Patents by Inventor DAVID B. NICOL

DAVID B. NICOL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
    Patent number: 9691698
    Abstract: A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: June 27, 2017
    Assignee: HARRIS CORPORATION
    Inventors: Michael Raymond Weatherspoon, David B. Nicol, Louis Joseph Rendek, Jr.
  • METHOD OF TRANSFERRING AND ELECTRICALLY JOINING A HIGH DENSITY MULTILEVEL THIN FILM TO A CIRCUITIZED AND FLEXIBLE ORGANIC SUBSTRATE AND ASSOCIATED DEVICES
    Publication number: 20160322284
    Abstract: A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.
    Type: Application
    Filed: July 8, 2016
    Publication date: November 3, 2016
    Inventors: MICHAEL RAYMOND WEATHERSPOON, DAVID B. NICOL, LOUIS JOSEPH RENDEK, JR.
  • Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
    Patent number: 9420687
    Abstract: A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: August 16, 2016
    Assignee: HARRIS CORPORATION
    Inventors: Michael Raymond Weatherspoon, David B. Nicol, Louis Joseph Rendek, Jr.
  • METHOD OF TRANSFERRING AND ELECTRICALLY JOINING A HIGH DENSITY MULTILEVEL THIN FILM TO A CIRCUITIZED AND FLEXIBLE ORGANIC SUBSTRATE AND ASSOCIATED DEVICES
    Publication number: 20140376197
    Abstract: A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.
    Type: Application
    Filed: September 11, 2014
    Publication date: December 25, 2014
    Inventors: MICHAEL RAYMOND WEATHERSPOON, DAVID B. NICOL, LOUIS JOSEPH RENDEK, JR.