Patents by Inventor David Alex Rose

David Alex Rose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for removing particles from the surface of a semiconductor wafer
    Patent number: 11769660
    Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: September 26, 2023
    Assignee: PulseForge, Inc.
    Inventors: David Alex Rose, Kurt A. Schroder
  • Method and apparatus for removing particles from the surface of a semiconductor wafer
    Patent number: 11688600
    Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A liquid is placed on a surface of a semiconductor wafer on which particles may adhere. A light pulse is then applied to the surface of the semiconductor wafer through the liquid. The liquid containing the particles is then removed from the surface of the semiconductor wafer.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: June 27, 2023
    Assignee: PulseForge, Inc.
    Inventors: David Alex Rose, Kurt A. Schroder
  • METHOD AND APPARATUS FOR REMOVING PARTICLES FROM THE SURFACE OF A SEMICONDUCTOR WAFER
    Publication number: 20230178362
    Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A liquid is placed on a surface of a semiconductor wafer on which particles may adhere. A light pulse is then applied to the surface of the semiconductor wafer through the liquid. The liquid containing the particles is then removed from the surface of the semiconductor wafer.
    Type: Application
    Filed: December 3, 2021
    Publication date: June 8, 2023
    Applicant: NCC NANO, LLC
    Inventors: DAVID ALEX ROSE, KURT A. SCHRODER
  • METHOD AND APPARATUS FOR REMOVING PARTICLES FROM THE SURFACE OF A SEMICONDUCTOR WAFER
    Publication number: 20230178363
    Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.
    Type: Application
    Filed: December 3, 2021
    Publication date: June 8, 2023
    Applicant: NCC NANO, LLC
    Inventors: DAVID ALEX ROSE, KURT A. SCHRODER
  • Method and apparatus for removing particles from the surface of a semiconductor wafer
    Patent number: 11621175
    Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an electric grid is utilized to remove the particles off the surface of the wafer.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: April 4, 2023
    Assignee: PulseForge Inc.
    Inventors: David Alex Rose, Kurt A. Schroder