Patents by Inventor David A. Moore

David A. Moore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250379914
    Abstract: The present disclosure generally relates to synchronizing data. Some techniques are for automatically synchronizing data in accordance with some embodiments. Other techniques are for causing data to be available based on presence in accordance with some embodiments.
    Type: Application
    Filed: January 28, 2025
    Publication date: December 11, 2025
    Inventors: Dale A. TAYLOR, Felipe Marin CYPRIANO, David A. MOORE, Steven A. MYERS
  • Patent number: 11705652
    Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: July 18, 2023
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Jian Miremadi, David A. Moore, John Norton, Eduardo F. Velazquez
  • Publication number: 20230034892
    Abstract: A predictive insurance underwriting system. An electronic life insurance policy application processing apparatus accepts data describing a consumer. An underwriting desktop processing apparatus receives the data. An underwriting rules processing apparatus determines, based on the data describing the consumer, whether the consumer is eligible for expedited underwriting of a life insurance policy covering the consumer. If it is determined that the consumer is eligible for expedited underwriting, a tele-interview processing apparatus collects first additional data relating to the consumer during a telephonic interview and, in response to a request from a processing unit, one or more third party databases transmit second additional data relating to the consumer.
    Type: Application
    Filed: October 10, 2022
    Publication date: February 2, 2023
    Inventors: Kurt D. Hummel, David A. Moore, Jason A. Jump, Erin R. McClintock, Shannon Terry, Prashanti Ghale
  • Patent number: 11494845
    Abstract: A predictive insurance underwriting system. An electronic life insurance policy application processing apparatus accepts data describing a consumer. An underwriting desktop processing apparatus receives the data. An underwriting rules processing apparatus determines, based on the data describing the consumer, whether the consumer is eligible for expedited underwriting of a life insurance policy covering the consumer. If it is determined that the consumer is eligible for expedited underwriting, a tele-interview processing apparatus collects first additional data relating to the consumer during a telephonic interview and, in response to a request from a processing unit, one or more third party databases transmit second additional data relating to the consumer.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: November 8, 2022
    Assignee: Nationwide Mutual Insurance Company
    Inventors: Kurt D. Hummel, David A. Moore, Jason A. Jump, Erin R. McClintock, Shannon Terry, Prashanti Ghale
  • Patent number: 11481520
    Abstract: Examples described herein relate to a printed circuit assembly (PCA). The PCA includes a printed circuit board (PCB). The PCA further includes an identification device embedded within the PCB. The identification device stores identity information that uniquely identifies identification device and the PCB. Moreover, a PCB identifier defined using the identity information is also stored in a platform attestation file hosted locally within the PCA, on a remote server, or both locally within the PCA and on the remote server. Additionally, the PCA includes an authentication device disposed on the PCB, wherein the platform attestation file is cryptographically bound to the authentication device.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: October 25, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David A. Moore, Nigel Edwards, Jonathon Hughes
  • Patent number: 11435298
    Abstract: In some examples, a system receives a first image of a circuit board produced by a first production stage, and compares the first image to a second image of the circuit board acquired at a second production stage for the circuit board. The system indicates an anomaly with the circuit board based on the comparing.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: September 6, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David A. Moore, Jonathon Hughes, Michael L. Mixon, Gretchen La Fontaine Otero, Niysaan E. Vlasak
  • Publication number: 20220188462
    Abstract: Examples described herein relate to a printed circuit assembly (PCA). The PCA includes a printed circuit board (PCB). The PCA further includes an identification device embedded within the PCB. The identification device stores identity information that uniquely identifies identification device and the PCB. Moreover, a PCB identifier defined using the identity information is also stored in a platform attestation file hosted locally within the PCA, on a remote server, or both locally within the PCA and on the remote server. Additionally, the PCA includes an authentication device disposed on the PCB, wherein the platform attestation file is cryptographically bound to the authentication device.
    Type: Application
    Filed: December 15, 2020
    Publication date: June 16, 2022
    Inventors: David A. MOORE, Nigel EDWARDS, Jonathon HUGHES
  • Publication number: 20220026375
    Abstract: In some examples, a system receives a first image of a circuit board produced by a first production stage, and compares the first image to a second image of the circuit board acquired at a second production stage for the circuit board. The system indicates an anomaly with the circuit board based on the comparing.
    Type: Application
    Filed: July 24, 2020
    Publication date: January 27, 2022
    Inventors: David A. Moore, Jonathon Hughes, Michael L. Mixon, Gretchen La Fontaine Otero, Niysaan E. Vlasak
  • Publication number: 20210044039
    Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
    Type: Application
    Filed: October 27, 2020
    Publication date: February 11, 2021
    Inventors: Jian Miremadi, David A. Moore, John Norton, Eduardo F. Velazquez
  • Patent number: 10874035
    Abstract: An example device in accordance with an aspect of the present disclosure includes a collection engine and a correlation engine to identify cooling loop characteristics. The collection engine is to collect data from devices associated with cooling loops. The correlation engine is to identify, based on the data collected, a common loop from among the cooling loops, and which of the devices are associated with the common loop.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: December 22, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Tahir Cader, David A. Moore, Greg Scott Long
  • Patent number: 10833438
    Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: November 10, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Jian Miremadi, David A. Moore, John Norton, Eduardo F. Velazquez
  • Publication number: 20200350714
    Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
    Type: Application
    Filed: May 1, 2019
    Publication date: November 5, 2020
    Inventors: Jian Miremadi, David A. Moore, John Norton, Eduardo F. Velazquez
  • Patent number: 10716240
    Abstract: Examples herein disclose a multi-channel apparatus include a first channel and a second channel. The first channel receives heated air from an electrical component. The first channel deflects the heated air from a posterior electrical component. The deflection of the heated air is caused by a curvature of an internal partition. The second channel, which is segmented from the first channel via the internal partition, provides cool air to the posterior electrical component.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: July 14, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David A. Moore, John Franz, Jonathon Hughes, Rahul V. Joshi, John Vijil
  • Patent number: 10684662
    Abstract: An electronic device includes a housing enclosure, which at least sealingly contains an electronic component, a barrier, a pump, and a coolant. The electronic component is located on a substrate, while the barrier defines a circulation loop in which the coolant is exposed to the electronic component. The pump is positioned within the circulation loop to cause flow of the coolant through the circulation loop along one side of the at least one barrier in one direction and along an opposite side of the at least one barrier in an opposite direction.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: June 16, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David A. Moore, Kianoush Naeli, Valerie J. Marty, James McKinnell
  • Patent number: 10671051
    Abstract: A method for detecting thermal events in an electrical system includes: synchronizing, via a controller, measurements of power consumed by each of a plurality of load elements during an interval with one another and with measurements of power supplied by each of a plurality of power sources to the plurality of load elements during the interval; determining a differential between a sum of the power consumed by the load elements during the interval and a sum of the power supplied by the power sources to the plurality of load elements during the interval; comparing the differential to a predetermined threshold; and determining whether a thermal event has occurred based on the comparison of the differential to the predetermined threshold.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: June 2, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Daniel Humphrey, David A. Moore, Stewart Gavin Goodson, II
  • Publication number: 20200110381
    Abstract: A method for detecting thermal events in an electrical system includes: synchronizing, via a controller, measurements of power consumed by each of a plurality of load elements during an interval with one another and with measurements of power supplied by each of a plurality of power sources to the plurality of load elements during the interval; determining a differential between a sum of the power consumed by the load elements during the interval and a sum of the power supplied by the power sources to the plurality of load elements during the interval; comparing the differential to a predetermined threshold; and determining whether a thermal event has occurred based on the comparison of the differential to the predetermined threshold.
    Type: Application
    Filed: October 9, 2018
    Publication date: April 9, 2020
    Inventors: Daniel Humphrey, David A. Moore, Stewart Gavin Goodson, II
  • Patent number: 10458724
    Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: October 29, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: John P. Franz, Tahir Cader, Michael L. Sabotta, David A. Moore
  • Patent number: 10352314
    Abstract: A pump includes a main chamber and a pair of valves on opposite ends of the main chamber. At least a portion of the respective valves and of the main chamber is formed from a single, unitary piece. The respective valves each contain a freely movable member to permit selective opening and closing of each respective valve. A force applicator alternately induces a suction action and an expulsion action in the main chamber.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: July 16, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kianoush Naeli, David A. Moore
  • Patent number: 10330395
    Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: June 25, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: John P. Franz, Tahir Cader, Michael L. Sabotta, David A. Moore
  • Publication number: 20190094924
    Abstract: In some examples, a computing system can include an exterior enclosure for the computing system, an electrical component within the enclosure, an interior cooling line within the enclosure to circulate coolant past the electrical component to remove heat generated by the electrical component, and an inlet coolant line port through the exterior enclosure to receive an inlet coolant line. The inlet coolant line port can, for example, include a sensor to detect tampering with an interior of the inlet coolant line.
    Type: Application
    Filed: September 26, 2017
    Publication date: March 28, 2019
    Inventors: John Norton, David A. Moore, Steve Weingart