Patents by Inventor David B. Rear

David B. Rear has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electro deposition chemistry
    Publication number: 20030205474
    Abstract: The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.
    Type: Application
    Filed: April 9, 2003
    Publication date: November 6, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Uziel Landau, John J. D'Urso, David B. Rear
  • Electro deposition chemistry
    Patent number: 6610191
    Abstract: The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: August 26, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Uziel Landau, John J. D'Urso, David B. Rear
  • Electro deposition chemistry
    Publication number: 20020063064
    Abstract: The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.
    Type: Application
    Filed: November 13, 2001
    Publication date: May 30, 2002
    Applicant: Applied Materials, Inc.
    Inventors: Uziel Landau, John J. D'Urso, David B. Rear
  • Electro deposition chemistry
    Patent number: 6350366
    Abstract: The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, ie., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: February 26, 2002
    Assignee: Applied Materials, Inc.
    Inventors: Uziel Landau, John J. D'Urso, David B. Rear
  • Electro deposition chemistry
    Patent number: 6113771
    Abstract: The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.
    Type: Grant
    Filed: July 13, 1998
    Date of Patent: September 5, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Uziel Landau, John J. D'Urso, David B. Rear