Patents by Inventor David A. Pickney

David A. Pickney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication method of high precision, thermally stable electromagnetic coil vanes
    Patent number: 6588090
    Abstract: The present invention relates to a method and apparatus of fabricating electromagnetic coil vanes. The method involves placing a bonding composition on opposing surfaces of a substrate. First and second complementary coil patterns are formed, and are aligned and bonded to respective clamp plate fixtures. The first complementary coil pattern is bonded to one surface of the opposing surfaces of the substrate via the bonding composition, and the second complementary coil pattern is bonded to the other surface of the opposing surfaces of the substrate via the bonding composition. The bonding composition is cured, and the clamp plates are removed from the first and second complementary coil patterns.
    Type: Grant
    Filed: June 3, 1999
    Date of Patent: July 8, 2003
    Assignee: Nikon Corporation
    Inventors: Rodney A. Kendall, David A. Pickney