Abstract: An integrated heat-assisted magnetic recording (HAMR) device comprises a slider that has a top surface, a bottom surface, and a trailing end. A waveguide is carried on the trailing end and a near field transducer is positioned to receive energy from the waveguide and produce plasmons for heating a region of a magnetic medium. A write pole is carried by the slider adjacent to the near field transducer. A laser is mounted on the top surface of the slider and produces a laser beam that passes through a beam shaper mounted on the top surface of the slider that collimates or focuses the laser beam. A mirror is mounted on the slider for directing the collimated or focused light beam into the waveguide.

Abstract: An apparatus includes a slider mounted on an arm, a first waveguide including a first core guiding layer, a second waveguide mounted on the slider and including a second core guiding layer having a uniform thickness smaller than the thickness of the first core guiding layer, and a coupler for coupling light from the first core guiding layer to the second core guiding layer, wherein the coupler comprises a curved mirror formed in the second waveguide and positioned to reflect light from the first core guiding layer into the second core guiding layer.

Abstract: An apparatus includes a slider mounted on an arm, a first waveguide including a first core guiding layer, a second waveguide mounted on the slider and including a second core guiding layer having a thickness smaller than the thickness of the first core guiding layer, and a coupler for coupling light from the first core guiding layer to the second core guiding layer.

Abstract: An integrated heat-assisted magnetic recording (HAMR) device comprises a slider that has a top surface, a bottom surface, and a trailing end. A waveguide is carried on the trailing end and a near field transducer is positioned to receive energy from the waveguide and produce plasmons for heating a region of a magnetic medium. A write pole is carried by the slider adjacent to the near field transducer. A laser is mounted on the top surface of the slider and produces a laser beam that passes through a beam shaper mounted on the top surface of the slider that collimates or focuses the laser beam. A mirror is mounted on the slider for directing the collimated or focused light beam into the waveguide.

Abstract: An apparatus comprising a slider including a slider substrate with a trailing side and a writer with bond pads disposed on the trailing side. The writer has an optic input for receiving an optic output. The apparatus comprises an optoelectronic substrate having a substrate surface facing the trailing side, and having contacts on the substrate surface that are joined to the bond pads by conductive bridges, and having an optoelectronic emitter adjacent the substrate surface for generating the optic output.

Abstract: An apparatus includes a slider mounted on an arm, a first waveguide including a first core guiding layer, a second waveguide mounted on the slider and including a second core guiding layer having a thickness smaller than the thickness of the first core guiding layer, and a coupler for coupling light from the first core guiding layer to the second core guiding layer.

Abstract: An apparatus comprising a slider including a slider substrate with a trailing side and a writer with bond pads disposed on the trailing side. The writer has an optic input for receiving an optic output. The apparatus comprises an optoelectronic substrate having a substrate surface facing the trailing side, and having contacts on the substrate surface that are joined to the bond pads by conductive bridges, and having an optoelectronic emitter adjacent the substrate surface for generating the optic output.

Abstract: A slider scale package assembly in a head gimbal assembly (HGA) for electrically coupling a slider/magnetic recording (MR) head to a head interconnect circuit in a disc drive includes a flex circuit attached to the back of the slider/MR head which turns the slider/MR head into the slider scale package with at least one repositioned interconnect pad disposed at the back of the slider/MR head. The flex circuit further includes a conductive material, one end of which is electrically bonded to a bond pad of the slider/MR head, and the other end is electrically bonded to a conductive material of the head interconnect circuit via the interconnect pad. A plurality of flex circuits can be made in a sheet format and dividable into a plurality of individual flex circuits to be attached to a plurality of slider/MR heads.

Abstract: A flex circuit for use in a head gimbal assembly having additional polyamide features which improve the damping properties of the flex circuit. An elbow or damping strips with or without metal traces can be added to the flex circuit to dampen the first torsion gain. The elbow or damping strips with or without metal traces do not act as a substrate for electrical circuitry, but rather provide damping properties to the head gimbal assembly.

Abstract: Passive damping of a disc drive structural member is achieved using a tuned resonance passive damping circuit. This circuit can, for example, be connected to a head gimbal assembly that has a piezoelectric micro-actuator. The circuit can be tuned to the sway frequency of the micro-actuator. The circuit is configured to dissipate mechanical energy as heat, effectively damping the structure to which it is attached.

Abstract: Passive damping of a disc drive structural member is achieved using a tuned resonance passive damping circuit. This circuit can, for example, be connected to a head gimbal assembly that has a piezoelectric micro-actuator. The circuit can be tuned to the sway frequency of the micro-actuator. The circuit is configured to dissipate mechanical energy as heat, effectively damping the structure to which it is attached.

Abstract: A microactuation system is disclosed for selectively altering a position of a transducing head carried by a slider in a disc drive system with respect to a track of a rotatable disk having a plurality of concentric tracks. The disc drive system includes a load beam having a base for attachment to an actuator arm and a head suspension for supporting the slider over the rotatable disc. A microactuation system includes a piezoelectric element attached between the base and the head suspension of the load beam and beams or hinges connecting the head suspension to the base. The piezoelectric element is deformable in response to a voltage applied thereto. The beams are sufficiently compliant to permit movement of the head suspension with respect to the base upon deformation of the piezoelectric elements.

Abstract: A disc drive has a recording disc rotatable about an axis and a slider supporting a transducing head for transducing data with the disc. A dual-stage actuation assembly supports the slider to position the transducing head adjacent a selected radial track of the disc, and includes a movable actuator arm and a load beam connected to the actuator arm. A flexure is connected to the load beam for supporting the slider, and includes first conductive traces terminating at first bond pads and at least one second conductive trace electrically connected to the transducing head. A microactuator includes a rotor operatively connected to the slider for radially moving the transducing head and a stator connected to the flexure at the first bond pads.

Abstract: A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.

Abstract: A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.

Abstract: The present invention may be characterized as an improved integrated circuit die testing system which includes a number of components which cooperate together. An integrated circuit carrier is provided for holding the integrated circuit die. Attached to the integrated circuit carrier is a chip site. Proximate to this chip site exists a plurality of contact pads. These contact pads are electrically coupled to a plurality of test points. Also provided is an integrated circuit die. Finally, a pattern of electrically conductive paste is provided. This electrically conductive paste electrically couples the integrated circuit die and the contact pads thereby allowing the integrated circuit die to be tested from the test points.