Patents by Inventor David Anthony Miller

David Anthony Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for risk tracking
    Patent number: 11922352
    Abstract: Disclosed are systems and methods for facilitating identification of risk across risk silos in an organization. Machine learning utilizes risk identification data from two or more silos to identify risk associated with electronic change requests provided to the system. Regulatory/compliance results are submitted to a blockchain for immutable recordation of compliance status.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: March 5, 2024
    Assignee: United Services Automobile Association (USAA)
    Inventors: Yevgeniy Viatcheslavovich Khmelev, Susan Elizabeth Wright, David M. Jones, Jr., Michael Anthony Miller
  • Systems and methods for manufacturing stacked circuits and transmission lines
    Patent number: 10511073
    Abstract: Devices and methods for manufacturing RF circuits and systems in both passive and active forms are contemplated herein. Exemplary devices include 3D electrical and mechanical structures which are created from individual slices which may be assembled to create a final functional block such as a circuit, component or a system. The slices may fabricated by a variety of manufacturing techniques, such as micromachined layer-by-layer metal batch processing.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: December 17, 2019
    Assignee: CUBIC CORPORATION
    Inventors: David Anthony Miller, Hooman Kazemi, Ankush Mohan, Yoonyoung Jin
  • SYSTEMS AND METHODS FOR MANUFACTURING STACKED CIRCUITS AND TRANSMISSION LINES
    Publication number: 20180026324
    Abstract: Devices and methods for manufacturing RF circuits and systems in both passive and active forms are contemplated herein. Exemplary devices include 3D electrical and mechanical structures which are created from individual slices which may be assembled to create a final functional block such as a circuit, component or a system. The slices may fabricated by a variety of manufacturing techniques, such as micromachined layer-by-layer metal batch processing.
    Type: Application
    Filed: December 1, 2015
    Publication date: January 25, 2018
    Inventors: David Anthony Miller, Hooman Kazemi, Ankush Mohan, Yoonyoung Jin