Patents by Inventor David A. Rittenhouse
David A. Rittenhouse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11656653Abstract: A wireless energy transfer system includes an electronic device having at least two members, each housing at least a portion of the electronic device pivotably coupled via a number of hinges. A hinge member is disposed proximate at least some of the number of hinges. At least one receiver coil may be disposed in, on, or about the hinge member. Removing the receiver coil from the members housing the electronic device advantageously permits thinning of the members and a beneficial reduction in height of the electronic device. A power supply may include a number of power supply coils disposed in, on, or about a power supply member. Some or all of the power supply coils may wirelessly couple to the at least one receiver coil via an electromagnetic field and transfer energy to the electronic device when the electronic device is disposed proximate the power supply.Type: GrantFiled: February 19, 2021Date of Patent: May 23, 2023Assignee: Intel CorporationInventor: David A. Rittenhouse
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Publication number: 20210203190Abstract: A wireless energy transfer system includes an electronic device having at least two members, each housing at least a portion of the electronic device pivotably coupled via a number of hinges. A hinge member is disposed proximate at least some of the number of hinges. At least one receiver coil may be disposed in, on, or about the hinge member. Removing the receiver coil from the members housing the electronic device advantageously permits thinning of the members and a beneficial reduction in height of the electronic device. A power supply may include a number of power supply coils disposed in, on, or about a power supply member. Some or all of the power supply coils may wirelessly couple to the at least one receiver coil via an electromagnetic field and transfer energy to the electronic device when the electronic device is disposed proximate the power supply.Type: ApplicationFiled: February 19, 2021Publication date: July 1, 2021Inventor: David A. Rittenhouse
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Patent number: 11006195Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.Type: GrantFiled: May 26, 2017Date of Patent: May 11, 2021Assignee: Intel CorporationInventors: Devon Worrell, David A. Rittenhouse
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Patent number: 10838466Abstract: Particular embodiments described herein provide for device that includes a first housing, a second housing, and a hinge, configured as an antenna, to rotatably couple the first housing and the second housing.Type: GrantFiled: December 10, 2015Date of Patent: November 17, 2020Assignee: Intel CorporationInventors: David A. Rittenhouse, Manish A. Hiranandani, Denica N. Larsen, Anand S. Konanur, Hong W. Wong, Ulun Karacaoglu
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Patent number: 10419834Abstract: Embodiments are generally directed to an integrated sound bar hinge assembly for a mobile electronic device. A wearable electronic device may include a hinge assembly body; at least one hinge set coupled with hinge assembly body to hingeably couple a first portion of a mobile device to a second portion of the mobile device; and at least one speaker bracket contained in the hinge assembly body to install a first speaker.Type: GrantFiled: September 27, 2017Date of Patent: September 17, 2019Assignee: INTEL CORPORATIONInventor: David A. Rittenhouse
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Publication number: 20180348825Abstract: Particular embodiments described herein provide for device that includes a first housing, a second housing, and a hinge, configured as an antenna, to rotatably couple the first housing and the second housing.Type: ApplicationFiled: December 10, 2015Publication date: December 6, 2018Applicant: Intel CorporationInventors: David A. Rittenhouse, Manish A. Hiranandani, Denica N. Larsen, Anand S. Konanur, Hong W. Wong, Ulun Karacaoglu
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Publication number: 20180270553Abstract: Embodiments are generally directed to an integrated sound bar hinge assembly for a mobile electronic device. A wearable electronic device may include a hinge assembly body; at least one hinge set coupled with hinge assembly body to hingeably couple a first portion of a mobile device to a second portion of the mobile device; and at least one speaker bracket contained in the hinge assembly body to install a first speaker.Type: ApplicationFiled: September 27, 2017Publication date: September 20, 2018Inventor: David A. Rittenhouse
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Patent number: 9990006Abstract: In one example a hinge assembly for an electronic device comprises a first hinge comprising a first bracket coupled to a first bushing disposed at a first end of the first bracket and rotatable about a first shaft extending through the first bushing. a second hinge comprising, a second bushing, a first linkage arm rotatable about a second shaft extending through the second bushing, and a second linkage arm rotatable about the second shaft extending through the second bushing and a third hinge comprising a second bracket coupled to a second bushing disposed at a first end of the second bracket and rotatable about a third shaft extending though the second bushing, wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft. Other examples may be described.Type: GrantFiled: May 24, 2016Date of Patent: June 5, 2018Assignee: Intel CorporationInventors: Mark E. Sprenger, Kenan Arik, Aleksander Magi, David A. Rittenhouse
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Publication number: 20180143662Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). The electronic device may also include a first housing and a structurally sensitive module. The structurally sensitive module can include a structurally sensitive component and a structurally sensitive attachment. The structurally sensitive attachment includes one or more mounting tabs to structurally isolate the structurally sensitive component from the first housing.Type: ApplicationFiled: June 27, 2015Publication date: May 24, 2018Applicant: Intel CorporationInventors: Ralph V. Miele, Amin Mohammed Godil, Andrew Larson, Shantanu D. Kulkarni, Dan H. Gerbus, Andrew C. Dausman, David A. Rittenhouse
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Patent number: 9964988Abstract: Particular embodiments described herein provide for an device that includes a first body coupled to a first housing, a second body coupled to a second housing, a hinge rod, and a spring clip on an outside diameter of the hinge rod, where the spring clip is configured to increase the torque of the hinge.Type: GrantFiled: December 22, 2015Date of Patent: May 8, 2018Assignee: Intel CorporationInventor: David A. Rittenhouse
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Patent number: 9888306Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.Type: GrantFiled: May 25, 2017Date of Patent: February 6, 2018Assignee: Intel CorporationInventors: Devon Worrell, David A. Rittenhouse
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Publication number: 20170359640Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.Type: ApplicationFiled: May 26, 2017Publication date: December 14, 2017Inventors: Devon Worrell, David A. Rittenhouse
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Patent number: 9843850Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.Type: GrantFiled: September 26, 2015Date of Patent: December 12, 2017Assignee: Intel CorporationInventors: Devon Worrell, David A. Rittenhouse
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Publication number: 20170344074Abstract: In one example a hinge assembly for an electronic device comprises a first hinge comprising a first bracket coupled to a first bushing disposed at a first end of the first bracket and rotatable about a first shaft extending through the first bushing. a second hinge comprising, a second bushing, a first linkage arm rotatable about a second shaft extending through the second bushing, and a second linkage arm rotatable about the second shaft extending through the second bushing and a third hinge comprising a second bracket coupled to a second bushing disposed at a first end of the second bracket and rotatable about a third shaft extending though the second bushing, wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft. Other examples may be described.Type: ApplicationFiled: May 24, 2016Publication date: November 30, 2017Applicant: Intel CorporationInventors: Mark E. Sprenger, Kenan Arik, Aleksander Magi, David A. Rittenhouse
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Patent number: 9794660Abstract: Embodiments are generally directed to an integrated sound bar hinge assembly for a mobile electronic device. A wearable electronic device may include a hinge assembly body; at least one hinge set coupled with hinge assembly body to hingeably couple a first portion of a mobile device to a second portion of the mobile device; and at least one speaker bracket contained in the hinge assembly body to install a first speaker.Type: GrantFiled: September 25, 2015Date of Patent: October 17, 2017Assignee: INTEL CORPORATIONInventor: David A. Rittenhouse
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Publication number: 20170264983Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.Type: ApplicationFiled: May 25, 2017Publication date: September 14, 2017Inventors: Devon Worrell, David A. Rittenhouse
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Publication number: 20170177026Abstract: Particular embodiments described herein provide for an device that includes a first body coupled to a first housing, a second body coupled to a second housing, a hinge rod, and a spring clip on an outside diameter of the hinge rod, where the spring clip is configured to increase the torque of the hinge.Type: ApplicationFiled: December 22, 2015Publication date: June 22, 2017Applicant: Intel CorporationInventor: David A. Rittenhouse
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Publication number: 20170094380Abstract: Embodiments are generally directed to an integrated sound bar hinge assembly for a mobile electronic device. A wearable electronic device may include a hinge assembly body; at least one hinge set coupled with hinge assembly body to hingeably couple a first portion of a mobile device to a second portion of the mobile device; and at least one speaker bracket contained in the hinge assembly body to install a first speaker.Type: ApplicationFiled: September 25, 2015Publication date: March 30, 2017Inventor: David A. Rittenhouse
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Publication number: 20170094382Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.Type: ApplicationFiled: September 26, 2015Publication date: March 30, 2017Inventors: Devon Worrell, David A. Rittenhouse
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Patent number: 9563236Abstract: Embodiments are generally directed an adjustable tension wrap end hinge. A hinge assembly includes a first wrap end component and a second wrap end component; a first axle and a second axle, the wrap section of the first wrap end component being wrapped at least in part around a first portion of the first axle adjacent to a first end of the first axle, and the wrap section of the second wrap end component being wrapped at least in part around a first portion of the second axle adjacent to a first end of the second axle; and a first tension screw to adjust a tension of the first wrap end component on the first axle and a second tension screw to adjust a tension of the second wrap end component on the second axle.Type: GrantFiled: July 10, 2015Date of Patent: February 7, 2017Assignee: Intel CorporationInventor: David A. Rittenhouse