Patents by Inventor David A. Holtzclaw

David A. Holtzclaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package
    Patent number: 9431317
    Abstract: In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface that contacts and thermally couples with the thermal pad. The wall includes at least one aperture there-through. Solder paste is provided between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: August 30, 2016
    Assignee: Cisco Technology, Inc.
    Inventors: Yongguo Chen, Hujiao Wang, David A. Holtzclaw, Wei Qi, Benjamin Lee Davis, John MacKay
  • POWER DOUBLER AMPLIFIER MODULE WITH IMPROVED SOLDER COVERAGE BETWEEN A HEAT SINK AND A THERMAL PAD OF A CIRCUIT PACKAGE
    Publication number: 20150124410
    Abstract: In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface that contacts and thermally couples with the thermal pad. The wall includes at least one aperture there-through. Solder paste is provided between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste.
    Type: Application
    Filed: November 7, 2013
    Publication date: May 7, 2015
    Applicant: Cisco Technology, Inc.
    Inventors: Yongguo Chen, Hujiao Wang, David A. Holtzclaw, Wei Qi, Benjamin Lee Davis, John MacKay