Patents by Inventor David A. Sluzewski

David A. Sluzewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130142478
    Abstract: An apparatus includes a slider structure having a top surface and a bottom surface opposite from the top surface. The apparatus includes a waveguide with an input facet at the top surface and an output proximate the bottom surface. A laser having an output facet is positioned proximate the input facet of the waveguide and include a second plurality of pads facing a first plurality of pads on the top surface of the slider. A bonding material is disposed between individual ones of the first and second plurality of pads such that a reflow of the bonding material induces relative movement between the laser and the top surface to align the input and output facets.
    Type: Application
    Filed: December 2, 2011
    Publication date: June 6, 2013
    Applicant: SEAGATE TECHNOLOGY LLC
    Inventors: David A. Sluzewski, Scott E. Olson
  • Patent number: 8351158
    Abstract: A slider includes a slider body having a first side and edges defined adjacent to the first side, at least two separate insulators each adjacent to the first side of the slider body and supported by the slider body, and a conductive trace adjacent to each of the at least two separate insulators and opposite the first side of the slider body. The at least two separate insulators each are in physical contact with the slider body along the first side of the slider body such that the at least two separate insulators are physically attached to the slider body to electrically insulate each conductive trace from the slider body.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: January 8, 2013
    Assignee: Seagate Technology LLC
    Inventors: Jianxin Zhu, David A. Sluzewski, Lance E. Stover, Joel W. Hoehn, Kevin J. Schulz
  • Publication number: 20110157750
    Abstract: A slider includes a slider body having a first side and edges defined adjacent to the first side, at least two separate insulators each adjacent to the first side of the slider body and supported by the slider body, and a conductive trace adjacent to each of the at least two separate insulators and opposite the first side of the slider body. The at least two separate insulators each are in physical contact with the slider body along the first side of the slider body such that the at least two separate insulators are physically attached to the slider body to electrically insulate each conductive trace from the slider body.
    Type: Application
    Filed: March 11, 2011
    Publication date: June 30, 2011
    Applicant: SEAGATE TECHNOLOGY LLC
    Inventors: Jianxin Zhu, David A. Sluzewski, Lance E. Stover, Joel W. Hoehn, Kevin J. Schulz
  • Patent number: 7929248
    Abstract: A slider according to the present invention includes a slider body, a plurality of insulators, and conductive traces. The slider body has a first side and edges defined substantially perpendicular to the first side. The plurality of insulators are each adjacent to the first side of the slider body. The conductive traces are adjacent to each of the plurality of insulators and opposite the slider body.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: April 19, 2011
    Assignee: Seagate Technology LLC
    Inventors: Jianxin Zhu, David A. Sluzewski, Lance E. Stover, Joel W. Hoehn, Kevin J. Schulz
  • Publication number: 20070274005
    Abstract: A slider according to the present invention includes a slider body, a plurality of insulators, and conductive traces. The slider body has a first side and edges defined substantially perpendicular to the first side. The plurality of insulators are each adjacent to the first side of the slider body. The conductive traces are adjacent to each of the plurality of insulators and opposite the slider body.
    Type: Application
    Filed: May 23, 2006
    Publication date: November 29, 2007
    Applicant: Seagate Technology LLC
    Inventors: Jianxin Zhu, David A. Sluzewski, Lance E. Stover, Joel W. Hoehn, Kevin J. Schulz
  • Patent number: 6600619
    Abstract: A system and method for controlling vibration of a piezoelectric microactuator in a disc drive are disclosed. The mechanical strain on the piezoelectric microactuator is ascertained and fed back to a controller which provides an electrical signal to the piezoelectric microactuator based upon the sensed strain. The electrical signal provided to the piezoelectric microactuator produces a mechanical force on the microactuator which counteracts the sensed strain. In one embodiment, a bridge circuit is coupled to the piezoelectric microactuator. The bridge circuit is adapted to sense a voltage across the piezoelectric microactuator and to separate the voltage across the piezoelectric microactuator into a voltage externally applied to the piezoelectric microactuator and a voltage induced on the piezoelectric microactuator by mechanical strain.
    Type: Grant
    Filed: December 30, 1999
    Date of Patent: July 29, 2003
    Assignee: Seagate Technology LLC
    Inventors: John C. Morris, Brian G. Molloy, David A. Sluzewski, John S. Wright
  • Patent number: 6590748
    Abstract: A dual-acting disc drive micro-actuator is formed of a stack of adjoining layers. The stack includes first through fifth layers. The first layer includes first and second spaced apart top electrodes. The second layer includes a first piezoelectric element electrically coupled to the first and second top electrodes. The third layer includes a center electrode electrically coupled to the first piezoelectric element. The fourth layer includes a second piezoelectric element electrically coupled to the center electrode. The fifth layer includes a first bottom electrode electrically coupled to the second piezoelectric element. The first and second piezoelectric elements are expandable and contractible in a common length direction in response to respective electrical fields applied between the center electrode and the first top electrode, the second top electrode and the first bottom electrode.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: July 8, 2003
    Assignee: Seagate Technology LLC
    Inventors: James M. Murphy, David A. Sluzewski, John S. Wright, David G. Qualey
  • Patent number: 6504669
    Abstract: A disc drive head positioning apparatus includes a head, a suspension which supports the head, a piezoelectric microactuator which is operatively coupled to the suspension, and a charge feedback driver which is operatively coupled to the piezoelectric microactuator. A method of positioning the head relative to a storage medium is also provided.
    Type: Grant
    Filed: June 10, 1999
    Date of Patent: January 7, 2003
    Assignee: Seagate Technology LLC
    Inventors: Donald W. Janz, John C. Morris, Brian G. Molloy, David A. Sluzewski, John S. Wright
  • Patent number: 6351353
    Abstract: The present invention is a package for incorporating a micromotor into a head gimbal assembly. The head gimbal assembly includes a slider package and a micromotor package assembled on a load beam. The slider package and micromotor package include circuitry which allow a read/write signal to be conducted from the read/write head on the slider to the load beam. Solder joints form the electrical and mechanical connections between the load beam, the micromotor, and the slider.
    Type: Grant
    Filed: December 9, 1999
    Date of Patent: February 26, 2002
    Assignee: Seagate Technology, Inc.
    Inventors: David A. Sluzewski, David G. Qualey, Kevin J. Schultz
  • Publication number: 20010050833
    Abstract: A dual-acting disc drive micro-actuator is formed of a stack of adjoining layers. The stack includes first through fifth layers. The first layer includes first and second spaced apart top electrodes. The second layer includes a first piezoelectric element electrically coupled to the first and second top electrodes. The third layer includes a center electrode electrically coupled to the first piezoelectric element. The fourth layer includes a second piezoelectric element electrically coupled to the center electrode. The fifth layer includes a first bottom electrode electrically coupled to the second piezoelectric element. The first and second piezoelectric elements are expandable and contractible in a common length direction in response to respective electrical fields applied between the center electrode and the first top electrode, the second top electrode and the first bottom electrode.
    Type: Application
    Filed: June 7, 2001
    Publication date: December 13, 2001
    Inventors: James M. Murphy, David A. Sluzewski, John s. Wright, David G. Qualey
  • Patent number: 6046886
    Abstract: A disc drive flex circuit head interconnect includes a base insulating layer. At least one flexible electrical conductor is attached to the base insulating layer. The electrical conductor has first and second ends, the first end is adapted to couple to a head, and a second end adapted to couple to an actuator board through a slot in the actuator board. An insulating spacer covers at least a portion of the electrical conductor and extends beyond at least one edge of the base insulating layer near the second end of the conductor. A disc drive incorporating the interconnect and a method of interconnection is also provided.
    Type: Grant
    Filed: May 12, 1998
    Date of Patent: April 4, 2000
    Assignee: Seagate Technology, Inc.
    Inventors: Adam K. Himes, Kevin J. Schulz, David A. Sluzewski, David G. Qualey
  • Patent number: 5769989
    Abstract: A configuration of surface-mounted circuit assembly has four layers, namely, an integrated circuit device, an adhesive layer, a solder layer and the carrier board. The integrated circuit device is attached to the solder layer which sets on top of the carrier board, with the adhesive layer between the integrated circuit device and the solder layer. The carrier board has at least one via located beneath where the integrated circuit is located. The via is filled with solder such that the solder layer at which the integrated circuit device is situated is thermo-conductively connected to the back side of the carrier board. This configuration allows the integrated circuit device to be easily removed from the carrier board by the application of heat to the back side of the carrier board.
    Type: Grant
    Filed: September 19, 1995
    Date of Patent: June 23, 1998
    Assignee: International Business Machines Corporation
    Inventors: Mark Kenneth Hoffmeyer, David A. Sluzewski
  • Patent number: 5601675
    Abstract: An electronics device has unpackaged chips or other small components mounted on a carrier and wire-bonded to carrier wiring traces. The rear chip faces have a layer of adhesive which overlies a layer of solder or other fusible material, and which adheres to a pad area of the carrier. To replace a chip, its solder layer is melted, and the chip and adhesive are pulled off. Reapplying an adhesive layer allows a new chip to be mounted on the carrier and bonded to the traces.
    Type: Grant
    Filed: December 6, 1994
    Date of Patent: February 11, 1997
    Assignee: International Business Machines Corporation
    Inventors: Mark K. Hoffmeyer, David A. Sluzewski