Abstract: A heat transfer loop system includes a primary passive two-phase flow segment with an evaporator, a condenser and a liquid reservoir, and a secondary actively pumped liquid flow segment in which the liquid in the reservoir is drawn by a liquid pump into the evaporator, where a portion of the liquid is vaporized by the heat input and moves into the primary segment while the excess liquid is pumped back to the reservoir. The evaporator consists of a porous wick and one or more liquid arteries encased in the porous wick. The liquid arteries have porous walls to allow liquid phase working fluid to flow into the surrounding porous wick. The liquid arteries have porous walls to allow liquid phase working fluid to flow into the surrounding porous wick. The excess liquid continues to move through the arteries and eventually out of the evaporator and into the reservoir. The porous wick provides sufficient capillary force to separate the liquid inside the arteries and the vapor in the evaporator.

Abstract: A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.

Abstract: A heat pipe assembly includes a base plate and a corrugated lid joined to the base plate to form a plurality of tubes between the base plate and the corrugated lid. Each of the plurality of tubes forms an envelope of a respective heat pipe within the heat pipe assembly. The heat pipe assembly may be included in a fuel cell stack.

Abstract: An assembly includes a heat pipe and one or more fins. The heat pipe has an envelope with two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than the radius of curvature of the curved portions. Each fin comprises a plate. The plate has a hole through it. The hole is sized to accommodate the envelope. The hole has two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than a radius of curvature of the curved portions. The plate has at least one collar portion adjacent to the hole. The collar portion extends approximately in a direction normal to the plate. The collar portion is sized so as to accommodate the method of attachment of the fin to the envelope.

Abstract: An assembly includes a heat pipe and one or more fins. The heat pipe has an envelope with two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than the radius of curvature of the curved portions. Each fin comprises a plate. The plate has a hole through it. The hole is sized to accommodate the envelope. The hole has two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than a radius of curvature of the curved portions. The plate has at least one collar portion adjacent to the hole. The collar portion extends approximately in a direction normal to the plate. The collar portion is sized so as to accommodate the method of attachment of the fin to the envelope.

Abstract: An assembly includes a heat pipe and one or more fins. The heat pipe has an envelope with two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than the radius of curvature of the curved portions. Each fin comprises a plate. The plate has a hole through it. The hole is sized to accommodate the envelope. The hole has two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than a radius of curvature of the curved portions. The plate has at least one collar portion adjacent to the hole. The collar portion extends approximately in a direction normal to the plate. The collar portion is sized so as to accommodate the method of attachment of the fin to the envelope.

Abstract: A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.

Abstract: A heat pipe assembly includes a base plate and a corrugated lid joined to the base plate to form a plurality of tubes between the base plate and the corrugated lid. Each of the plurality of tubes forms an envelope of a respective heat pipe within the heat pipe assembly. The heat pipe assembly may be included in a fuel cell stack.

Abstract: An assembly includes a heat pipe and one or more fins. The heat pipe has an envelope with two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than the radius of curvature of the curved portions. Each fin comprises a plate. The plate has a hole through it. The hole is sized to accommodate the envelope. The hole has two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than a radius of curvature of the curved portions. The plate has at least one collar portion adjacent to the hole. The collar portion extends approximately in a direction normal to the plate. The collar portion is sized so as to accommodate the method of attachment of the fin to the envelope.

Abstract: A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.

Abstract: The invention is a very flexible heat pipe which is constructed of multiple layers of material laminated into the final structure. The center of the symmetrical structure is a coarse screen which creates a vapor space. The layers on either side of the screen are copper felt pads, and the outer casing is two layers of metal foil and a layer of polypropylene. The heat pipe constructed in this manner is so a flexible that when one outside surface is covered with adhesive, the heat pipe can essentially be used as tape or a stick-on heat transfer surface which conforms to a body being cooled.

Abstract: The invention is an integrated circuit cooler in which a heat spreader is mounted atop a weight sensitive integrated circuit package, and at least one heat pipe is attached to the heat spreader and to a cooling fin assembly remote from the heat spreader. To accommodate to the tolerances, the potential tilt of the installed integrated circuit package, and the weight of the fins, the heat spreader is mounted on the integrated circuit package using springs on posts attached to the circuit mounting board, and the heat pipe has an annealed section of the casing located between the heat spreader and the fins to relieve the potential stress on the thermal connection or the integrated circuit package. Another feature of the assembly is that the fins are mounted on the heat pipe using only spring clamps formed into the fins.

Abstract: The apparatus is a selective radiation emitter to be used in conjunction with a photocell for thermophotovoltaic generation of electricity from heat. One embodiment of the emitter is a layer of selectively radiating rare earth oxide bonded onto a heated base metal layer by the use of an intermediate thin layer of porous metal powder. Another embodiment is an emitter of a thick metal powder layer combined with a rare earth oxide which is formed into the voids in the metal powder structure and bonded to a metal substrate which is to be heated. In this embodiment the metal powder grains are gold plated to limit their emissivity, so that emission outside the desired band of the rare earth oxide is greatly reduced.

Abstract: The apparatus is a rapid response evaporator for material deposition in vapor. The structure is a vessel which is heated to a temperature just above the melting temperature of the liquid which it contains. Inserted into the heated liquid is a funnel shaped evaporator structure in which the vertical tube is a capillary structure to raise the heated liquid from the vessel. The upper diverging portion of the evaporator contains a porous capillary interior coating in contact with the capillary tube, and the exterior is independently heated. Because of the low thermal mass of the upper portion of the evaporator and the liquid in its capillary structure, it can respond to heat changes quickly enough to rapidly vary the rate of evaporation and the thickness of the deposited coating.

Abstract: A heat transfer surface structure for cooling high power density surfaces and the method of constructing it. The surface includes a sintered capillary layer with a complex configuration of tunnels within it constructed adjacent to the heated surface which is subject to very high power densities. The tunnel arteries serve to supply evaporable liquid and remove vapor to provide the cooling. A unique method of constructing the tunneled sintered layer is also described.