Abstract: A mobile phone may include a display, an enclosure enclosing the display and including a front cover positioned over the display and defining a front exterior surface, and a rear cover defining a rear exterior surface and a raised sensor array region along the rear exterior surface. The raised sensor array region may define a first hole and a second hole. The second hole may be defined by a first opening along an interior surface of the rear cover and having a first opening size and a second opening along the rear exterior surface of the rear cover and having a second opening size smaller than the first opening size. The mobile phone may further include a first camera having a first lens assembly extending into the first hole, and a second camera having a second lens assembly extending into the second hole.

Abstract: A portable electronic device may include an enclosure including a front cover defining a front exterior surface of the portable electronic device and a rear cover defining a rear exterior surface of the portable electronic device. The portable electronic device may further include a rear-facing camera and a rear-facing flash including a light emitting component defining a plurality of illuminable regions. The light emitting component may be configured to illuminate a first subset of the plurality of illuminable regions to illuminate a first field of view and illuminate a second subset of the plurality of illuminable regions, the second subset different from the first subset, to illuminate a second field of view different from the first field of view.

Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.

Abstract: A mobile phone may include an enclosure. The enclosure may include a front cover, a rear cover, a housing segment coupled to the front cover and to the rear cover and including a first wall section defining at least a portion of a first side exterior surface of the mobile phone, a second wall section defining at least a portion of a second side exterior surface, and a chassis section extending between the first wall section and the second wall section. The mobile phone may further include a circuit board assembly thermally coupled to the chassis section at a thermal coupling region of the chassis section, the chassis section defining a thermal path extending from the thermal coupling region to the first wall section, and a through-hole positioned in the thermal path and configured to interrupt a flow of heat from the circuit board assembly to the first wall section.

Abstract: A mobile phone may include an enclosure defining an internal volume, the enclosure including a front cover formed from a transparent material and defining a front exterior surface, a rear cover formed from a glass material and defining a rear exterior surface, and a housing component defining a side exterior surface. The mobile phone may include a circuit board assembly within the internal volume. The circuit board assembly may include a circuit board, a circuit component coupled to an exterior surface of the circuit board, and a cowling coupled to the circuit board and covering the circuit component, the cowling having a thickness less than about 0.5 mm and including a base structure formed from an aluminum alloy having a thickness less than about 0.4 mm and a thermally conductive structure positioned over the base structure and configured to dissipate heat.

Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.

Abstract: A portable electronic device may include an enclosure including a front cover defining a front exterior surface of the portable electronic device and a rear cover defining a rear exterior surface of the portable electronic device. The portable electronic device may further include a rear-facing camera and a rear-facing flash including a light emitting component defining a plurality of illuminable regions. The light emitting component may be configured to illuminate a first subset of the plurality of illuminable regions to illuminate a first field of view and illuminate a second subset of the plurality of illuminable regions, the second subset different from the first subset, to illuminate a second field of view different from the first field of view.

Abstract: A mobile phone may include an enclosure defining an internal volume, the enclosure including a front cover formed from a transparent material and defining a front exterior surface, a rear cover formed from a glass material and defining a rear exterior surface, and a housing component defining a side exterior surface. The mobile phone may include a circuit board assembly within the internal volume. The circuit board assembly may include a circuit board, a circuit component coupled to an exterior surface of the circuit board, and a cowling coupled to the circuit board and covering the circuit component, the cowling having a thickness less than about 0.5 mm and including a base structure formed from an aluminum alloy having a thickness less than about 0.4 mm and a thermally conductive structure positioned over the base structure and configured to dissipate heat.

Abstract: A mobile phone may include a display, an enclosure enclosing the display and including a front cover positioned over the display and defining a front exterior surface, and a rear cover defining a rear exterior surface and a raised sensor array region along the rear exterior surface. The raised sensor array region may define a first hole and a second hole. The second hole may be defined by a first opening along an interior surface of the rear cover and having a first opening size and a second opening along the rear exterior surface of the rear cover and having a second opening size smaller than the first opening size. The mobile phone may further include a first camera having a first lens assembly extending into the first hole, and a second camera having a second lens assembly extending into the second hole.

Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.

Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.

Abstract: This disclosure describes a speaker assembly suitable for use in a portable electronic device utilizing water resistant ports. The speaker assembly can have an open back that subjects a back volume of the speaker to pressure differentials within a device housing of the portable electronic device. The speaker assembly can utilize a speaker surround having a varying thickness. The varying thickness speaker surround allows the speaker to maintain an acceptable frequency response profile while limiting the travel of the diaphragm it is coupled with. The disclosure also describes how electrically conductive pathways can be integrated within a housing of the speaker assembly.

Abstract: This disclosure describes a speaker assembly suitable for use in a portable electronic device utilizing water resistant ports. The speaker assembly can have an open back that subjects a back volume of the speaker to pressure differentials within a device housing of the portable electronic device. The speaker assembly can utilize a speaker surround having a varying thickness. The varying thickness speaker surround allows the speaker to maintain an acceptable frequency response profile while limiting the travel of the diaphragm it is coupled with. The disclosure also describes how electrically conductive pathways can be integrated within a housing of the speaker assembly.

Abstract: An electronic device having several modifications designed to prevent liquid ingress into an opening (or openings) of the electronic device is disclosed. For example, the electronic device includes a SIM tray having a sealing element designed to provide a seal at an opening that receives the SIM tray. The sealing element may include a first section and a second section extending from the first section, with the first section designed to bend with respect to (and in some cases collapse onto) the second section. The electronic device may further include an audio module fitted with a sealing element. The sealing element may include extensions extending away from a main body of the sealing element, with some extension designed to engage the audio module, and other extensions designed to engage an audio module interface. The sealing element provides a seal against liquid ingress into the audio module.

Abstract: An electronic device having openings covered by a vent assembly is disclosed. The vent assembly may include multiple adhesive layers surrounding an air-permeable, liquid resistant membrane that allow air to flow into and/or out of the electronic device, while also preventing liquid ingress into the electronic device. The membrane may be supported by several structural elements. For example, the vent assembly includes an adhesive layer secured with the membrane, with the adhesive layer including a web region having multiple ribs that engage the membrane. Also, the vent assembly includes a mesh material that includes a porous region that receives a portion of the adhesive layer. Also, an additional vent assembly may cover an additional opening of the electronic device and provide protection for an operational component in the electronic device. The additional vent assembly may allow air into the additional opening for the operational component.

Abstract: An electronic device having liquid-resistant modifications that prevent liquid ingress into an opening (or openings) in an enclosure of the electronic device is disclosed. For example, the electronic device may include a coating formed from a liquid-resistant material that is applied internally to the enclosure. The electronic device may further include a frame that carries a protective transparent layer designed to cover a display assembly. In order to secure the frame with the enclosure, the electronic device may include an adhesive assembly disposed over an outer perimeter of the coating. The adhesive assembly may include several adhesive parts initially separate from one another. However, with the adhesive parts between the frame and the enclosure, the adhesive parts can be compressed by the frame and the enclosure, causing the adhesive parts to expand and engage each other. As a result, the coating and the adhesive parts provide a seal against liquid.

Abstract: An electronic device having several modifications designed to prevent liquid ingress into an opening (or openings) of the electronic device is disclosed. For example, the electronic device includes a SIM tray having a sealing element designed to provide a seal at an opening that receives the SIM tray. The sealing element may include a first section and a second section extending from the first section, with the first section designed to bend with respect to (and in some cases collapse onto) the second section. The electronic device may further include an audio module fitted with a sealing element. The sealing element may include extensions extending away from a main body of the sealing element, with some extension designed to engage the audio module, and other extensions designed to engage an audio module interface. The sealing element provides a seal against liquid ingress into the audio module.

Abstract: An electronic device having liquid-resistant modifications that prevent liquid ingress into an opening (or openings) in an enclosure of the electronic device is disclosed. For example, the electronic device may include a coating formed from a liquid-resistant material that is applied internally to the enclosure. The electronic device may further include a frame that carries a protective transparent layer designed to cover a display assembly. In order to secure the frame with the enclosure, the electronic device may include an adhesive assembly disposed over an outer perimeter of the coating. The adhesive assembly may include several adhesive parts initially separate from one another. However, with the adhesive parts between the frame and the enclosure, the adhesive parts can be compressed by the frame and the enclosure, causing the adhesive parts to expand and engage each other. As a result, the coating and the adhesive parts provide a seal against liquid.