Patents by Inventor David A. Selvidge

David A. Selvidge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210313720
    Abstract: Blind mate connection techniques and associated connectors are disclosed. Blind mate connectors provide connections where visual inspection at time of connection may not be available. Stacking tolerance increases when connectors have a different set of datums (e.g., a different relative orientation) relative to adjacent connectors. Different datums permit twinning two printed circuit boards (“PCBs”) prior to insertion into a slot of a chassis. Each connector may be attached to a respective PCB utilizing a spring and offset feature to provide a standoff on a respective PCB. Control of standoff and rotational movement (e.g., via brackets) allows each individual connector to have a “float” for improved insertion tolerance. Connector pairs may connect through an opening in a midplane while simultaneously connecting to the midplane. Switch trays and node trays may be inserted through opposing sides of a chassis and be connected through the midplane of that chassis.
    Type: Application
    Filed: April 6, 2020
    Publication date: October 7, 2021
    Inventors: Pinche Tsai, Minh Nguyen, David A. Selvidge
  • Patent number: 11102149
    Abstract: Switches and groups of IO ports may be divided into separate switch modules and IO modules that can be connected by high-speed low-loss management cables in a variety of configurations. Thereafter, the separate modules may be replaced independently of each other. The switch module may recognize, and thereafter ignore, unconnected ports, removing the performance penalty that sometimes arises when fewer than all available ports are connected. The switch module may rapidly adjust to addition, subtraction, and replacement of connected IO modules.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: August 24, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Nilashis Dey, John M. Lenthall, David A. Selvidge, Minh Nguyen
  • Publication number: 20210194826
    Abstract: Switches and groups of IO ports, conventionally integrated on a single shared PCB, may be divided into separate switch modules and IO modules that can be connected by high-speed low-loss management cables in a variety of configurations. Thereafter, the separate modules may be replaced independently of each other. Some of the management connections may be parallel, similar to production-data connections. Alternatively, a series of IO modules (e.g., a chain or a ring) may be managed by a single switch module using a management method. The management method may include collecting and updating configuration and status information specific to each of the IO modules and, by extension, each of their IO ports. This enables the switch module to recognize, and thereafter ignore, unconnected ports, removing the performance penalty that sometimes arises when fewer than all available ports are connected. It also allows the switch module to rapidly adjust to addition, subtraction, and replacement of connected IO modules.
    Type: Application
    Filed: December 20, 2019
    Publication date: June 24, 2021
    Inventors: Nilashis Dey, John M. Lenthall, David A. Selvidge, Minh Nguyen
  • Patent number: 10925186
    Abstract: Embodiments are directed to an assembly including a bay structure including a bay structure that defines a bay for receiving a pluggable module and including sides and a front plate rotatably connected to the sides, a connecting bracket coupled with the bay structure, and a heat transfer device coupled with the bay structure. The bay structure, the heat transfer device, and the connecting bracket are configured such that rotating the front plate from a first position to a second position displaces the connecting bracket in a first direction which causes the connecting bracket to displace the heat transfer device in a second direction transverse to the first direction.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: February 16, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David A. Selvidge, Pinche Tsai, Minh H. Nguyen
  • Patent number: 10866621
    Abstract: A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: December 15, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David A. Selvidge, Pinche Tsai, David Scott Chialastri, Minh H. Nguyen
  • Publication number: 20200367387
    Abstract: Embodiments are directed to an assembly including a bay structure including a bay structure that defines a bay for receiving a pluggable module and including sides and a front plate rotatably connected to the sides, a connecting bracket coupled with the bay structure, and a heat transfer device coupled with the bay structure. The bay structure, the heat transfer device, and the connecting bracket are configured such that rotating the front plate from a first position to a second position displaces the connecting bracket in a first direction which causes the connecting bracket to displace the heat transfer device in a second direction transverse to the first direction.
    Type: Application
    Filed: May 15, 2019
    Publication date: November 19, 2020
    Inventors: David A. Selvidge, Pinche Tsai, Minh H. Nguyen
  • Publication number: 20200241609
    Abstract: A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.
    Type: Application
    Filed: January 24, 2019
    Publication date: July 30, 2020
    Inventors: David A. Selvidge, Pinche Tsai, David Scott Chialastri, Minh H. Nguyen
  • Patent number: 10602640
    Abstract: In example implementations, a memory cooler is provided. The memory cooler includes a body. The body includes two pieces that are moveable relative to one another. Each piece of the body includes an inlet manifold, an outlet manifold, and a plurality of cold plates extending between the inlet manifold and the outlet manifold. The inlet manifold is to receive liquid coolant from a liquid coolant supply line. The outlet manifold is to return the liquid coolant to the liquid coolant supply line. The liquid coolant flows from the inlet manifold to the outlet manifold through interior channels of the cold plates. The plurality of cold plates of a first piece of the body are interleaved with the plurality of cold plates of a second piece of the body such that slots to receive memory modules are defined between adjacent pairs of cold plates.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: March 24, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Pinche Tsai, Minh Nguyen, David A. Selvidge
  • Patent number: 10225940
    Abstract: Example implementations relate to a handle made of a single metal sheet. In one example, the handle includes a plurality of chamfered edges where each edge includes a first side and a second side. The handle includes a rolled-over top cover and a rolled bottom edge disposed between each of the plurality of chamfered edges. The handle also includes a latching extension disposed adjacent to each of the plurality of chamfered edges. The latching extension of the handle includes a pivot hole, an engaging indentation, and a hook located at an endpoint of the latching extension.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: March 5, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Stephen Spencer, Belgie B. McClelland, David A. Selvidge
  • Patent number: 9990012
    Abstract: A disk drive module is provided herein. The disk drive module includes a frame, a keyed member, a front aperture, and a back aperture. The frame includes a top wall, a bottom wall, and a pair of side walls therebetween. The keyed member is formed along at least one of the pair of side walls. The front aperture to receive a drive carrier. The back aperture to interchangeably receive at least one back end selected from a hot plug back end and a non-hot plug back end.
    Type: Grant
    Filed: April 24, 2014
    Date of Patent: June 5, 2018
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Earl W Moore, Minh H Nguyen, David A Selvidge
  • Patent number: 9829933
    Abstract: Examples described herein include latch mechanisms for covers. In some examples, an electronic device has an enclosure, a cover, and a latch mechanism. The enclosure may include an opening. The latch mechanism may include a rotatable arm, a spring to bias the rotatable arm to secure the cover to the enclosure, and a cam moveable between a rest position and an engaged position. In the engaged position, the cam moves the rotatable arm to release the cover.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: November 28, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Shou-Jen Yang, Earl W. Moore, David A. Selvidge
  • Publication number: 20170251560
    Abstract: Example implementations relate to a handle made of a single metal sheet. In one example, the handle includes a plurality of chamfered edges where each edge includes a first side and a second side. The handle includes a rolled-over top cover and a rolled bottom edge disposed between each of the plurality of chamfered edges. The handle also includes a latching extension disposed adjacent to each of the plurality of chamfered edges. The latching extension of the handle includes a pivot hole, an engaging indentation, and a hook located at an endpoint of the latching extension.
    Type: Application
    Filed: October 30, 2014
    Publication date: August 31, 2017
    Inventors: Stephen SPENCER, Belgie B McCLELLAND, David A SELVIDGE
  • Publication number: 20170010641
    Abstract: A disk drive module is provided herein. The disk drive module includes a frame, a keyed member, a front aperture, and a back aperture. The frame includes a top wall, a bottom wall. and a pair of side walls therebetween. The keyed member is formed along at least one of the pair of side walls. The front aperture to receive a drive carrier. The back aperture to interchangeably receive at least one back end selected from a hot plug back end and a non-hot plug back end.
    Type: Application
    Filed: April 24, 2014
    Publication date: January 12, 2017
    Inventors: Earl W MOORE, Minh H NGUYEN, David A SELVIDGE
  • Publication number: 20140295711
    Abstract: A compression connector includes a housing and a plurality of contacts located within the housing. Each of the plurality of contacts is configured to bend at a plurality of locations when pressure is applied to the contact. In addition, each of the plurality of contacts is configured to tuck within itself when pressure is applied to the contact. Furthermore, each of the plurality of contacts is constrained by the housing.
    Type: Application
    Filed: October 25, 2011
    Publication date: October 2, 2014
    Inventors: John P. Franz, Andrew James Phelan, George D. Magason, David A. Selvidge, Joseph R. Allen, Kelly K. Smith, Michael S. Bunker
  • Patent number: 8235339
    Abstract: An assembly for engaging a rail with support structures includes a bracket disposed at an end of the rail. The bracket is configured to rotate between at least first and second positions such that the bracket can present at least first or second different engagement features for engaging with different kinds of support structures.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: August 7, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David A. Selvidge, Paul E. Westphall, Kelly K. Smith
  • Publication number: 20110043986
    Abstract: A power supply assembly for electronic components, such as servers, can include a power supply and a mount. The power supply is connected to the mount and is configured to power a plurality of electronic components. The power supply assembly can include a connection between the power supply and mount that is configured to permit the power supply to pivot about an axis in relation to the mount.
    Type: Application
    Filed: April 30, 2008
    Publication date: February 24, 2011
    Inventors: Kevin D. Conn, David A. Selvidge
  • Publication number: 20100327135
    Abstract: An assembly for engaging a rail with support structures includes a bracket disposed at an end of the rail. The bracket is configured to rotate between at least first and second positions such that the bracket can present at least first or second different engagement features for engaging with different kinds of support structures.
    Type: Application
    Filed: June 26, 2009
    Publication date: December 30, 2010
    Inventors: David A. Selvidge, Paul E. Westphall, Kelly K. Smith
  • Patent number: 7817417
    Abstract: A baffle manages airflow through optionally mounted electronic components by using flexible members formed to extend to empty connectors and flex away from the connectors to accommodate electronic components mounted to the connectors.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: October 19, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John P Franz, Richard A. Bargerhuff, David A. Selvidge
  • Patent number: D739404
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: September 22, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Keith J. Kuehn, David A. Selvidge, Melissa Ellen Meingast, Brooks Vaughan
  • Patent number: D773918
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: December 13, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Stephen Spencer, David A. Selvidge, Belgie B. McClelland