Abstract: A monitor mounting system which includes a crossbar having at least one monitor mounting bracket positioned thereon. A support arm is configured to adjust the vertical height of the crossbar and a pivot assembly is positioned between the support arm and the crossbar, with the pivot assembly configured to allow limited pivot adjustment of the crossbar in order to level the crossbar to the horizontal position.

Abstract: A circuit board assembly includes a circuit board and an electrical connector having a connector housing holding contacts in a contact array. The connector housing has a mating end configured to be mated with a mating electrical connector in a mating direction. The electrical connector has cables terminated to the contacts and extending from a cable end. A connector mount is used to locate the electrical connector relative to the circuit board. A bracket is coupled to the mounting surface of the circuit board. A biasing member is coupled to the bracket and the mounting feature and is compressible along a compression axis parallel to the mating direction to allow the electrical connector to float in the mating direction relative to the circuit board.

Abstract: A circuit board assembly includes an electrical connector mounted to a circuit board having a connector housing holding contacts in a contact array. A connector mount having a bracket is coupled to the mounting surface of the circuit board proximate to the mating edge. The electrical connector is movably coupled to the connector mount to move relative to the circuit board during mating with the mating electrical connector. The connector mount has a biasing member compressible along a compression axis parallel to the mating direction to allow the electrical connector to float in the mating direction relative to the circuit board. The electrical connector is movably coupled to the connector mount in a confined envelope in at least one floating direction perpendicular to the mating direction.

Abstract: An electrical connector includes wafer assemblies coupled to a housing. Each wafer assembly includes a leadframe, a wafer body holding the leadframe, and a ground frame coupled to the wafer body to provide electrical shielding for the leadframe. Each leadframe has signal contacts with mating ends extending from the wafer body for mating with mating signal contacts of a mating electrical connector. The mating ends are twisted 45° to define twisted mating interfaces. Each ground frame has ground shields extending from a ground plate along the mating ends of the signal contacts. The ground shields are twisted 45° relative to the ground plate to define twisted shield zones along the mating ends of the signal contacts.

Abstract: A method of simultaneously sonicating multiple samples consistently with a single acoustic source includes using strategically positioned reflectors, refractors, scatterers, and/or energy distributors (collectively called acoustic energy redirectors).

Abstract: An electrical connector assembly includes a housing having a mating interface configured to be mated with a hermaphroditic mating electrical connector assembly. The housing includes an electrically conductive commoning member having contact openings. Wafer assemblies are coupled to the housing each having a leadframe, a wafer body holding the leadframe, and a ground frame providing electrical shielding for the leadframe. The signal contacts are terminated to cables. The ground shields are electrically connected to the commoning member. The mating ends of the signal contacts and the ground shields form a hermaphroditic mating interface for mating with the hermaphroditic mating electrical connector assembly.

Abstract: An electrical connector includes wafer assemblies coupled to a housing. Each wafer assembly includes a leadframe, a wafer body holding the leadframe, and a ground frame coupled to the wafer body to provide electrical shielding for the leadframe. Each leadframe has signal contacts with mating ends extending from the wafer body for mating with mating signal contacts of a mating electrical connector. The mating ends are twisted 45° to define twisted mating interfaces. Each ground frame has ground shields extending from a ground plate along the mating ends of the signal contacts. The ground shields are twisted 45° relative to the ground plate to define twisted shield zones along the mating ends of the signal contacts.

Abstract: An electrical connector includes a housing holding wafer assemblies in a wafer stack each including a wafer body holding a leadframe with signal contacts arranged in pairs and extending between mating ends and mounting ends. Each pair includes a primary signal contact and a secondary signal contact. Each signal contact has a main body extending through the wafer bodies and a mating end extend from the wafer body presented at the mating interface. The mating ends are twisted 45° relative to the main bodies. The mating end of the primary signal contact is arranged at a first side of the main body and the mating end of the secondary signal contact is arranged at a second side of the main body to define a twisted pair interface configured to be mated with the mating signal contacts of the mating electrical connector.

Abstract: An electrical connector includes wafer assemblies coupled to a housing. Each wafer assembly includes a leadframe, a wafer body holding the leadframe, and a ground frame coupled to the wafer body to provide electrical shielding for the leadframe. Each leadframe has signal contacts with mating ends extending from the wafer body for mating with mating signal contacts of a mating electrical connector. The mating ends are twisted 45° to define twisted mating interfaces. Each ground frame has ground shields extending from a ground plate along the mating ends of the signal contacts. The ground shields are twisted 45° relative to the ground plate to define twisted shield zones along the mating ends of the signal contacts.

Abstract: An electrical connector includes a housing holding wafer assemblies in a wafer stack each including a wafer body holding a leadframe with signal contacts arranged in pairs and extending between mating ends and mounting ends. Each pair includes a primary signal contact and a secondary signal contact. Each signal contact has a main body extending through the wafer bodies and a mating end extend from the wafer body presented at the mating interface. The mating ends are twisted 45° relative to the main bodies. The mating end of the primary signal contact is arranged at a first side of the main body and the mating end of the secondary signal contact is arranged at a second side of the main body to define a twisted pair interface configured to be mated with the mating signal contacts of the mating electrical connector.

Abstract: A method includes creating a publisher configured to send messages over a channel having a shared memory. The method includes creating at least one subscriber configured to receive the messages over the channel by sequentially referencing memory slots of the plurality of memory slots. The method includes determining that the next sequential memory slot is currently referenced by a subscriber. The method includes delaying sending the message by the publisher based on determining that the next sequential memory slot is currently referenced by the subscriber. The method includes receiving an event trigger indicative of message reading by the subscriber. The method includes, responsive to receiving the event trigger, determining that the next sequential memory slot is not currently referenced. The method includes sending the message to the next sequential memory slot based on determining that the next sequential memory slot is not currently referenced.

Abstract: A circuit board assembly includes an electrical connector mounted to a circuit board having a connector housing holding contacts in a contact array. A connector mount having a bracket is coupled to the mounting surface of the circuit board proximate to the mating edge. The electrical connector is movably coupled to the connector mount to move relative to the circuit board during mating with the mating electrical connector. The connector mount has a biasing member compressible along a compression axis parallel to the mating direction to allow the electrical connector to float in the mating direction relative to the circuit board. The electrical connector is movably coupled to the connector mount in a confined envelope in at least one floating direction perpendicular to the mating direction.

Abstract: An electrical connector includes wafer assemblies coupled to a housing. Each wafer assembly includes a leadframe, a wafer body holding the leadframe, and a ground frame coupled to the wafer body to provide electrical shielding for the leadframe. Each leadframe has signal contacts with mating ends extending from the wafer body for mating with mating signal contacts of a mating electrical connector. The mating ends are twisted 45° to define twisted mating interfaces. Each ground frame has ground shields extending from a ground plate along the mating ends of the signal contacts. The ground shields are twisted 45° relative to the ground plate to define twisted shield zones along the mating ends of the signal contacts.

Abstract: A circuit board assembly includes a circuit board and an electrical connector having a connector housing holding contacts in a contact array. The connector housing has a mating end configured to be mated with a mating electrical connector in a mating direction. The electrical connector has cables terminated to the contacts and extending from a cable end. A connector mount is used to locate the electrical connector relative to the circuit board. A bracket is coupled to the mounting surface of the circuit board. A biasing member is coupled to the bracket and the mounting feature and is compressible along a compression axis parallel to the mating direction to allow the electrical connector to float in the mating direction relative to the circuit board.

Abstract: Provided according to embodiments of the invention are methods of disrupting, removing, and/or preventing biofilm formation on a surface. Such methods use compositions that include nanoparticles and/or microparticles that include an inert liquid and/or gas core surrounded by an enclosing substance. Further provided according to embodiments of the invention are methods for disrupting a biofilm to extract an analyte from a sample, methods of disrupting superficial dermal layers, and methods of disrupting, removing, and/or preventing biofilms in hydroponic systems, microbial fuel cells, and on agricultural products.

Abstract: A method includes creating a publisher configured to send messages over a channel having a shared memory. The method includes creating at least one subscriber configured to receive the messages over the channel by sequentially referencing memory slots of the plurality of memory slots. The method includes determining that the next sequential memory slot is currently referenced by a subscriber. The method includes delaying sending the message by the publisher based on determining that the next sequential memory slot is currently referenced by the subscriber. The method includes receiving an event trigger indicative of message reading by the subscriber. The method includes, responsive to receiving the event trigger, determining that the next sequential memory slot is not currently referenced. The method includes sending the message to the next sequential memory slot based on determining that the next sequential memory slot is not currently referenced.

Abstract: A method includes creating a publisher configured to send messages over a channel having a shared memory. The method includes creating at least one subscriber configured to receive the messages over the channel by sequentially referencing memory slots of the plurality of memory slots. The method includes determining that the next sequential memory slot is currently referenced by a subscriber. The method includes delaying sending the message by the publisher based on determining that the next sequential memory slot is currently referenced by the subscriber. The method includes receiving an event trigger indicative of message reading by the subscriber. The method includes, responsive to receiving the event trigger, determining that the next sequential memory slot is not currently referenced. The method includes sending the message to the next sequential memory slot based on determining that the next sequential memory slot is not currently referenced.

Abstract: A header assembly includes a header housing and contact modules coupled to the header housing each having a frame assembly with a signal leadframe and a dielectric frame. The dielectric frame includes mating portion extensions at a front of the dielectric frame. The signal leadframe includes mating portions extending forward from the mating portion extensions. Each contact module includes a ground shield having ground shrouds providing electrical shielding for the mating portions. Each ground shroud includes shroud walls forming a shroud cavity receiving the corresponding mating portion extension. Each ground shroud includes a shroud transition to vary a depth of the shroud cavity along a length of the ground shroud.

Abstract: A header assembly includes a header housing and contact modules coupled to the header housing each having a frame assembly with a signal leadframe and a dielectric frame. The dielectric frame includes mating portion extensions at a front of the dielectric frame. The signal leadframe includes mating portions extending forward from the mating portion extensions. Each contact module includes a ground shield having ground shrouds providing electrical shielding for the mating portions. Each ground shroud includes shroud walls forming a shroud cavity receiving the corresponding mating portion extension. Each ground shroud includes a shroud transition to vary a depth of the shroud cavity along a length of the ground shroud.

Abstract: A header assembly includes a header housing having a header cavity. The header assembly includes header signal contacts received in corresponding signal contact channels having mating ends arranged in the header cavity for mating with the receptacle assembly. The header assembly includes header ground contacts received in corresponding ground contact channels. Each header ground contact includes shield walls forming a shield cavity receiving header signal contacts to provide electrical shielding for the header signal contacts. The shield walls include an end wall extending between first and second side walls. Each header ground contact includes a mating protrusion that extends outward relative to the shield cavity from the corresponding shield wall. The mating protrusion is configured to engage a conductive insert of the receptacle assembly used to electrically common each of the header ground contacts.