Abstract: An interposer chip providing translation of data between DASL and Unilink protocols and operating in one of the line card mode or switch card mode is provided. Additionally, it provides compatibility of Unilink ports with EQ switch fabric, sub-port flow control and capability of DASL ports to support individual ports and link parallel ports.

Abstract: An interconnection module for holding and interconnecting optoelectronic cards is provided. It includes an optical midplane which accommodates and flexibly interconnects N optoelectronic cards on one side of the midplane and M cards on the other side of the midplane. Optical connectors, which are arranged on the midplane and on the cards, provide arrangement of cards on the midplane in one of the two positions, in the first position the cards on opposite sides of the midplane being parallel to each other, and in the second position the cards being perpendicular to each other. Preferably, each of the N cards on one side is connected to a subset of cards on the other side, the number of cards in the subset being variable for each of the N cards and less or equal to M in total. Additionally, a backplane section of the module, having a plurality of connectors joined via laminated strands, may be added as an extension of the midplane to interconnect any required number of cards on same side of the midplane.

Abstract: An interconnection module for holding and interconnecting optoelectronic cards is provided. It includes an optical midplane which accommodates and flexibly interconnects N optoelectronic cards on one side of the midplane and M cards on the other side of the midplane. Optical connectors, which are arranged on the midplane and on the cards, provide arrangement of cards on the midplane in one of the two positions, in the first position the cards on opposite sides of the midplane being parallel to each other, and in the second position the cards being perpendicular to each other. Preferably, each of the N cards on one side is connected to a subset of cards on the other side, the number of cards in the subset being variable for each of the N cards and less or equal to M in total. Additionally, a backplane section of the module, having a plurality of connectors joined via laminated strands, may be added as an extension of the midplane to interconnect any required number of cards on same side of the midplane.