Abstract: The present invention is an individual pressure barrier pouch that is used in conjunction with the assembly of either a one piece or a two piece ostomy appliance or as a pressure barrier pouch that can be preassembled and integrated into the assembly of a two piece ostomy appliance. In all three embodiments, body waste material/excretions from the patient's stoma/fistula pass through the pressure barrier pouch to enter the ostomy pouch. When pressure is applied to the ostomy pouch, the excretions no longer have access to escape through the path of least resistance between the stoma and the wafer stoma clearance hole as they do with a conventional ostomy pouch. The only access to the path of least resistance with the present invention would have body excretions backing up through the pressure barrier pouch.

Abstract: A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible circuit protrudes from the mold, and providing a compressible elastomeric interface between the mold and the flexible circuit to seal off the mold cavity and protect the flexible circuit from damage due to the clamping force of the mold. The portion of the flexible circuit within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound, and a heat exchanger thermally coupled to the portion of the flexible circuit that protrudes from the mold protects the flexible circuit from damage due to thermal conduction from the mold and mold compound.

Abstract: An improved compliant pin strip and process for making an electrical package having a printed circuit board encased in a housing and pin connectors mechanically and electrically connected to the printed circuit board and extending outwardly away from an outer surface of the housing is provided. This involves the use of a compliant pin strip having a dam bar that defines surfaces for a molding tool to close on and seal a mold cavity. The pin strip with dam bar enables a simplified, cost effective, and more robust manufacturing process.

Abstract: An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between the connector header and the circuit board. The electronic assembly is then placed in a mold for plastic encapsulation. The floor of the mold has a well sized to accommodate the conductor pins and shroud of the connector header, and the connector header has a peripheral flange that seats against the floor of the mold to keep encapsulant out of the well. Encapsulant fills open spaces inboard of the connector header, and a connector insert disposed between the connector header and the floor of the well prevents distention of the connector header and circuit board due to the packing pressure of the encapsulant.

Abstract: A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible circuit protrudes from the mold, and providing a compressible elastomeric interface between the mold and the flexible circuit to seal off the mold cavity and protect the flexible circuit from damage due to the clamping force of the mold. The portion of the flexible circuit within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound, and a heat exchanger thermally coupled to the portion of the flexible circuit that protrudes from the mold protects the flexible circuit from damage due to thermal conduction from the mold and mold compound.

Abstract: An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between the connector header and the circuit board. The electronic assembly is then placed in a mold for plastic encapsulation. The floor of the mold has a well sized to accommodate the conductor pins and shroud of the connector header, and the connector header has a peripheral flange that seats against the floor of the mold to keep encapsulant out of the well. Encapsulant fills open spaces inboard of the connector header, and a connector insert disposed between the connector header and the floor of the well prevents distention of the connector header and circuit board due to the packing pressure of the encapsulant.

Abstract: A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic component on a surface of the circuit board so that solder bumps on the bottom of the electronic component engage contact pads on the top of the circuit board. The solder bumps are then reflowed to attach the electronic component to the circuit board after which the electronic component is underfilled by providing a mold die having a mold cavity, a gate leading into the mold cavity and a vent leading out of the mold cavity. The mold die is placed over the electronic component and onto the surface of the circuit board so that the electronic component is inside the mold cavity and the mold cavity is sealed.

Abstract: A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, a substrate with a first side of an integrated circuit (IC) die mounted to a first side of the substrate is provided. The IC die is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate. The substrate includes a hole approximate an outer edge of the IC die. The first side of the substrate is then positioned in contact with at least a portion of the first side of the backplate. The IC die is positioned within the cavity with a second side of the IC die in thermal contact with the backplate. The substrate and at least a portion of the backplate are overmolded with an overmold material, which enters the cavity through the hold to substantially underfill the IC die and substantially fill an unoccupied portion of the cavity.

Abstract: An assembly for a sealed electronic component includes at least one electronic device mounted on a substrate, and a metal enclosure comprising first and second housing components that are welded together to define a sealed enclosure. The resulting assembly provides a reliable seal that eliminates the need for mechanical fasteners, adhesives, and equipment for applying and curing adhesives.

Abstract: A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending from an inner surface. A cavity of the first and second mold portions provides a mold cavity, when joined. A backplate is also provided that includes a plurality of support pedestals and an integrated heatsink extending from a first side of the backplate. A substrate includes a first side of an integrated circuit (IC) die mounted to a first side of the substrate. The backplate and the substrate are placed within the cavity of the second mold portion and the support pedestals are in contact with the first side of the substrate. The first and second mold portions are joined and the mold pins contact a second surface of the substrate during an overmolding process.

Abstract: An overmolded electronic assembly includes a substrate, a plurality of surface mount technology (SMT) integrated circuit (IC) chips, a plurality of heat sinks, a backplate and an overmold material. The substrate includes a plurality of conductive traces formed on a first surface of the substrate. The IC chips each include an active front side and a backside and the IC chips are electrically coupled to one or more of the traces. The heat sinks are each in thermal contact with the backside of a different one of the IC chips and are independent of each other. The backplate is attached to a second surface of the substrate, which is opposite the first surface of the substrate. The overmold material covers the first surface of the substrate and maintains the heat sinks in thermal contact with an associated one of the IC chips.

Abstract: A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic component on a surface of the circuit board so that solder bumps on the bottom of the electronic component engage contact pads on the top of the circuit board. The solder bumps are then reflowed to attach the electronic component to the circuit board after which the electronic component is underfilled by providing a mold die having a mold cavity, a gate leading into the mold cavity and a vent leading out of the mold cavity. The mold die is placed over the electronic component and onto the surface of the circuit board so that the electronic component is inside the mold cavity and the mold cavity is sealed.

Abstract: A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending from an inner surface. A cavity of the first and second mold portions provides a mold cavity, when joined. A backplate is also provided that includes a plurality of support pedestals and an integrated heatsink extending from a first side of the backplate. A substrate includes a first side of an integrated circuit (IC) die mounted to a first side of the substrate. The backplate and the substrate are placed within the cavity of the second mold portion and the support pedestals are in contact with the first side of the substrate. The first and second mold portions are joined and the mold pins contact a second surface of the substrate during an overmolding process.

Abstract: A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, a substrate with a first side of an integrated circuit (IC) die mounted to a first side of the substrate is provided. The IC die is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate. The substrate includes a hole approximate an outer edge of the IC die. The first side of the substrate is then positioned in contact with at least a portion of the first side of the backplate. The IC die is positioned within the cavity with a second side of the IC die in thermal contact with the backplate. The substrate and at least a portion of the backplate are overmolded with an overmold material, which enters the cavity through the hold to substantially underfill the IC die and substantially fill an unoccupied portion of the cavity.

Abstract: An overmolded electronic assembly includes a substrate, a plurality of surface mount technology (SMT) integrated circuit (IC) chips, a plurality of heat sinks, a backplate and an overmold material. The substrate includes a plurality of conductive traces formed on a first surface of the substrate. The IC chips each include an active front side and a backside and the IC chips are electrically coupled to one or more of the traces. The heat sinks are each in thermal contact with the backside of a different one of the IC chips and are independent of each other. The backplate is attached to a second surface of the substrate, which is opposite the first surface of the substrate. The overmold material covers the first surface of the substrate and maintains the heat sinks in thermal contact with an associated one of the IC chips.

Abstract: This invention generally relates to decorative spinners. More specifically, this invention relates to a spinner apparatus rotated about its vertical axis, either by wind blowing across its face or in a second embodiment, spun by a motor drive unit. The spinner apparatus consists of a number or set of letters or other decorative symbol or logo on or in a pad centered between concentric bands of tinted transparent material coated metal which are connected at the top and bottom and progressively radially displaced about their vertical axis as they approach the inner band. When the device is spun either by the wind blowing it or by an electric motor, the numbers, letters or symbols stand out and appear to be stationary in the line of sight of the viewer and the bands progressively rotated off the plane of the outside band and the center detail provide an interesting wind catching and light reflecting three dimensional shape.

Abstract: An electronic assembly and/or a mold is constructed to reduce deflection and resultant damage to components and/or an associated printed circuit board of the electronic assembly when the electronic assembly is overmolded.

Abstract: A thermally conductive film is attached to an integrated circuit (IC) wafer through a number of steps. Initially, a thermally conductive film is positioned on a first side of a block. Next, an IC wafer that includes a plurality of chips is positioned with its non-active side in contact with the film. Then, a first surface of an elastomer pad is positioned in contact with an active side of the wafer. Next, a predetermined pressure is applied between a second side of the block that is opposite the first side and a second surface of the elastomer pad that is opposite the first surface. Finally, the film, the block, the wafer and the elastomer pad are heated to a predetermined temperature for a predetermined time while a predetermined pressure is applied to bond the film to the wafer without bonding the film to the block.

Abstract: A thermally conductive film is attached to an integrated circuit (IC) wafer through a number of steps. Initially, a thermally conductive film is positioned on a first side of a block. Next, an IC wafer that includes a plurality of chips is positioned with its non-active side in contact with the film. Then, a first surface of an elastomer pad is positioned in contact with an active side of the wafer. Next, a predetermined pressure is applied between a second side of the block that is opposite the first side and a second surface of the elastomer pad that is opposite the first surface. Finally, the film, the block, the wafer and the elastomer pad are heated to a predetermined temperature for a predetermined time while a predetermined pressure is applied to bond the film to the wafer without bonding the film to the block.

Abstract: An electronic package and filtered electrical connector assembly includes number of connector pins extending away from a main circuit board having a first ground plane, and an auxiliary circuit board having a second ground plane is positioned over the main circuit board with the connector pins extending therethrough and electrically connected to a corresponding number of capacitors mounted to the auxiliary circuit board. An inductive block and surrounding conductive spacer block are positioned between the main and auxiliary circuit boards with the connector pins extending through the inductive block and with the conductive spacer block electrically contacting the first and second ground planes. A connector shroud surrounds the connector pins extending through auxiliary circuit board, and all components are bonded together via an overmolding process to form the electronic package.