Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

Abstract: A portable electronic device may include a housing having a wall defining an opening in the housing and at least a portion of four side surfaces of the portable electronic device. The portable electronic device may further include a display at least partially within the housing, a front cover positioned in the opening in the housing and over the display, the front cover defining a front surface, a peripheral side surface extending from the front surface and at least partially surrounded by the wall of the housing, and a notch that, together with a portion of the wall of the housing, defines an acoustic port of the portable electronic device. The electronic device may further include an acoustic port cover positioned at least partially in the acoustic port and a speaker at least partially within the housing and configured to direct sound through the acoustic port cover.

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.

Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.

Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

Abstract: A mobile phone may include a housing, a battery at least partially within the housing, and a circuit board assembly at least partially within the housing and positioned along a side of the battery. The circuit board assembly may include a first circuit board defining a first hole, a second circuit board defining a second hole, a wall structure between the first circuit board and the second circuit board and attached to an inner surface of the first circuit board and an inner surface of the second circuit board, and a fastener assembly configured to retain the first circuit board to the second circuit board.

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Abstract: A portable electronic device includes a housing, a sensor array including a first camera module having a first field of view, a second camera module having a second field of view different from the first field of view, and a light source, and a rear cover formed from a glass material and defining a raised sensor array region positioned over the sensor array. The raised sensor array region defines a first hole extending through the rear cover and positioned proximate a first corner region of the raised sensor array region, and a second hole extending through the rear cover and positioned proximate a second corner region diagonal from the first corner region. The first camera module includes a first camera housing defining a recess at a corner of the first camera housing, and the second camera module includes a second camera housing extending into the recess.

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Abstract: A portable electronic device may include a housing member, a rear cover coupled to the housing member, and a top module coupled to the housing member and including a front cover defining an exterior surface and an interior surface opposite to the exterior surface, a display stack attached to the interior surface of the front cover and comprising a flexible circuit element extending from a side of the display stack, a frame member attached to the interior surface of the front cover and extending at least partially around a periphery of the display stack, and an encapsulating structure positioned between the frame member and the display stack and at least partially encapsulating a portion of a peripheral side of the display stack and the flexible circuit element. The encapsulating structure may cover at least a portion of a bottom side of the display stack.

Abstract: A strobe module can include a Fresnel lens that defines an external surface of the strobe module and a sidewall at least partially defining an internal volume and defining an external channel. A gasket can be disposed in the external channel. A substrate can be coupled to the sidewall to further define the internal volume and a light source can be disposed on the substrate in the internal volume.

Abstract: An electronic device may have a display overlapped by a cover layer. Portions of the surface of the display and cover layer may have curved profiles. The display may include a flexible substrate and may have bent edge portions protruding from a central region. Gaps may be formed between regions of pixels on a common substrate or between separate display panels. Gap-overlapping structures may overlap the gaps to hide internal components from view or to blend the appearance of gaps with the appearance of adjoining portions of a display layer. The gap-overlapping structures may include light sources such as crystalline semiconductor light-emitting diodes. The diodes may emit light through light diffusing structures. Protruding display layer fingers and other structures may be used to accommodate display cover layer surfaces with curved profiles such as corner surfaces of compound curvature.

Abstract: An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.