Patents by Inventor David A. Roy

David A. Roy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ULTRA THIN FLIP-CHIP BACKSIDE DEVICE SENSOR PACKAGE
    Publication number: 20110210411
    Abstract: An integrated circuit that senses a phenomenon, such as a magnetic field, may be mounted upside down on a carrier substrate so that the electrical connections to the integrated sensor circuit may be made on the side facing the carrier. This eliminates the need for wirebonds on the side of the sensor integrated circuit that faces the phenomenon being sensed, thereby substantially eliminating any uneven topography on that side. The sensor integrated circuit is able to sense the phenomenon by sensing it through the body of the sensor integrated circuit. The body of the sensor integrated circuit may have a thickness within a vicinity of fifty microns.
    Type: Application
    Filed: April 20, 2010
    Publication date: September 1, 2011
    Applicant: SOUND DESIGN TECHNOLOGIES, LTD.
    Inventors: Sukhminder S. Binapal, David A. Roy