Abstract: A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.

Abstract: A method for improving adhesion between polymeric materials is provided. The method includes treating a surface of a first polymeric material with plasma of oxygen gas and hydrogen-containing gas. The first polymeric material may be a fully cured polymeric material. A second polymeric material may then be deposited on the plasma treated surface of the first polymeric material. The second polymeric material may be an uncured polymeric material. This plasma treatment may be used in improving the adhesion between polymeric components of an inkjet printer. It provides good adhesion between the polymeric components of the inkjet printer even after long exposure to ink.

Abstract: A method of bonding a chip to a wafer at precise alignment suitable for fabricating a heater chip in an ink jet printhead is provided. The method includes spray coating an adhesive composition on a surface of a substrate, aligning and tacking at least one chip to the substrate coated with the adhesive composition, exposing the substrate tacked with at least one chip coated with the adhesive composition to radiation and heat, and performing thermal compression bonding. The method uses a spray coatable adhesive composition comprising a thermally activated adhesive and a photoacid generator.

Abstract: A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.

Abstract: A process for etching semiconductor substrates using a deep reactive ion etching process to produce through holes or slots (hereinafter “slots”) in the substrates. The process includes applying a first layer to a back side of a substrate as a first etch stop material. The first layer is a relatively soft etch stop material. A second layer is applied to the first layer on the back side of the substrate to provide a composite etch stop layer. The second layer is a relatively hard etch stop material. The substrate is etched from a side opposite the back side of the substrate to provide a slot in the substrate.

Abstract: A microwave device has a monolithic microwave integrated circuit (MMIC) disposed therein for applying microwave radiation to a microfluidic structure, such as a chamber, defined in the device. The microwave radiation from the MMIC is useful for heating samples introduced into the microfluidic structure and for effecting lysis of cells in the samples. Microfabrication techniques allow the fabrication of MMICs that perform heating and cell lysing of samples having volumes in the microliter to picoliter range.

Abstract: A microwave device has a monolithic microwave integrated circuit (MMIC) disposed therein for applying microwave radiation to a microfluidic structure, such as a chamber, defined in the device. The microwave radiation from the MMIC is useful for heating samples introduced into the microfluidic structure and for effecting lysis of cells in the samples. Microfabrication techniques allow the fabrication of MMICs that perform heating and cell lysing of samples having volumes in the microliter to picoliter range.

Abstract: A manufacturable GaAs VFET process includes providing a doped GaAs substrate with a lightly doped first epitaxial layer thereon and a heavily doped second epitaxial layer positioned on the first epitaxial layer. A temperature tolerant conductive layer is positioned on the second epitaxial layer and patterned to define a plurality of elongated, spaced apart source areas. Using the patterned conductive layer, a plurality of gate trenches are etched into the first epitaxial layer adjacent the source areas. The bottoms of the gate trenches are implanted and activated to form gate areas. A gate contact is deposited in communication with the implanted gate areas, a source contact is deposited in communication with the patterned conductive layer overlying the source areas, and a drain contact is deposited on the rear surface of the substrate.

Abstract: Arbitrarily and individually priced articles can be automatically vended from a machine in which the articles are stored without restriction, limitation, or categorization to their individualized prices. The vended articles are compactly stored in a plurality of vertical stacks. Each stack includes a retrieval mechanism which picks the top article from the stack and inserts it into an inclined ladder. The inserted package then moves to the display station where the user determines whether or not the displayed article is to be vended. If the article is to be vended, an appropriate amount of consideration is inserted, counted, and the article is moved to a delivery station within the ladder. If the appropriate amount of consideration has, in fact, been received, the article is dispensed from the delivery station. Otherwise, the article will then be moved to a return station included within the ladder.