Patents by Inventor David A. Moore
David A. Moore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250379914Abstract: The present disclosure generally relates to synchronizing data. Some techniques are for automatically synchronizing data in accordance with some embodiments. Other techniques are for causing data to be available based on presence in accordance with some embodiments.Type: ApplicationFiled: January 28, 2025Publication date: December 11, 2025Inventors: Dale A. TAYLOR, Felipe Marin CYPRIANO, David A. MOORE, Steven A. MYERS
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Patent number: 11705652Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.Type: GrantFiled: October 27, 2020Date of Patent: July 18, 2023Assignee: Hewlett Packard Enterprise Development LPInventors: Jian Miremadi, David A. Moore, John Norton, Eduardo F. Velazquez
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Publication number: 20230034892Abstract: A predictive insurance underwriting system. An electronic life insurance policy application processing apparatus accepts data describing a consumer. An underwriting desktop processing apparatus receives the data. An underwriting rules processing apparatus determines, based on the data describing the consumer, whether the consumer is eligible for expedited underwriting of a life insurance policy covering the consumer. If it is determined that the consumer is eligible for expedited underwriting, a tele-interview processing apparatus collects first additional data relating to the consumer during a telephonic interview and, in response to a request from a processing unit, one or more third party databases transmit second additional data relating to the consumer.Type: ApplicationFiled: October 10, 2022Publication date: February 2, 2023Inventors: Kurt D. Hummel, David A. Moore, Jason A. Jump, Erin R. McClintock, Shannon Terry, Prashanti Ghale
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Patent number: 11494845Abstract: A predictive insurance underwriting system. An electronic life insurance policy application processing apparatus accepts data describing a consumer. An underwriting desktop processing apparatus receives the data. An underwriting rules processing apparatus determines, based on the data describing the consumer, whether the consumer is eligible for expedited underwriting of a life insurance policy covering the consumer. If it is determined that the consumer is eligible for expedited underwriting, a tele-interview processing apparatus collects first additional data relating to the consumer during a telephonic interview and, in response to a request from a processing unit, one or more third party databases transmit second additional data relating to the consumer.Type: GrantFiled: April 19, 2017Date of Patent: November 8, 2022Assignee: Nationwide Mutual Insurance CompanyInventors: Kurt D. Hummel, David A. Moore, Jason A. Jump, Erin R. McClintock, Shannon Terry, Prashanti Ghale
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Patent number: 11481520Abstract: Examples described herein relate to a printed circuit assembly (PCA). The PCA includes a printed circuit board (PCB). The PCA further includes an identification device embedded within the PCB. The identification device stores identity information that uniquely identifies identification device and the PCB. Moreover, a PCB identifier defined using the identity information is also stored in a platform attestation file hosted locally within the PCA, on a remote server, or both locally within the PCA and on the remote server. Additionally, the PCA includes an authentication device disposed on the PCB, wherein the platform attestation file is cryptographically bound to the authentication device.Type: GrantFiled: December 15, 2020Date of Patent: October 25, 2022Assignee: Hewlett Packard Enterprise Development LPInventors: David A. Moore, Nigel Edwards, Jonathon Hughes
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Patent number: 11435298Abstract: In some examples, a system receives a first image of a circuit board produced by a first production stage, and compares the first image to a second image of the circuit board acquired at a second production stage for the circuit board. The system indicates an anomaly with the circuit board based on the comparing.Type: GrantFiled: July 24, 2020Date of Patent: September 6, 2022Assignee: Hewlett Packard Enterprise Development LPInventors: David A. Moore, Jonathon Hughes, Michael L. Mixon, Gretchen La Fontaine Otero, Niysaan E. Vlasak
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Publication number: 20220188462Abstract: Examples described herein relate to a printed circuit assembly (PCA). The PCA includes a printed circuit board (PCB). The PCA further includes an identification device embedded within the PCB. The identification device stores identity information that uniquely identifies identification device and the PCB. Moreover, a PCB identifier defined using the identity information is also stored in a platform attestation file hosted locally within the PCA, on a remote server, or both locally within the PCA and on the remote server. Additionally, the PCA includes an authentication device disposed on the PCB, wherein the platform attestation file is cryptographically bound to the authentication device.Type: ApplicationFiled: December 15, 2020Publication date: June 16, 2022Inventors: David A. MOORE, Nigel EDWARDS, Jonathon HUGHES
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Publication number: 20220026375Abstract: In some examples, a system receives a first image of a circuit board produced by a first production stage, and compares the first image to a second image of the circuit board acquired at a second production stage for the circuit board. The system indicates an anomaly with the circuit board based on the comparing.Type: ApplicationFiled: July 24, 2020Publication date: January 27, 2022Inventors: David A. Moore, Jonathon Hughes, Michael L. Mixon, Gretchen La Fontaine Otero, Niysaan E. Vlasak
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Publication number: 20210044039Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.Type: ApplicationFiled: October 27, 2020Publication date: February 11, 2021Inventors: Jian Miremadi, David A. Moore, John Norton, Eduardo F. Velazquez
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Patent number: 10874035Abstract: An example device in accordance with an aspect of the present disclosure includes a collection engine and a correlation engine to identify cooling loop characteristics. The collection engine is to collect data from devices associated with cooling loops. The correlation engine is to identify, based on the data collected, a common loop from among the cooling loops, and which of the devices are associated with the common loop.Type: GrantFiled: December 18, 2015Date of Patent: December 22, 2020Assignee: Hewlett Packard Enterprise Development LPInventors: Tahir Cader, David A. Moore, Greg Scott Long
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Patent number: 10833438Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.Type: GrantFiled: May 1, 2019Date of Patent: November 10, 2020Assignee: Hewlett Packard Enterprise Development LPInventors: Jian Miremadi, David A. Moore, John Norton, Eduardo F. Velazquez
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Publication number: 20200350714Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.Type: ApplicationFiled: May 1, 2019Publication date: November 5, 2020Inventors: Jian Miremadi, David A. Moore, John Norton, Eduardo F. Velazquez
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Patent number: 10716240Abstract: Examples herein disclose a multi-channel apparatus include a first channel and a second channel. The first channel receives heated air from an electrical component. The first channel deflects the heated air from a posterior electrical component. The deflection of the heated air is caused by a curvature of an internal partition. The second channel, which is segmented from the first channel via the internal partition, provides cool air to the posterior electrical component.Type: GrantFiled: February 23, 2016Date of Patent: July 14, 2020Assignee: Hewlett Packard Enterprise Development LPInventors: David A. Moore, John Franz, Jonathon Hughes, Rahul V. Joshi, John Vijil
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Patent number: 10684662Abstract: An electronic device includes a housing enclosure, which at least sealingly contains an electronic component, a barrier, a pump, and a coolant. The electronic component is located on a substrate, while the barrier defines a circulation loop in which the coolant is exposed to the electronic component. The pump is positioned within the circulation loop to cause flow of the coolant through the circulation loop along one side of the at least one barrier in one direction and along an opposite side of the at least one barrier in an opposite direction.Type: GrantFiled: April 20, 2015Date of Patent: June 16, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: David A. Moore, Kianoush Naeli, Valerie J. Marty, James McKinnell
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Patent number: 10671051Abstract: A method for detecting thermal events in an electrical system includes: synchronizing, via a controller, measurements of power consumed by each of a plurality of load elements during an interval with one another and with measurements of power supplied by each of a plurality of power sources to the plurality of load elements during the interval; determining a differential between a sum of the power consumed by the load elements during the interval and a sum of the power supplied by the power sources to the plurality of load elements during the interval; comparing the differential to a predetermined threshold; and determining whether a thermal event has occurred based on the comparison of the differential to the predetermined threshold.Type: GrantFiled: October 9, 2018Date of Patent: June 2, 2020Assignee: Hewlett Packard Enterprise Development LPInventors: Daniel Humphrey, David A. Moore, Stewart Gavin Goodson, II
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Publication number: 20200110381Abstract: A method for detecting thermal events in an electrical system includes: synchronizing, via a controller, measurements of power consumed by each of a plurality of load elements during an interval with one another and with measurements of power supplied by each of a plurality of power sources to the plurality of load elements during the interval; determining a differential between a sum of the power consumed by the load elements during the interval and a sum of the power supplied by the power sources to the plurality of load elements during the interval; comparing the differential to a predetermined threshold; and determining whether a thermal event has occurred based on the comparison of the differential to the predetermined threshold.Type: ApplicationFiled: October 9, 2018Publication date: April 9, 2020Inventors: Daniel Humphrey, David A. Moore, Stewart Gavin Goodson, II
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Patent number: 10458724Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.Type: GrantFiled: September 27, 2017Date of Patent: October 29, 2019Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPInventors: John P. Franz, Tahir Cader, Michael L. Sabotta, David A. Moore
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Patent number: 10352314Abstract: A pump includes a main chamber and a pair of valves on opposite ends of the main chamber. At least a portion of the respective valves and of the main chamber is formed from a single, unitary piece. The respective valves each contain a freely movable member to permit selective opening and closing of each respective valve. A force applicator alternately induces a suction action and an expulsion action in the main chamber.Type: GrantFiled: April 20, 2015Date of Patent: July 16, 2019Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kianoush Naeli, David A. Moore
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Patent number: 10330395Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.Type: GrantFiled: November 21, 2017Date of Patent: June 25, 2019Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPInventors: John P. Franz, Tahir Cader, Michael L. Sabotta, David A. Moore
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Publication number: 20190094924Abstract: In some examples, a computing system can include an exterior enclosure for the computing system, an electrical component within the enclosure, an interior cooling line within the enclosure to circulate coolant past the electrical component to remove heat generated by the electrical component, and an inlet coolant line port through the exterior enclosure to receive an inlet coolant line. The inlet coolant line port can, for example, include a sensor to detect tampering with an interior of the inlet coolant line.Type: ApplicationFiled: September 26, 2017Publication date: March 28, 2019Inventors: John Norton, David A. Moore, Steve Weingart