Abstract: A modular quantum computing structure includes a plurality of attachment structures, at least some of the attachment structures having different thicknesses. At least one of a plurality of qubit chips is bonded to a first attachment structure of the plurality of attachment structures having a first thickness. A second attachment structure of the plurality of attachment structures arranged adjacent the first attachment structure has a second thickness different from the first thickness of the first attachment structure. At least one of the qubit chips bonded to the first attachment structure has a footprint extending beyond a footprint of the first interposer to overlap at least the second interposer.

Abstract: Techniques for quality of service (QoS) support for input/output devices and other agents are described. In embodiments, a processing device includes execution circuitry to execute a plurality of software threads; hardware to control monitoring or allocating, among the plurality of software threads, one or more shared resources; and configuration storage to enable the monitoring or allocating of the one or more shared resources among the plurality of software threads and one or more channels through which one or more devices are to be connected to the one or more shared resources.

Abstract: The disclosed technology provides solutions for performing a document validation process where physically present witnesses are required. A process of the disclosed technology can include steps for identifying a location of a first device associated with a first user, receiving an electronic copy of a signed document, and an electronic copy of one or more government issued documents associated with the first user, and providing a prompt to the first user, wherein the prompt is configured to request electronic contact address information for a second device associated with a second user. The process can further include steps for identifying a location of the second device associated with the second user to verify that the first device is within a predetermined threshold distance of the second device. Systems and machine-readable media are also provided.

Abstract: A machine learning framework and method for using the same are described.

Abstract: The present invention sets forth a technique for performing virtual object placement in a video sequence. The technique includes identifying a planar surface depicted in an input video sequence and selecting a virtual object included in an object library. The technique also includes generating, for a combination of the planar surface and the virtual object, a suitability metric associated with the combination, wherein the suitability metric is based at least on a semantic compatibility between the virtual object and the planar surface. The technique further includes generating, via one or more machine learning models, a modified video sequence based on the suitability metric, where the modified video sequence depicts the virtual object placed on the planar surface.

Abstract: A quantum computing chip device provides an edge based capacitive, intra-chip connection. A first chip includes a first signal line with a distal end positioned proximate to or on an edge of the first chip and a proximal end positioned away from the edge of the first chip. A second chip includes a second signal line with a distal end positioned proximate to or on an edge of the second chip and a proximal end positioned away from the edge of the second chip. The first signal line and the second signal line are configured to conduct a signal. The second signal line of the second chip is disposed in alignment for a capacitive bus connection to the first signal line of the first chip.

Abstract: An air quality notification system to perform operations that include: causing a sensor device to sample an air quality associated with a location at a predefined sampling interval; determining, at the sensor device, that a value corresponding with the air quality sampled by the sensor device transgresses a threshold value; causing the sensor device to transmit an alert to a server system responsive to the determining that the value corresponding with the air quality transgresses a threshold value; and causing the server system to present a notification at a client device responsive to the sensor device transmitting the alert, the notification including at least a display of an identifier associated with the location.

Abstract: Methods of reducing injury to crop foliage and achieving weed control using encapsulated acetamide herbicides are described. Herbicidal microcapsules comprising herbicide core material and a shell wall encapsulating the core material are also described. The microcapsules provide reduced crop injury through controlled herbicide release.

Abstract: The present invention provides compounds of the formula: for use in the treatment of systemic sclerosis, fibrosis (e.g. pulmonary fibrosis), achondroplasia, thanatophoric dysplasia (e.g. type I), severe achondroplasia with developmental delay and acanthosis nigricans (SADDAN), muenke syndrome or cancer.

Abstract: A method for operating a multi-door oven apparatus is provided. In one example, the method comprises moving, by a mechanical device, a first oven door along a first path in a first direction orthogonal to a side surface of an oven, the side surface comprising an entrance to the oven. The method further comprises moving, by the mechanical device, the first oven door along a second path in a second direction parallel to the side surface, wherein moving the first oven door along the second path comprises moving the first oven door past a second oven door.

Abstract: Techniques regarding the composition and/or structure of oven walls are provided. For example, one or more embodiments described herein can comprise an oven with a heat source configured to heat a hollow space within the oven. The oven further can comprise an oven body that can define the hollow space. Also, the oven body can comprise a plurality of connected sides, wherein one or more of the connected sides comprise a plurality of carbon nanotubes.

Abstract: The disclosed technology provides solutions for performing a document validation process wherein physically present witnesses are required. In some aspects, a process of the disclosed technology includes steps for receiving geolocation data for a mobile device associated with a first user, receiving a signed electronic document via the first device, determining if the signed electronic document was properly executed by the first user, and if the signed electronic document was properly executed, providing a prompt to the first user, wherein the prompt is configured to request electronic contact address for a second device associated with a second user. In some aspects, the process can further include transmitting an authentication request to the second device associated with the second user, receiving geolocation data from the second device in response to the authentication request. Systems and machine-readable media are also provided.

Abstract: One embodiment of the present invention sets forth a technique for processing recordings of events. The technique includes applying a machine learning model to a plurality of samples from one or more recordings of the events to generate a plurality of embeddings representing the plurality of samples. The technique also includes generating a plurality of labels that identify speakers associated with the plurality of samples based on metadata comprising timestamps of voice activity during the events and participants associated with the voice activity. The technique further includes storing mappings of the plurality of embeddings to the plurality of labels.

Abstract: An electronic structure includes a first substrate having a first under bump metallization (UBM) region and a second UBM region formed thereon. One or more solder bumps is deposited onto the first UBM region. A downstop formed on the second UBM region is wider, shallower and more rigid than any one of the solder bumps formed on the first UBM region. A second substrate is joined to the first substrate by the one or more solder bumps located on the first UBM region, and a height of the downstop limits a distance between at least one of the first substrate and the second substrate, or between an object and at least one of the first substrate and the second substrate.

Abstract: The present invention provides compounds of the formula: wherein A, Z, G, R1, R2, and R4 are as described herein, pharmaceutically acceptable salts thereof, and methods of using these compounds and pharmaceutically acceptable salts thereof for treating patients for cancer.

Abstract: The present invention provides compounds of the formula: wherein A, Z, G, R1, R2, and R4 are as described herein, pharmaceutically acceptable salts thereof, and methods of using these compounds and pharmaceutically acceptable salts thereof for treating patients for cancer.

Abstract: A content distribution system includes content receivers that provide a plurality of blockchain databases that store transaction records associated with subscriber requests for content, and a computer system that processes those transaction records and enables authorized content receivers to output requested content.

Abstract: A method of applying a coating to a substrate includes ionic electrolytic plating a substrate submerged within an ionic liquid at ambient temperature, in ambient air, and at ambient pressure with aluminum. The ionic liquid includes imidazolium chloride compounds having aluminum chloride (AlCl3) and sodium dodecyl sulphate (C12H25NaO4S) in a mono ethylene glycol solution, and a deposition rate of the ionic electrolytic plating is controlled by a power supply within a temperature range between about 288 Kelvin (59° F.) to about 305 Kelvin (89° F.).

Abstract: A cryogenic system comprising a first cryogenic stage and a second cryogenic stage. A first signal line passing from the first cryogenic stage and is connected to a superconducting thermal break in the second cryogenic stage. A second signal line connecting the superconducting thermal break to a cryogenic device.

Abstract: A semiconductor device comprises a first chip layer, having a first chip layer front-side and a first chip layer back-side, a qubit chip layer, having a qubit chip layer front-side and a qubit chip layer back-side, the qubit chip layer front-side operatively coupled to the first chip layer front-side with a set of bump-bonds, a set of through-silicon vias (TSVs) connected to at least one of: the first chip layer back-side or the qubit chip layer back-side and a cap wafer metal bonded to at least one of: the qubit chip layer back-side or the first chip layer back-side.