Patents by Inventor David A. Sawoska

David A. Sawoska has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for enhancing the solderability of a surface
    Patent number: 6444109
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, ampihateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: September 3, 2002
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Process for selectively plating areas of a substrate
    Publication number: 20020068127
    Abstract: A process for the selective activation and plating of a substrate is disclosed. The process involves the application of an activator composition to a substrate in a predetermined pattern by means of a print head wherein the print head moves across the surface of the substrate and selectively deposits the activator composition in said predetermined pattern upon the substrate. The selectively activated substrate is then subjected to electroless plating.
    Type: Application
    Filed: December 4, 2000
    Publication date: June 6, 2002
    Inventors: Francis Durso, Steven Castaldi, David Sawoska
  • Method for enhancing the solderability of a surface
    Publication number: 20010016232
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Application
    Filed: March 29, 2001
    Publication date: August 23, 2001
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Method for enhancing the solderability of a surface
    Patent number: 6200451
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: February 17, 1999
    Date of Patent: March 13, 2001
    Assignee: MacDermid, Incorporated
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Oxidizing accelerator
    Patent number: 4608275
    Abstract: A method of electroless deposition of metal on a non-conductive substrate is disclosed and comprises treating a substrate prior to electroless deposition with a catalyst composition containing a mixed tin-palladium catalyst. An improvement in metal deposition is obtained by contacting the treated substrate with an alkaline accelerator bath containing an agent which oxidizes the tin.
    Type: Grant
    Filed: March 18, 1985
    Date of Patent: August 26, 1986
    Assignee: MacDermid, Incorporated
    Inventors: Peter E. Kukanskis, John J. Grunwald, David Sawoska
  • Electroless copper deposition solution using a hypophosphite reducing agent
    Patent number: 4279948
    Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution.
    Type: Grant
    Filed: August 27, 1979
    Date of Patent: July 21, 1981
    Assignee: MacDermid Incorporated
    Inventors: Peter E. Kukanskis, John J. Grunwald, Donald R. Ferrier, David A. Sawoska
  • Electroless copper composition solution using a hypophosphite reducing agent
    Patent number: 4209331
    Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution.
    Type: Grant
    Filed: May 25, 1978
    Date of Patent: June 24, 1980
    Assignee: MacDermid Incorporated
    Inventors: Peter E. Kukanskis, John J. Grunwald, Donald R. Ferrier, David A. Sawoska