Abstract: A method and apparatus for laser welding a section of a ribbon to a substrate or substrate pad uses a laser beam that passes through an aperture in a bond head. The laser beam may be supplied to the bond head using an optic fiber. This method is useful for bonding conductive ribbons in microelectronic circuits.

Abstract: An implantable medical device substrate is free form cut to the shape of the interior of the device. The free form shape allows more efficient use of not only the interior space of the device but also of the substrate itself. Integrated circuit components are formed to fit the shape of the substrate, freeing areas in the device for additional components, or allowing the device to be made smaller through a maximized use of the available space-volume.

Abstract: An accelerometer device which can be mounted on a substrate, e.g., a circuit board enclosed in a medical device, includes an accelerometer sensing element having an axis of sensitivity and further includes first and second multilayer end caps. The substrate generally defines a mounting plane. The accelerometer sensing element includes a device body having a longitudinal axis extending between generally parallel first and second ends thereof and further includes a principal surface extending between the first and second ends of the device body parallel to the longitudinal axis. The axis of sensitivity of the sensing element is generally perpendicular to a plane defined by the principal surface. Further, the accelerometer sensing element includes conductive pad regions on each of the first and second ends of the device body.

Abstract: An accelerometer and sensor assemblies for medical implantable devices such as pacemakers, cardioverters, IPGs, PCDs, defibrillators, ICDs, and the like, includes at least one intermediate metallization layer sandwiched between a first lower surface of at least one upper sheet formed from a piezoelectric material surface, and a second upper surface of at least one lower sheet formed from a piezoelectric material. The at least one upper sheet has a first outer edge disposed between its first upper and first lower surfaces. The at least one lower sheet has a second outer edge disposed between its second upper and second lower surfaces. The at least one intermediate metallization layer is not disposed at all locations between the first lower surface and the second upper surface, but extends to an external region disposed between the first outer edge and the second outer edge, and is electrically connected to the external region.

Abstract: Accelerometer and sensor assemblies for implantable medical devices such as pacemakers, cardioverters, IPGs, PCDs, defibrillators, ICDs, and the like includes at least one intermediate metallization layer sandwiched between a first lower surface of at least one upper sheet formed from a piezoelectric material surface, and a second upper surface of at least one lower sheet formed from a piezoelectric material. The at least one upper sheet has a first outer edge disposed between its first upper and first lower surfaces. The at least one lower sheet has a second outer edge disposed between its second upper and second lower surfaces. The at least one intermediate metallization layer is not disposed at all locations between the first lower surface and the second upper surface, but extends to an external region disposed between the first outer edge and the second outer edge, and is electrically connected to the external region.

Abstract: The present invention relates to accelerometer assemblies for implantable medical devices such as pacemakers, IPGs, PCDs, defibrillators, ICDs and the like. The accelerometer assembly of the present invention comprises a beam that deflects in response to being subjected to an externally provided force. Deflection of the beam generates a voltage in a piezoelectric material disposed in the assembly. At least one stop is provided to limit the vertical range of motion through which the beam may deflect to prevent failure, fracturing or breakage of the beam resulting from excessive deflection of the beam that might otherwise occur were the stop not present.

Abstract: A feedthrough configuration for a hermetically sealed implantable medical device includes a metal case having an aperture and a feedthrough in the aperture which includes a ferrule sealed in the aperture, a pin extending through the ferrule and the aperture, an insulating material supporting the pin within the ferrule and an electrically conductive block spaced from the ferrule and in electrical connection with the pin. A device for electrical or electromagnetic protection can be connected to a peripheral upstanding portion of the ferrule and a peripheral skirt portion of the block. This arrangement of feedthrough elements can be particularly useful if the protective device is a chip capacitor which typically has a flat-sided configuration that can bridge the space between the ferrule and the block and be connected at one end to the block and at the other end to the ferrule.

Abstract: An implantable medical device including a hermetic housing containing an electronic circuit, such as a cardiac pacemaker. The electronic circuit may be coupled to a medical lead by means of a connector module which is formed as part of a molded, resilient shroud, extending around the circumference of the hermetic container.