Patents by Inventor David A. Hettel

David A. Hettel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4379808
    Abstract: A sheet type forming board for use in heat forming processes without the need for pre-soaking or pre-steaming required of prior hardboard materials. The forming board sheet has at least one layer containing cellulose fibers, a polyolefin, and an inorganic filler. Its moisture content is preferably 4-12%. A multi-layered sheet, wherein plys are joined together, is typically used to achieve the desired thickness and composite sheet composition. The formed products are light weight and have a number of desirable advantages, including rigidity, embossing and graining fidelity, and dielectric processability.
    Type: Grant
    Filed: June 30, 1980
    Date of Patent: April 12, 1983
    Assignee: The Mead Corporation
    Inventors: John N. Cole, David A. Hettel
  • Patent number: 4325899
    Abstract: A method and apparatus for heat forming hardboard and other types of forming board including the steps of placing a mesh screen in a die between upper and lower platens having mating contours, placing a sheet of heat formable board in the die upon the screen and below the upper platen, pressing the platens together and heating the sheet such that the sheet and screen are formed to the mating contours and gases and vapors released from the sheet follow the contours of the screen to escape from the die, separating the platens, and removing the sheet from the die.
    Type: Grant
    Filed: June 30, 1980
    Date of Patent: April 20, 1982
    Assignee: The Mead Corporation
    Inventors: John N. Cole, David A. Hettel