Abstract: The present invention provides, in one embodiment, a semiconductor wafer (100) dicing process. The dicing process comprises removing circuit features (120) from a street (115) located between dies (105) on a semiconductor substrate (102) using a first blade (135), such that the semiconductor substrate is exposed, and cutting through the exposed semiconductor substrate using a second blade (190). The first blade has a surface (140) coated with an abrasive material (145) comprising grit particles (150), having a median diameter (155) of at least about 25 microns. The grit particles are adhered to the first blade with a bonding agent (160) having a hardness of about 80 or less (Rockwell B Hardness scale). The grit particles have a concentration in the bonding agent ranging from about 25 to about 50 vol %. Another embodiment of the invention is a method of manufacturing a semiconductor device (200).

Abstract: An improved dicing wheel configuration is described herein. In one embodiment, the dicing wheel comprises: a hub, a blade, and an annular support. The hub is mounted on a shaft, and it clasps the blade. The annular support is compressed against the blade by the hub, and it has an outer diameter intermediate the outer diameters of the hub and the blade. A second annular support may also be compressed against the blade on the opposite side from the first annular support, and the annular support(s) may be separable from or bonded to the blade. The improved configuration preferably provides sufficient clearance for the hub to pass over solder bumps, stacked dies, or other protrusions on the wafer. The invention further contemplates methods for forming and using such a dicing wheel, as well as chips cut using such a dicing wheel.

Abstract: A dicing saw blade assembly with parallel blades separated by a spacer and attached to a single spindle on an automated dicing saw, is applicable to precisely separating CSP or MCM devices which have been fabricated on a polymeric substrate. Two parallel cuts are made simultaneously in the scribe streets of the substrate to separate the flip chip devices. The substrates are diced from the bottom side, thereby allowing use of thin blades for separating devices having relatively thick chips, as well as chips with attached heat spreaders.