Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

Abstract: According to the present disclosure, a printer apparatus may include a chuck configured to support a substrate thereon, a rail spaced apart from the chuck, a printhead carriage frame coupled to the rail and containing a printhead carriage housing at least one printhead therein, a first camera assembly configured to capture image data of the printhead and provide the image data to a computer, and a computer receiving the image data from the first camera assembly and configured to determine a deviation between a desired position of the printhead and an actual position of the printhead.

Abstract: According to the present disclosure, a printer apparatus may include a chuck configured to support a substrate thereon, a rail spaced apart from the chuck, a printhead carriage frame coupled to the rail, and a printhead carriage coupled to the printhead carriage frame. The printhead carriage may include a printhead and an actuation mechanism. The actuation assembly may be coupled to the printhead carriage and may be selectively engagable with the printhead for selective displacement of the printhead relative to the printhead carriage.

Abstract: According to the present disclosure, a printer apparatus may include a chuck configured to support a substrate thereon, a rail spaced apart from the chuck, a printhead carriage frame coupled to the rail, and a printhead carriage pivotally coupled to the printhead carriage frame.

Abstract: A microdeposition system includes a printhead carriage that includes N rows of nozzles and that moves along a first axis; a stage that holds a substrate; and a maintenance station located at a position along the first axis that is past an edge of the substrate. The N rows of nozzles selectively deposit droplets of fluid manufacturing material onto the substrate. The maintenance station includes a capping station and an ultrasonic cleaning station located in a middle of the capping station. N is an integer greater than one.

Abstract: A microdeposition system includes a stage, a printhead carriage, and a controller. The stage holds a substrate. The printhead carriage includes N printhead modules, where N is an integer greater than one. Each of the N printhead modules includes a printhead and an alignment mechanism. The printhead includes a plurality of nozzles that deposit droplets of fluid manufacturing material onto the substrate while relative movement between the substrate and the printhead is along a first axis. The alignment mechanism adjusts the printhead with respect to the printhead module. The controller controls the alignment mechanisms of the N printhead modules to set effective nozzle spacing for the pluralities of nozzles to a uniform value. The effective nozzle spacing is defined as spacing between adjacent ones of the plurality of nozzles as projected onto a second axis perpendicular to the first axis.

Abstract: A microdeposition system includes a printhead carriage that moves along a first axis; a stage that holds a substrate; a rail located above the printhead carriage and extending along a third axis parallel to the first axis; and an accessory carriage that travels along the rail to remain above the printhead carriage. The printhead carriage includes a plurality of nozzles that deposit droplets of fluid material onto the substrate.

Abstract: The present teachings relate to a printhead maintenance station for an industrial printing apparatus which is used to prevent clogging of the printhead, particularly during periods in which the printheads are idle. The maintenance station includes a capping station which has sockets for keeping the printheads moist and a blotting station for cleaning any residual printing fluids prior to carrying out a print function.

Abstract: A drop analysis/drop check system allows a plurality of printheads to remain stationary during analysis to emulate operation of an actual piezoelectric microdeposition system. The system provides accurate tuning of individual nozzle ejectors and allows for substrate loading and alignment in parallel with drop analysis/drop check. The drop analysis/drop check system includes a motion controller directing movement of a stage, a printhead controller controlling a printhead to selectively eject drops of fluid material to be deposited on a substrate, and a camera supported by the stage for movement relative to the printheads. The camera receives a signal from the motion controller to initiate exposure of the camera and captures an image of the drops of fluid material ejected by the printheads. A light-emitting device includes a strobe controller that receives a signal from the camera to supply light to an area including the liquid drops during camera exposure.

Abstract: The present invention relates to an integral printhead assembly for use in association with an industrial printing apparatus. The integral printhead assembly is a self-contained unit which can be quickly removed and replaced with another assembly with minimum downtime to the printing apparatus.

Abstract: According to the present disclosure, a printer apparatus may include a chuck configured to support a substrate thereon, a rail spaced apart from the chuck, a printhead carriage frame coupled to the rail and containing a printhead carriage housing at least one printhead therein, a first camera assembly configured to capture image data of the printhead and provide the image data to a computer, and a computer receiving the image data from the first camera assembly and configured to determine a deviation between a desired position of the printhead and an actual position of the printhead.

Abstract: A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.

Abstract: A microdeposition system and method includes a head with a plurality of nozzles. A controller generates nozzle firing commands that selectively fire the nozzles to create a desired feature pattern. Configuration memory stores voltage waveform parameters that define a voltage waveform for each of the nozzles. A digital to analog converter (DAC) sequencer communicates with the configuration memory and the controller and outputs a first voltage waveform for a first nozzle when a nozzle firing command for the first nozzle is received from the controller. A resistive ladder DAC receives the voltage waveforms from the DAC sequencer. An operational amplifier (opamp) communicates with the resistive ladder DAC and amplifies the voltage waveforms. The nozzles fire droplets when the voltage waveforms received from the opamp exceed a firing threshold of the nozzle.

Abstract: A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.

Abstract: A microdeposition system microdeposit droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define subfeatures of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.