Patents by Inventor David Angst

David Angst has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170096624
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Application
    Filed: December 19, 2016
    Publication date: April 6, 2017
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prema Sonthalia, Emanuel Cooper, Karl Boggs
  • Patent number: 9528078
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: December 27, 2016
    Assignee: Advanced Technology Materials, Inc.
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
  • Publication number: 20140206588
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Application
    Filed: March 25, 2014
    Publication date: July 24, 2014
    Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
  • Patent number: 8685909
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: April 1, 2014
    Assignee: Advanced Technology Materials, Inc.
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
  • Publication number: 20090239777
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Application
    Filed: March 23, 2009
    Publication date: September 24, 2009
    Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
  • Patent number: RE46427
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: June 6, 2017
    Assignee: Entegris, Inc.
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs