Patents by Inventor David A. Rittenhouse

David A. Rittenhouse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11656653
    Abstract: A wireless energy transfer system includes an electronic device having at least two members, each housing at least a portion of the electronic device pivotably coupled via a number of hinges. A hinge member is disposed proximate at least some of the number of hinges. At least one receiver coil may be disposed in, on, or about the hinge member. Removing the receiver coil from the members housing the electronic device advantageously permits thinning of the members and a beneficial reduction in height of the electronic device. A power supply may include a number of power supply coils disposed in, on, or about a power supply member. Some or all of the power supply coils may wirelessly couple to the at least one receiver coil via an electromagnetic field and transfer energy to the electronic device when the electronic device is disposed proximate the power supply.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: May 23, 2023
    Assignee: Intel Corporation
    Inventor: David A. Rittenhouse
  • Publication number: 20210203190
    Abstract: A wireless energy transfer system includes an electronic device having at least two members, each housing at least a portion of the electronic device pivotably coupled via a number of hinges. A hinge member is disposed proximate at least some of the number of hinges. At least one receiver coil may be disposed in, on, or about the hinge member. Removing the receiver coil from the members housing the electronic device advantageously permits thinning of the members and a beneficial reduction in height of the electronic device. A power supply may include a number of power supply coils disposed in, on, or about a power supply member. Some or all of the power supply coils may wirelessly couple to the at least one receiver coil via an electromagnetic field and transfer energy to the electronic device when the electronic device is disposed proximate the power supply.
    Type: Application
    Filed: February 19, 2021
    Publication date: July 1, 2021
    Inventor: David A. Rittenhouse
  • Patent number: 11006195
    Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: May 11, 2021
    Assignee: Intel Corporation
    Inventors: Devon Worrell, David A. Rittenhouse
  • Patent number: 10838466
    Abstract: Particular embodiments described herein provide for device that includes a first housing, a second housing, and a hinge, configured as an antenna, to rotatably couple the first housing and the second housing.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: November 17, 2020
    Assignee: Intel Corporation
    Inventors: David A. Rittenhouse, Manish A. Hiranandani, Denica N. Larsen, Anand S. Konanur, Hong W. Wong, Ulun Karacaoglu
  • Patent number: 10419834
    Abstract: Embodiments are generally directed to an integrated sound bar hinge assembly for a mobile electronic device. A wearable electronic device may include a hinge assembly body; at least one hinge set coupled with hinge assembly body to hingeably couple a first portion of a mobile device to a second portion of the mobile device; and at least one speaker bracket contained in the hinge assembly body to install a first speaker.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: September 17, 2019
    Assignee: INTEL CORPORATION
    Inventor: David A. Rittenhouse
  • Publication number: 20180348825
    Abstract: Particular embodiments described herein provide for device that includes a first housing, a second housing, and a hinge, configured as an antenna, to rotatably couple the first housing and the second housing.
    Type: Application
    Filed: December 10, 2015
    Publication date: December 6, 2018
    Applicant: Intel Corporation
    Inventors: David A. Rittenhouse, Manish A. Hiranandani, Denica N. Larsen, Anand S. Konanur, Hong W. Wong, Ulun Karacaoglu
  • Publication number: 20180270553
    Abstract: Embodiments are generally directed to an integrated sound bar hinge assembly for a mobile electronic device. A wearable electronic device may include a hinge assembly body; at least one hinge set coupled with hinge assembly body to hingeably couple a first portion of a mobile device to a second portion of the mobile device; and at least one speaker bracket contained in the hinge assembly body to install a first speaker.
    Type: Application
    Filed: September 27, 2017
    Publication date: September 20, 2018
    Inventor: David A. Rittenhouse
  • Patent number: 9990006
    Abstract: In one example a hinge assembly for an electronic device comprises a first hinge comprising a first bracket coupled to a first bushing disposed at a first end of the first bracket and rotatable about a first shaft extending through the first bushing. a second hinge comprising, a second bushing, a first linkage arm rotatable about a second shaft extending through the second bushing, and a second linkage arm rotatable about the second shaft extending through the second bushing and a third hinge comprising a second bracket coupled to a second bushing disposed at a first end of the second bracket and rotatable about a third shaft extending though the second bushing, wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft. Other examples may be described.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: June 5, 2018
    Assignee: Intel Corporation
    Inventors: Mark E. Sprenger, Kenan Arik, Aleksander Magi, David A. Rittenhouse
  • Publication number: 20180143662
    Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). The electronic device may also include a first housing and a structurally sensitive module. The structurally sensitive module can include a structurally sensitive component and a structurally sensitive attachment. The structurally sensitive attachment includes one or more mounting tabs to structurally isolate the structurally sensitive component from the first housing.
    Type: Application
    Filed: June 27, 2015
    Publication date: May 24, 2018
    Applicant: Intel Corporation
    Inventors: Ralph V. Miele, Amin Mohammed Godil, Andrew Larson, Shantanu D. Kulkarni, Dan H. Gerbus, Andrew C. Dausman, David A. Rittenhouse
  • Patent number: 9964988
    Abstract: Particular embodiments described herein provide for an device that includes a first body coupled to a first housing, a second body coupled to a second housing, a hinge rod, and a spring clip on an outside diameter of the hinge rod, where the spring clip is configured to increase the torque of the hinge.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: May 8, 2018
    Assignee: Intel Corporation
    Inventor: David A. Rittenhouse
  • Patent number: 9888306
    Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: February 6, 2018
    Assignee: Intel Corporation
    Inventors: Devon Worrell, David A. Rittenhouse
  • Publication number: 20170359640
    Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.
    Type: Application
    Filed: May 26, 2017
    Publication date: December 14, 2017
    Inventors: Devon Worrell, David A. Rittenhouse
  • Patent number: 9843850
    Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.
    Type: Grant
    Filed: September 26, 2015
    Date of Patent: December 12, 2017
    Assignee: Intel Corporation
    Inventors: Devon Worrell, David A. Rittenhouse
  • Publication number: 20170344074
    Abstract: In one example a hinge assembly for an electronic device comprises a first hinge comprising a first bracket coupled to a first bushing disposed at a first end of the first bracket and rotatable about a first shaft extending through the first bushing. a second hinge comprising, a second bushing, a first linkage arm rotatable about a second shaft extending through the second bushing, and a second linkage arm rotatable about the second shaft extending through the second bushing and a third hinge comprising a second bracket coupled to a second bushing disposed at a first end of the second bracket and rotatable about a third shaft extending though the second bushing, wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft. Other examples may be described.
    Type: Application
    Filed: May 24, 2016
    Publication date: November 30, 2017
    Applicant: Intel Corporation
    Inventors: Mark E. Sprenger, Kenan Arik, Aleksander Magi, David A. Rittenhouse
  • Patent number: 9794660
    Abstract: Embodiments are generally directed to an integrated sound bar hinge assembly for a mobile electronic device. A wearable electronic device may include a hinge assembly body; at least one hinge set coupled with hinge assembly body to hingeably couple a first portion of a mobile device to a second portion of the mobile device; and at least one speaker bracket contained in the hinge assembly body to install a first speaker.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: October 17, 2017
    Assignee: INTEL CORPORATION
    Inventor: David A. Rittenhouse
  • Publication number: 20170264983
    Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.
    Type: Application
    Filed: May 25, 2017
    Publication date: September 14, 2017
    Inventors: Devon Worrell, David A. Rittenhouse
  • Publication number: 20170177026
    Abstract: Particular embodiments described herein provide for an device that includes a first body coupled to a first housing, a second body coupled to a second housing, a hinge rod, and a spring clip on an outside diameter of the hinge rod, where the spring clip is configured to increase the torque of the hinge.
    Type: Application
    Filed: December 22, 2015
    Publication date: June 22, 2017
    Applicant: Intel Corporation
    Inventor: David A. Rittenhouse
  • Publication number: 20170094380
    Abstract: Embodiments are generally directed to an integrated sound bar hinge assembly for a mobile electronic device. A wearable electronic device may include a hinge assembly body; at least one hinge set coupled with hinge assembly body to hingeably couple a first portion of a mobile device to a second portion of the mobile device; and at least one speaker bracket contained in the hinge assembly body to install a first speaker.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventor: David A. Rittenhouse
  • Publication number: 20170094382
    Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.
    Type: Application
    Filed: September 26, 2015
    Publication date: March 30, 2017
    Inventors: Devon Worrell, David A. Rittenhouse
  • Patent number: 9563236
    Abstract: Embodiments are generally directed an adjustable tension wrap end hinge. A hinge assembly includes a first wrap end component and a second wrap end component; a first axle and a second axle, the wrap section of the first wrap end component being wrapped at least in part around a first portion of the first axle adjacent to a first end of the first axle, and the wrap section of the second wrap end component being wrapped at least in part around a first portion of the second axle adjacent to a first end of the second axle; and a first tension screw to adjust a tension of the first wrap end component on the first axle and a second tension screw to adjust a tension of the second wrap end component on the second axle.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: February 7, 2017
    Assignee: Intel Corporation
    Inventor: David A. Rittenhouse