Abstract: A “rad hard” or “rad tolerant” analog-to-digital converter (ADC) integrated circuit includes a pair of input voltage terminals, three ADCs, a function of the two closest (FOTC) circuit, and an output port. Each of the three ADCs performs an analog-to-digital conversion and outputs a value indicative of the voltage between the pair of input voltage terminals. The FOTC circuit determines which of the three ADC output values are the two numerically closest values, and determines and outputs a FOTC value. The FOTC value is a multi-bit digital value taken from the group consisting of: one of the two numerically closest ADC output values, the sum of the two numerically closest ADC output values, and the average of the two numerically closest ADC output values.

Abstract: A system includes a control loop signal path. The signal path includes three processors. Each processor (“slice”) includes an ADC, a digital signal processor (DSP), and a DAC. The DSPs execute identical programs of instructions, so that at any given time they are executing the same instruction. The DSP of the slice executes an instruction that performs a “register sum of two closest” (RSOC) operation. The instruction identifies a register of the slice, and the data content of this register is output to the other slices. The DSP performs a “sum of two closest” operation on: 1) the data content of the register, 2) the data content to the corresponding registers in the other slices. The DSP determines which two of these values are numerically the closest, generates a result value that is a function of these two values (for example, the sum), and writes the result into the register.

Abstract: A system includes a feedback control loop signal path. Circuitry of the signal path includes three processors. Each processor (“slice”) includes an ADC, a digital signal processor (DSP), and a DAC. The DSPs of the three slices execute identical programs of instructions, and are clocked in unison so that at any given time they are executing the same instruction. The DSP of the slice executes an instruction that performs a “register bitwise majority vote” (RMAJ) operation. The instruction identifies a register of the slice, and the data content of this register is output via a bus to the two other slices. The DSP performs a bitwise majority vote on: 1) the data content of the register, 2) the data content of the corresponding register in each of the other two slices. The result of the bitwise majority vote is written into the register of the slice.

Abstract: A power switch includes a power device connecting a supply input to an output, and a power switch controller comprising a gate control circuit that turns the power device on and off in response to a command signal and a decision circuit that produces an OFF signal indicating when the power device is fully off. The power device may be integrated or separate from the power switch controller. The gate control circuit may accept one or more enable signals that must be active to turn on the power device, so that OFF signals and enable inputs of multiple power switches can be interconnected to facilitate break-before-make operation using minimal additional circuitry. Coordinated systems of power switches connecting one or more power supplies to one or more loads and methods of coordinating systems of power switches having OFF indication are also provided.

Abstract: A resilient majority driver accepts triple-redundant input signals and provides a robust output signal unaffected by static errors on one of the input signals or by single-event transients caused by radiation within the driver. Data, clock, and asynchronous input signals to DICE (Dual Interlocked storage CEll) flip-flops in a register are driven by resilient majority drivers to construct an input-protected DICE register. Static errors are corrected using triple-redundant inputs and majority voting, while single-event strikes are largely corrected by the DICE architecture within each flip-flop and by the resilient majority drivers. Remaining errors in the input-protected DICE registers, such as those caused by single-event transients occurring during clock transitions, are corrected by error-correction encoders and decoders, whose output transients are suppressed by glitch filters.

Abstract: Expansion compensating structures are formed in redistribution layers of a wafer-level chip-scale integrated circuit package (WLCSP) or other IC package having a low-expansion substrate. The structures include micromechanical actuators designed and oriented to move solder bumps attached to them in the same direction and distance as a function of temperature as do pads to which they may be connected on a higher-expansion substrate such as a printed circuit board. Expansion compensated IC packages incorporating these expansion compensating structures are provided, as well as expansion compensated assemblies containing one or more of these IC packages. Methods of fabricating expansion compensated IC packages requiring minimal changes to existing commercial WLCSP fabrication processes are also provided. These devices and methods result in assemblies having improved board-level reliability during thermal cycling, and allow the use of larger IC die sizes in WLCSP technology.

Abstract: Systems and methods for shutting down a functional circuit in response to a predetermined total ionizing dose of radiation employ at least two redundant sensing circuits operated in integrate and measure phases by one or more sequencer-type hardware or software controllers. NMOS TID sensors having leakage currents increasing monotonically with dose may be biased during integrate phases, with bias voltages or duty cycles adjusted to achieve a calibrated responsivity. TID measurements are compared to a corresponding reference, latched to generate overexpose signals, and tested for agreement. Disagreement triggers remeasurement to prevent erroneous shutdown until a minimum number of overexpose signals agree that TID exceeds the predetermined threshold. A disable circuit accepts the redundant overexpose signals and generates a signal to disable a functional circuit.

Abstract: Expansion compensating structures are formed in redistribution layers of a wafer-level chip-scale integrated circuit package (WLCSP) or other IC package having a low-expansion substrate. The structures include micromechanical actuators designed and oriented to move solder bumps attached to them in the same direction and distance as a function of temperature as do pads to which they may be connected on a higher-expansion substrate such as a printed circuit board. Expansion compensated IC packages incorporating these expansion compensating structures are provided, as well as expansion compensated assemblies containing one or more of these IC packages. Methods of fabricating expansion compensated IC packages requiring minimal changes to existing commercial WLCSP fabrication processes are also provided. These devices and methods will result in assemblies having improved board-level reliability during thermal cycling, and allow the use of larger IC die sizes in WLCSP technology.

Abstract: An integrated circuit for use in high-reliability electronic systems contains one or more digital majority voters with corresponding disagreement detectors connected to the same input signals producing a majority value output and an error signal that is active when not all input signals agree. Internal error signals from multiple majority voter/disagreement detectors as well as external error inputs may be combined using disjunctive error logic to produce an “error detected” output indication. Cold-sparing and hot-plugging are supported by providing cold-sparable electrostatic discharge protection circuits and power-on reset circuitry controlling cold-sparable output stages. Internal modular redundancy provides immunity to single-event transients as well as enhanced reliability.

Abstract: CMOS output stages, electrostatic discharge (ESD) protection circuits and input bus-keeper functions are provided that block dc and ac leakage paths within inactive powered-down integrated circuits used in redundant high-reliability system configurations employing cold-sparing to provide backup circuitry. These circuits and methods avoid both undesirable power consumption in a cold-spared backup unit and loading of connected active units when powered down, without compromising performance or functionality of the backup unit when in its active powered state. Inputs and outputs using an analog majority voting principle to implement in-circuit redundancy for on-chip fault tolerance are also provided, incorporating the low-leakage principles of the invention for low power dissipation when powered down. Such on-chip redundancy can harden an IC against various faults, such as single-event effects in high-radiation environments, while maintaining the other advantages in a cold-sparing system.

Abstract: Systems and methods for fault-tolerant threshold circuits used in converting an analog input to a single-bit digital output employ N-modular redundancy of either inverting or non-inverting threshold circuits whose inputs are connected to a single input, and apply majority voting of their outputs to provide correction of transient or permanent faults in up to floor[(N?1)/2] of the individual threshold circuits. Using summation to perform analog majority voting averages the N threshold circuit outputs and provides resilience to single-event transients, but may exhibit an output characteristic having intermediate voltage levels. A digital majority voter having N inputs connected to the outputs of N threshold circuits restores well-defined logic levels and clean hysteresis for Schmitt trigger threshold circuits. A single point of failure at the digital majority voter may be eliminated using an analog majority voter to sum the outputs of three or more redundant digital majority voters.

Abstract: CMOS output stages, electrostatic discharge (ESD) protection circuits and input bus-keeper functions are provided that block dc and ac leakage paths within inactive powered-down integrated circuits used in redundant high-reliability system configurations employing cold-sparing to provide backup circuitry. These circuits and methods avoid both undesirable power consumption in a cold-spared backup unit and loading of connected active units when powered down, without compromising performance or functionality of the backup unit when in its active powered state. Inputs and outputs using an analog majority voting principle to implement in-circuit redundancy for on-chip fault tolerance are also provided, incorporating the low-leakage principles of the invention for low power dissipation when powered down. Such on-chip redundancy can harden an IC against various faults, such as single-event effects in high-radiation environments, while maintaining the other advantages in a cold-sparing system.

Abstract: CMOS output stages, electrostatic discharge (ESD) protection circuits and input bus-keeper functions are provided that block dc and ac leakage paths within inactive powered-down integrated circuits used in redundant high-reliability system configurations employing cold-sparing to provide backup circuitry. These circuits and methods avoid both undesirable power consumption in a cold-spared backup unit and loading of connected active units when powered down, without compromising performance or functionality of the backup unit when in its active powered state. Inputs and outputs using an analog majority voting principle to implement in-circuit redundancy for on-chip fault tolerance are also provided, incorporating the low-leakage principles of the invention for low power dissipation when powered down. Such on-chip redundancy can harden an IC against various faults, such as single-event effects in high-radiation environments, while maintaining the other advantages in a cold-sparing system.

Abstract: Expansion compensating structures are formed in redistribution layers of a wafer-level chip-scale integrated circuit package (WLCSP) or other IC package having a low-expansion substrate. The structures include micromechanical actuators designed and oriented to move solder bumps attached to them in the same direction and distance as a function of temperature as do pads to which they may be connected on a higher-expansion substrate such as a printed circuit board. Expansion compensated IC packages incorporating these expansion compensating structures are provided, as well as expansion compensated assemblies containing one or more of these IC packages. Methods of fabricating expansion compensated IC packages requiring minimal changes to existing commercial WLCSP fabrication processes are also provided. These devices and methods will result in assemblies having improved board-level reliability during thermal cycling, and allow the use of larger IC die sizes in WLCSP technology.

Abstract: CMOS output stages, electrostatic discharge (ESD) protection circuits and input bus-keeper functions are provided that block dc and ac leakage paths within inactive powered-down integrated circuits used in redundant high-reliability system configurations employing cold-sparing to provide backup circuitry. These circuits and methods avoid both undesirable power consumption in a cold-spared backup unit and loading of connected active units when powered down, without compromising performance or functionality of the backup unit when in its active powered state. Inputs and outputs using an analog majority voting principle to implement in-circuit redundancy for on-chip fault tolerance are also provided, incorporating the low-leakage principles of the invention for low power dissipation when powered down. Such on-chip redundancy can harden an IC against various faults, such as single-event effects in high-radiation environments, while maintaining the other advantages in a cold-sparing system.

Abstract: Oscillation frequency measurements for trimming oscillators on an integrated circuit device are performed entirely on the device. The oscillation frequency measurements utilize a reference clock. Some measurements count periods of the oscillator signal independently of the reference clock, and some measurements count periods of the reference clock independently of the oscillator signal. After one oscillator on the device has been trimmed, that trimmed oscillator may then be used to make oscillation frequency measurements for trimming another oscillator on the device.

Abstract: Oscillation frequency measurements for trimming oscillators on an integrated circuit device are performed entirely on the device. The oscillation frequency measurements utilize a reference clock. Some measurements count periods of the oscillator signal independently of the reference clock, and some measurements count periods of the reference clock independently of the oscillator signal. After one oscillator on the device has been trimmed, that trimmed oscillator may then be used to make oscillation frequency measurements for trimming another oscillator on the device.

Abstract: Control circuitry for providing a control signal in a pulse width modulating regulating power converter wherein an output parameter delivered by the converter is regulated by pulse width modulation of current within the converter, including circuitry for receiving a sensed output parameter of the converter; circuitry for deriving therefrom an analog average current demand signal corresponding to a current that would bring the converter into regulation; circuitry for receiving a sensed present value of the current within the converter to provide an analog signal representative thereof; circuitry for differencing the average current demand signal and the analog signal to provide an error signal; a compensator arranged to average the error signal to provide a second error signal; a sawtooth generator providing an analog signal as a pulse width modulation ramp; and a comparator to which the ramp is applied to generate the control signal at the output thereof.

Abstract: A switch mode converter uses the bootstrap capacitor 30 to operate all the way to 100% duty cycle by adding only a very small amount of low-area extra circuitry. The additional circuitry includes a charge pump 40 and a duty cycle detect device 42. When the duty cycle detect device 42 detects that the converter is attempting to operate in 100% duty cycle, the charge pump 40 provides additional charge to the bootstrap capacitor 30 to ensure that the 100% duty cycle is maintained.

Abstract: A power integrated circuit architecture (10) having a high side transistor (100) interposed between a control circuit (152) and a low side transistor (100) to reduce the effects of the low side transistor on the operation of the control circuit. The low side transistor has a heavily p-doped region (56) designed to reduce minority carrier lifetime and improve minority carrier collection to reduce the minority carriers from disturbing the control circuit. The low side transistor has a guardring (16) tied to an analog ground, whereby the control circuit is tied to a digital ground, such that the collection of the minority carriers into the analog ground does not disturb the operation of the control circuit. The low side transistor is comprised of multiple transistor arrays (90) partitioned by at least one deep n-type region (16), which deep n-type region forms a guardring about the respective transistor array.