Abstract: An inkjet printing device includes an inkjet print head with nozzles for ejecting drops of ink or fluid and a print medium transport system for feeding a print medium passed the print head. At least two of the nozzles of the print head are positioned to print a spot at each target location on the print medium during operation of the printing device.

Abstract: Methods of forming thermal ink jet resistor structures for use in nucleating ink are described. In one embodiment, the method comprises forming a layer of conductive material over a substrate, and patterning and etching the layer of conductive material effective to form one or more arrays of resistors. Individual arrays comprise multiple, parallel-connected resistor elements and the resistor elements are configured such that failure of any one resistor element will not render its associated resistor array inoperative for nucleating ink. The resistor elements of individual arrays are formed such that collectively, the resistor elements are not independently addressable. Other embodiments are described.

Abstract: A thermal inkjet print head includes a temperature regulation system. The print head preferably includes a thermal inkjet print head and an array or array of Peltier devices in proximity to the thermal inkjet print head such that the array of Peltier devices can raise or lower the temperature of the thermal inkjet print head or components thereof.

Abstract: An inkjet printing device includes an inkjet print head with nozzles for ejecting drops of ink or fluid and a print medium transport system for feeding a print medium passed the print head. At least two of the nozzles of the print head are positioned to print a spot at each target location on the print medium during operation of the printing device.

Abstract: Methods of forming thermal ink jet resistor structures for use in nucleating ink are described. In one embodiment, the method comprises forming a layer of conductive material over a substrate, and patterning and etching the layer of conductive material effective to form one or more arrays of resistors. Individual arrays comprise multiple, parallel-connected resistor elements and the resistor elements are configured such that failure of any one resistor element will not render its associated resistor array inoperative for nucleating ink. The resistor elements of individual arrays are formed such that collectively, the resistor elements are not independently addressable. Other embodiments are described.

Abstract: Thermal ink jet defect tolerant resistor designs are described. In one embodiment, a thermal ink jet resistor structure comprises a first resistor element and at least one other resistor element. The resistor elements are connected in parallel and have substantially the same resistances. The resistor elements are configured for redundancy such that if one of the resistor elements fails, one or more remaining resistor elements can function to effectuate ink ejection. In another embodiment, a thermal ink jet printer comprises multiple ink reservoirs configured for holding and ejecting ink toward a print medium. At least one resistor array is disposed within each ink reservoir. Each resistor array comprises multiple, redundant resistor elements that are connected in parallel with one another such that failure of any one resistor element will not render its associated ink reservoir inoperative.

Abstract: Thermal ink jet defect tolerant resistor designs are described. In one embodiment, a thermal ink jet resistor structure comprises a first resistor element and at least one other resistor element. The resistor elements are connected in parallel and have substantially the same resistances. The resistor elements are configured for redundancy such that if one of the resistor elements fails, one or more remaining resistor elements can function to effectuate ink ejection. In another embodiment, a thermal ink jet printer comprises multiple ink reservoirs configured for holding and ejecting ink toward a print medium. At least one resistor array is disposed within each ink reservoir. Each resistor array comprises multiple, redundant resistor elements that are connected in parallel with one another such that failure of any one resistor element will not render its associated ink reservoir inoperative.

Abstract: A printhead is used to eject printing fluid, such as ink, onto a printing medium. This printhead has an integrated heat-sink used to cool energy dissipation elements which propel the printing fluid from the printhead. The printhead includes an amorphous substrate carrying a structure of plural thin-film layers. Upon the substrate is defined a metallic heat sink layer covering substantially the entire plan-view shape of the substrate, and serving during operation of the printhead to distribute excess heat for dissipation. During manufacturing of the printhead, this thin-film metallic heat sink layer performs the additional function of preventing an element or compound present in the substrate from migrating into the thin-film layers.