Patents by Inventor David B. Ackard

David B. Ackard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6838636
    Abstract: A method of welding two silicon workpieces (20, 22) together into one member without the formation of cracks along the weld. A first method passes current (34, 36) through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. A second method passing current (34) through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
    Type: Grant
    Filed: June 18, 2003
    Date of Patent: January 4, 2005
    Assignee: Integrated Materials, Inc.
    Inventors: Raanan Y. Zehavi, Robert L. Davis, David B. Ackard, James W. Govorko
  • Publication number: 20030213785
    Abstract: A method of welding two silicon workpieces (20, 22) together into one member without the formation of cracks along the weld. A first method passes current (34, 36) through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. A second method passing current (34) through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
    Type: Application
    Filed: June 18, 2003
    Publication date: November 20, 2003
    Inventors: Raanan Y. Zehavi, Robert L. Davis, David B. Ackard, James W. Govorko
  • Patent number: 6583377
    Abstract: Two silicon workpieces (20, 22) welded together into one member without the formation of cracks along the weld. It may be formed by a first method in which current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second forming method, current (34) is passed through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: June 24, 2003
    Assignee: Integrated Materials, Inc.
    Inventors: Raanan Y. Zehavi, Robert L. Davis, David B. Ackard, James W. Govorko
  • Publication number: 20030089688
    Abstract: Two silicon workpieces (20, 22) welded together into one member without the formation of cracks along the weld. It may be formed by a first method in which current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second forming method, current (34) is passed through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
    Type: Application
    Filed: April 30, 2002
    Publication date: May 15, 2003
    Inventors: Raanan Y. Zehavi, Robert L. Davis, David B. Ackard, James W. Govorko
  • Patent number: 6403914
    Abstract: A method and apparatus for welding together two silicon workpieces (20, 22) without the formation of cracks along the weld. In a first embodiment, current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second embodiment, current (34) is passed through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: June 11, 2002
    Assignee: Integrated Materials, Inc.
    Inventors: Raanan Y. Zehavi, Robert L. Davis, David B. Ackard, James W. Govorko
  • Publication number: 20020053558
    Abstract: A method and apparatus for welding together two silicon workpieces (20, 22) without the formation of cracks along the weld. In a first embodiment, current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second embodiment, current (34) is passed through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
    Type: Application
    Filed: June 12, 2001
    Publication date: May 9, 2002
    Inventors: Raanan Y. Zehavi, Robert L. Davis, David B. Ackard, James W. Govorko
  • Patent number: 6284997
    Abstract: A method and apparatus for welding together two silicon workpieces (20, 22) without the formation of cracks along the weld. In a first embodiment, current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second embodiment, current (34) is passed through a silicon plate (60) which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
    Type: Grant
    Filed: November 8, 2000
    Date of Patent: September 4, 2001
    Assignee: Integrated Materials, Inc.
    Inventors: Raanan Y. Zehavi, Robert L. Davis, David B. Ackard, James W. Govorko