersed arrangement. The processors each comprise at least one arithmetic logic unit, an instruction processing unit, and a plurality of processor ports. The dynamically configurable communication elements each comprise a plurality of communication ports, a first memory, and a routing engine. For each of the processors, the plurality of processor ports is configured for coupling to a first subset of the plurality of dynamically configurable communication elements. For each of the dynamically configurable communication elements, the plurality of communication ports comprises a first subset of communication ports configured for coupling to a subset of the plurality of processors and a second subset of communication ports configured for coupling to a second subset of the plurality of dynamically configurable communication elements.

Abstract: Embodiments of the invention describe an electrical audio connector assembly used in a variety of applications, such as for connecting audio components for transferring audio signals. For example, microphones may be connected to other electrical components by XLR connectors or a phone line. An electrical audio connector assembly includes an XLR connector or three pins and an RJ connector mounted on opposite ends of a body structure. Three metal binding posts project from the body structure, and are conductively coupled to both the XLR connector and the RJ connector.

Abstract: A processing system comprising processors and the dynamically configurable communication elements coupled together in an interspersed arrangement. The processors each comprise at least one arithmetic logic unit, an instruction processing unit, and a plurality of processor ports. The dynamically configurable communication elements each comprise a plurality of communication ports, a first memory, and a routing engine. For each of the processors, the plurality of processor ports is configured for coupling to a first subset of the plurality of dynamically configurable communication elements. For each of the dynamically configurable communication elements, the plurality of communication ports comprises a first subset of communication ports configured for coupling to a subset of the plurality of processors and a second subset of communication ports configured for coupling to a second subset of the plurality of dynamically configurable communication elements.

Abstract: A system, method, and computer program product for generating a distributable software package, including loading a template/profile; loading at least one module; receiving configuration options over a network connection; and assembling a distributable software package according to the profile, template(s), modules, and the configuration options.

Abstract: An electrical audio connector assembly includes an XLR connector and an RJ connector mounted on opposite ends of a body structure. Three metal binding posts project from the body structure, and they are conductively coupled to both the XLR connector and the RJ connector.

Abstract: A microelectronic assembly and a fabrication method are provided which includes a microelectronic element such as a chip or element of a package. A plurality of surface-mountable contacts are arranged in an array exposed at a major surface of the microelectronic element. One or more passive elements, e.g., a resistor, inductor, capacitor, or combination of the same are mounted to the microelectronic element, with an inner terminal of the passive element conductively mounted to an exposed surface of one contact and an outer terminal displaced vertically from the major surface of the microelectronic element.

Abstract: A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.

Abstract: A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and bottom surfaces. Top unit terminals are exposed at the top surfaces and bottom unit terminals are exposed at the bottom surfaces. The top and bottom unit terminals are provided at a set of ordered column positions. Each top unit terminal of the set, except the top unit terminals at the highest ordered column position, is connected to a respective bottom unit terminal of the same unit at a next higher ordered column position. Each bottom unit terminal of the set, except the bottom unit terminals of the lowest unit in the stack, is connected to a respective upper unit terminal of the next lower unit in the stack at the same column position.

Abstract: A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.

Abstract: A dispensing nozzle having: (i) an elongate nozzle body having a base portion and a dispensing end; (ii) an internal conduit in the nozzle body for delivering product from the base portion to the dispensing end; (iii) engaging formations on the nozzle for inter-engaging with co-operating engaging formations on a cap, to hold said cap in a position over-fitting the nozzle; and (iv) an external ramp on the nozzle body and against which a co-operating portion on the cap may act, to provide sufficient relative separation force between the cap and the nozzle body, to separate the engaging formations on the cap and the nozzle from an inter-engaged position.

Abstract: The invention relates to an outer container for holding an inner container in particular where the inner container has a sensitive product. The outer container comprises at least one of a moveable display board; retaining formations for retaining a hygroscopic element; or a stand for gripping the base of the inner container to retain it in an upright position. The invention also relates to a combination pack comprising the inner container retained in the outer container, particularly where the inner container holds a moisture sensitive product such as an adhesive.

Abstract: An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.

Abstract: The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.