Abstract: Embodiments are directed towards using policy rules that may be extended by scripting operative on a traffic management device. Each policy rule may have a condition and a corresponding action. If the condition is a script, a script engine separate from the policy engine may be employed to execute the script to determine if the condition is met. Otherwise, the policy engine may determine if the condition is met based on declarative expressions that comprise the condition. If the condition is met the action corresponding to the policy rule may be executed. Scripts may be used to compute the values of operands that may be used in one or more of the expression that comprise a condition for a policy rule. Also, the action corresponding to a policy rule may be implemented using a script that is executed by a script engine.

Abstract: Embodiments are directed towards exposing access to network metrics to a late binding user customized set of computer instructions within a traffic manager device (TMD) for use in managing a request for a resource. In one embodiment, the TMD may be interposed between client devices and a plurality of network devices. Request specific data is extracted from a client request received by the user's instructions. Various network metrics about the network devices are provided to the user's instructions to selectively provide the request from the client device to a network device. In one embodiment, an election hash is described as an action performed by the user's instructions.

Abstract: Embodiments are directed towards using policy rules that may be extended by scripting operative on a traffic management device. Each policy rule may have a condition and a corresponding action. If the condition is a script, a script engine separate from the policy engine may be employed to execute the script to determine if the condition is met. Otherwise, the policy engine may determine if the condition is met based on declarative expressions that comprise the condition. If the condition is met the action corresponding to the policy rule may be executed. Scripts may be used to compute the values of operands that may be used in one or more of the expression that comprise a condition for a policy rule. Also, the action corresponding to a policy rule may be implemented using a script that is executed by a script engine.

Abstract: A chemical mechanical polishing to that can provide uniform polishing across a wafer even when polishing hard wafers such as AlTiC wafers used in the formation of magnetic recording sliders. The chemical mechanical polishing to has a wafer carrier that includes a diaphragm or bladder that is configured such that an inner portion of the bladder can be pneumatically pressurized so as to bow outward, while outer portions remain unpressurized.

Abstract: A system and method for directing network connections. The invention enables a network device to direct subsequent connections from a client to a server for accessing resources. A process extracts a persistence key from a received message, and employs the persistence key to identify the appropriate server. An interface is provided, enabling a user program to direct the process of extracting the persistence key. The invention also provides a way for multiple clients to persist to a common server.

Abstract: A system and method for directing network connections. The invention enables a network device to direct subsequent connections from a client to a server for accessing resources. A process extracts a persistence key from a received message, and employs the persistence key to identify the appropriate server. An interface is provided, enabling a user program to direct the process of extracting the persistence key. The invention also provides a way for multiple clients to persist to a common server.

Abstract: A system and method for directing network connections. The invention enables a network device to direct subsequent connections from a client to a server for accessing resources. A process extracts a persistence key from a received message, and employs the persistence key to identify the appropriate server. An interface is provided, enabling a user program to direct the process of extracting the persistence key. The invention also provides a way for multiple clients to persist to a common server.

Abstract: A system and method for directing network connections. The invention enables a network device to direct subsequent connections from a client to a server for accessing resources. A process extracts a persistence key from a received message, and employs the persistence key to identify the appropriate server. An interface is provided, enabling a user program to direct the process of extracting the persistence key. The invention also provides a way for multiple clients to persist to a common server.

Abstract: A system and method for directing network connections. The invention enables a network device to direct subsequent connections from a client to a server for accessing resources. A process extracts a persistence key from a received message, and employs the persistence key to identify the appropriate server. An interface is provided, enabling a user program to direct the process of extracting the persistence key. The invention also provides a way for multiple clients to persist to a common server.

Abstract: In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface.

Abstract: In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface.

Abstract: An apparatus (100) and method are provided for polishing a substrate (105) that achieves a high-planarization uniformity. In one embodiment, the apparatus (100) includes a subcarrier (165) with a lower surface (170), a flexible member (245) extending across the lower surface, and a control-insert (280) disposed between the flexible member and the lower surface. The flexible member (245) has a surface adapted to press the substrate against a polishing pad. The control-insert (280) inhibits non-planar polishing by providing a variable removal rate across the substrate surface. The control-insert (245) can be an annular ring (280A) located near an outer edge of the flexible member (245) to control the removal rate near an edge of the substrate (105), or a disk (280B) near a center (290) of the flexible member to control the removal rate near a center of the substrate. The removal rate can be further controlled by varying a cross-sectional thickness of the control-insert (245).

Abstract: An apparatus and method for planarizing a substrate are provided. The apparatus (101) includes a subcarrier (354) having an outer surface (378) with an annular first membrane (376) coupled thereto. The first membrane (376) has a receiving surface (380) adapted to receive the substrate (356) thereon, and a lip (382) adapted to seal with a backside of the substrate to define a first chamber (384) therebetween. A second membrane (386) positioned above the first membrane (376), and coupled to the subcarrier (354) defines a second chamber (388). During a polishing operation pressurized fluid introduced into the second chamber (388) causes it to expand outward to exert a force on a portion of the backside of the substrate (356), thereby pressing a predetermined area (392) of the surface of the substrate against the polishing pad. The predetermined area (392) is directly proportional to the pressure of the fluid introduced into the second chamber (388).

Abstract: A truck catwalk system for allowing an individual to easily access the interior of a truck box. The inventive device includes a pair of support brackets, at least one pivot bracket, a pair of chains attached to the support brackets, a catch mechanism pivotally attached to one of the support brackets, a platform pivotally attached to the support brackets and catchably engaged by the catch mechanism, a foldable rail structure attached to the platform, a handle attached to the platform, and a ladder attached to the platform and the truck box.

Abstract: In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface.

Abstract: A polishing apparatus (100) and method for polishing and planarizing a substrate (105) is provided that achieves a high-planarization uniformity across the substrate, while providing a more efficient use of slurry. In one embodiment, the apparatus (100) includes a subcarrier (160) with a flexible member (185) attached to a lower surface (165) of it on which the substrate is held. The flexible member (185) has at least one hole (195) therein so that a pressurized fluid introduced between the flexible member and the subcarrier (160) directly presses the substrate (105) against a polishing surface (125) during operation. The number and size of the holes (195) are selected to provide sufficient friction between the flexible member (185) and the substrate (105) to cause it to rotate when a drive mechanism rotates the subcarrier (160).

Abstract: In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface.

Abstract: A truck catwalk system for allowing an individual to easily access the interior of a truck box. The inventive device includes a pair of support brackets, at least one pivot bracket, a pair of chains attached to the support brackets, a catch mechanism pivotally attached to one of the support brackets, a platform pivotally attached to the support brackets and catchably engaged by the catch mechanism, a foldable rail structure attached to the platform, a handle attached to the platform, and a ladder attached to the platform and the truck box.

Abstract: An apparatus (100) and method are provided for polishing a substrate (105) that achieves a high-planarization uniformity. In one embodiment, the apparatus (100) includes a subcarrier (165) with a lower surface (170), a flexible member (245) extending across the lower surface, and a control-insert (280) disposed between the flexible member and the lower surface. The flexible member (245) has a surface adapted to press the substrate against a polishing pad. The control-insert (280) inhibits non-planar polishing by providing a variable removal rate across the substrate surface. The control-insert (245) can be an annular ring (280A) located near an outer edge of the flexible member (245) to control the removal rate near an edge of the substrate (105), or a disk (280B) near a center (290) of the flexible member to control the removal rate near a center of the substrate. The removal rate can be further controlled by varying a cross-sectional thickness of the control-insert (245).

Abstract: An apparatus and method for planarizing a substrate are provided. The apparatus (101) includes a subcarrier (354) having an outer surface (378) with an annular first membrane (376) coupled thereto. The first membrane (376) has a receiving surface (380) adapted to receive the substrate (356) thereon, and a lip (382) adapted to seal with a backside of the substrate to define a first chamber (384) therebetween. A second membrane (386) positioned above the first membrane (376), and coupled to the subcarrier (354) defines a second chamber (388). During a polishing operation pressurized fluid introduced into the second chamber (388) causes it to expand outward to exert a force on a portion of the backside of the substrate (356), thereby pressing a predetermined area (392) of the surface of the substrate against the polishing pad. The predetermined area (392) is directly proportional to the pressure of the fluid introduced into the second chamber (388).