Abstract: An electronic device can include different components providing different functionality. Some electronic devices can include a proximity sensor for determining when a user's face is near the device. The sensor can include an emitter and a detector that are separated by a foam block to limit cross-talk between the emitter and detector. A sheet can be placed over the foam block to define openings for each of the emitter and detector. Some electronic devices can also include a camera. A glass cover secured to the device enclosure can protect the camera. To improve an adhesive bond between the glass cover and a metal enclosure, an ink layer can be placed between an adhesive and the glass. In addition, the camera or another component may need to be grounded to ensure proper operation. During assembly, however, the position of the camera can shift due to closing an enclosure. A grounding assembly that maintains contact with the camera in its initial and final positions can be provided.

Abstract: Electronic devices and other apparatuses adapted to receive electromagnetic wave communications are disclosed. An outer housing encloses various device components, including at least an internal antenna located fully therewithin and adapted to receive/send communications from/to an outside source via RF or other electromagnetic waves. A ceramic coating can be a thermal spray coating that covers at least a portion of the outer surface proximate to the internal antenna, and can be “RF transparent”—adapted to allow communications to/from the internal antenna via electromagnetic waves. The outer housing can be plastic, metal or a combination thereof. For metal or other non-RF transparent housings, an RF-transparent insert can be fitted into a window in the housing to permit communications to the internal antenna. The ceramic coating covers some or all of the metal, plastic and/or insert that comprise the outer housing and surface for a final aesthetic finish to the device.

Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.

Abstract: Apparatus, systems and methods for improving chemical strengthening behavior in glass members are disclosed. According to one aspect, a method for processing a glass part formed using a fusion process or a float process includes annealing the glass part and then chemically strengthening the glass part. Annealing the glass part includes at least heating the glass part at a first temperature, maintaining the first temperature, and cooling the glass part to a second temperature using a controlled cooling process. Chemically strengthening the glass part includes facilitating an ion exchange between ions included in the glass part and ions included in a chemical strengthening bath.

Abstract: Techniques or processes for providing markings on products are disclosed. The markings provided on products can be textual and/or graphic. The techniques or processes can provide high resolution markings on surfaces that are flat or curved. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, the housing for a particular product can include a housing surface and the markings can be provided on the housing surface such that the marking are visible to users of the products. The products can be electronic devices (e.g., portable electronic devices).

Abstract: This is directed to systems and methods for cover assembly retention of a portable electronic device. In some embodiments, a cover assembly and/or housing of an electronic device can include one or more retention features such as detents, hooks, tabs, extensions, screw plates, screw holes, shuttles, latches, or any combination of the above, for retaining the cover assembly to the housing. In some embodiments, one or more retention features can be included on a internal platform of the electronic device to retain the cover assembly. In some embodiments, a hidden screw feature can be included in a SIM tray slot of the electronic device. Once a SIM tray has been inserted into the SIM tray slot, the screw feature can be hidden from sight and may become unapparent to an end user of the electronic device.

Abstract: An electronic device may be provided with a housing. A camera module may be mounted within the housing. The housing may have a camera window with which a lens in the camera module is aligned. To rotationally and laterally align the camera module with respect to the camera window and the electronic device housing, an alignment structure may be mounted to the housing in alignment with the camera window and housing. The alignment structure may be formed form a ring-shaped structure with an opening. The alignment structures may have sidewalls that form an alignment groove for the camera module. The camera window may be formed from a circular opening in a layer of opaque material deposited on a transparent housing member such as a planar layer of glass. During the process, a laser tool may be used to trim the opening in the opaque material.

Abstract: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.

Abstract: Improved housings for electronic devices are disclosed. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. In other embodiments, apparatus, systems and methods for robustly attaching a cover portion of an electronic device to a bottom portion, e.g., a housing portion, of the electronic device are described. The electronic device can be portable and in some cases handheld.

Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

Abstract: Improved housings for electronic devices are disclosed. An electronic device housing can make use of at least one outer member (e.g., cover) that can be aligned, protected and/or secured with respect to other portions of the housing for the electronic device. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. Protective sides can be provided in some embodiments to protect the edges of the one or more glass surfaces so as to dissipate impact forces and thus reduce damage to the electronic device housing. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. The electronic device can be portable and in some cases handheld.

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

Abstract: Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.

Abstract: An electronic device may have a display. The display may have active components such as display pixels formed on a display substrate layer. The display substrate layer may be formed from a glass substrate layer. Thin-film transistors and other components for the display pixels may be formed on the glass substrate. An encapsulation glass layer may be bonded to the glass substrate using a ring-shaped bond structure. The ring-shaped bond structure may extend around the periphery of the encapsulation glass layer and the substrate glass layer. The bond structure may be formed from a glass frit, a solid glass ring, integral raised glass portions of the glass layers, meltable metal alloys, or other bond materials. Chemical and physical processing operations may be used to temper the glass layers, to perform annealing operations, to preheat the glass layers, and to promote adhesion.

Abstract: Electronic devices and other apparatuses adapted to receive electromagnetic wave communications are disclosed. An outer housing encloses various device components, including at least an internal antenna located fully therewithin and adapted to receive/send communications from/to an outside source via RF or other electromagnetic waves. A ceramic coating can be a thermal spray coating that covers at least a portion of the outer surface proximate to the internal antenna, and can be “RF transparent”—adapted to allow communications to/from the internal antenna via electromagnetic waves. The outer housing can be plastic, metal or a combination thereof. For metal or other non-RF transparent housings, an RF-transparent insert can be fitted into a window in the housing to permit communications to the internal antenna. The ceramic coating covers some or all of the metal, plastic and/or insert that comprise the outer housing and surface for a final aesthetic finish to the device.