Abstract: High temperature superconductor (HTS)-based interconnect systems comprising a cable including HTS-based interconnects are described. Each of the HTS-based interconnects includes a first portion extending from a first end towards an intermediate portion and a second portion extending from the intermediate portion to a second end. Each of the HTS-based interconnects includes a substrate layer formed in the first portion, in the intermediate portion, and in the second portion, a high temperature superconductor layer formed in at least a sub-portion of the first portion, in the intermediate portion, and in the second portion, and a metallic layer formed in the first portion and in at least a sub-portion of the intermediate portion. The HTS-based interconnect system includes a thermal load management system configured to maintain the intermediate portion of each of the HTS-based interconnects at a predetermined temperature in a range between a temperature of 60 kelvin and 92 kelvin.

Abstract: High temperature superconductor (HTS)-based interconnect systems comprising a cable including HTS-based interconnects are described. Each of the HTS-based interconnects includes a first portion extending from a first end towards an intermediate portion and a second portion extending from the intermediate portion to a second end. Each of the HTS-based interconnects includes a substrate layer formed in the first portion, in the intermediate portion, and in the second portion, a high temperature superconductor layer formed in at least a sub-portion of the first portion, in the intermediate portion, and in the second portion, and a metallic layer formed in the first portion and in at least a sub-portion of the intermediate portion. The HTS-based interconnect system includes a thermal load management system configured to maintain the intermediate portion of each of the HTS-based interconnects at a predetermined temperature in a range between a temperature of 60 kelvin and 92 kelvin.

Abstract: A cryogenic multilayer interconnect structure has a substrate including a molybdenum layer, a first insulating layer on the substrate and a first superconducting layer on the first insulating layer. The molybdenum layer has a coefficient of thermal expansion (CTE) that is well matched with the CTE of cryogenic electronic chips that are to be attached to the cryogenic multilayer interconnect structure. The substrate may be a copper clad molybdenum substrate that provide the CTE advantages provided by the molybdenum layer while also providing an increased thermal conductivity to improve the dissipation of heat generated by cryogenic electronic chips coupled to the substrate.

Abstract: One embodiment includes a computer interconnect system. The system includes a first cable comprising a first superconducting signal line formed from a superconductor material to propagate at least one signal and a second cable comprising a second superconducting signal line formed from the superconductor material to propagate the respective at least one signal. The system also includes an interconnect structure configured to contact each of the first and second cable and comprising a third superconducting signal line formed from the superconductor material and configured to propagate the respective at least one signal between the respective first and second superconducting signal line. The system further includes at least one interconnect contact disposed on the first, second, and third at least one superconducting signal line at a contact portion between each of the at least one first and third superconducting signal lines and the at least second and third superconducting signal lines.

Abstract: Methods and structures corresponding to superconducting apparatus including superconducting layers and traces are provided. A method for forming a superconducting apparatus includes forming a first dielectric layer on a substrate by depositing a first dielectric material on the substrate and curing the first dielectric material at a first temperature. The method further includes forming a first superconducting layer comprising a first set of patterned superconducting traces on the first dielectric layer. The method further includes forming a second dielectric layer on the first superconducting layer by depositing a second dielectric material on the first superconducting layer and curing the second dielectric material at a second temperature, where the second temperature is lower than the first temperature. The method further includes forming a second superconducting layer comprising a second set of patterned superconducting traces on the second dielectric layer.

Abstract: Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.

Abstract: Methods and structures corresponding to superconducting apparatus including superconducting layers and traces are provided. A method for forming a superconducting apparatus includes forming a first dielectric layer on a substrate by depositing a first dielectric material on the substrate and curing the first dielectric material at a first temperature. The method further includes forming a first superconducting layer comprising a first set of patterned superconducting traces on the first dielectric layer. The method further includes forming a second dielectric layer on the first superconducting layer by depositing a second dielectric material on the first superconducting layer and curing the second dielectric material at a second temperature, where the second temperature is lower than the first temperature. The method further includes forming a second superconducting layer comprising a second set of patterned superconducting traces on the second dielectric layer.

Abstract: Methods and structures corresponding to superconducting apparatus including superconducting layers and traces are provided. A method for forming a superconducting apparatus includes forming a first dielectric layer on a substrate by depositing a first dielectric material on the substrate and curing the first dielectric material at a first temperature. The method further includes forming a first superconducting layer comprising a first set of patterned superconducting traces on the first dielectric layer. The method further includes forming a second dielectric layer on the first superconducting layer by depositing a second dielectric material on the first superconducting layer and curing the second dielectric material at a second temperature, where the second temperature is lower than the first temperature. The method further includes forming a second superconducting layer comprising a second set of patterned superconducting traces on the second dielectric layer.

Abstract: Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.

Abstract: Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.

Abstract: Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.

Abstract: A method of customizing hardware by an end user for a mobile phone is provided. The method includes receiving from an end-user a selection of a mobile phone shell from a set of mobile phone shells, sending to the end-user a subset of interchangeable hardware components having different functions, and receiving from the end-user a selection of at least one hardware component from the subset of interchangeable hardware components. The subset of interchangeable hardware components is generated based on a compatibility between the selected mobile phone shell and the set of available interchangeable hardware components.

Abstract: A helmet testing apparatus includes a sensor configured to be selectively positionable within an interior head cavity of a helmet to acquire compliance data regarding a liner of the helmet and a processing circuit configured to determine a rating for the helmet based on the compliance data and predetermined compliance parameters for the helmet.

Abstract: A system for monitoring a building having one or more microphones coupled to a telephone includes a detector configured to detect a triggering event within the building and transmit an activating signal when the triggering event is detected, and a control module configured to receive the activating signal from the detector. The control module is programmed to activate at least one of the one or more microphones to monitor sound when the activating signal is received.

Abstract: Methods and structures corresponding to superconducting apparatus including superconducting layers and traces are provided. A method for forming a superconducting apparatus includes forming a first dielectric layer on a substrate by depositing a first dielectric material on the substrate and curing the first dielectric material at a first temperature. The method further includes forming a first superconducting layer comprising a first set of patterned superconducting traces on the first dielectric layer. The method further includes forming a second dielectric layer on the first superconducting layer by depositing a second dielectric material on the first superconducting layer and curing the second dielectric material at a second temperature, where the second temperature is lower than the first temperature. The method further includes forming a second superconducting layer comprising a second set of patterned superconducting traces on the second dielectric layer.

Abstract: Described embodiments include a self-propelled vehicle, method, and system. The self-propelled vehicle includes an autonomous driving system configured to dynamically determine maneuvers operating the vehicle along a route in an automated mode without continuous input from a human driver. The vehicle includes an input device configured to receive a real-time request for a specific dynamic maneuver by the vehicle operating along the route from the human driver. The vehicle includes a decision circuit configured to select a real-time dynamic maneuver by arbitrating between (i) the received real-time request for the specific dynamic maneuver from the human driver and (ii) a real-time determination relative to the specific dynamic maneuver received from the autonomous driving system. The vehicle includes an implementation circuit configured to output the selected real-time dynamic maneuver to an operations system of the vehicle.

Abstract: A helmet testing apparatus including a movable member, a sensor coupled to the movable member and configured to acquire compliance data regarding a liner disposed within a shell of a helmet through engagement of the sensor with the liner, and a processing circuit configured to determine a rating for the helmet based on the compliance data and predetermined compliance parameters for the helmet.

Abstract: A system for monitoring a building having one or more microphones coupled to a telephone includes a detector configured to detect a triggering event within the building and transmit an activating signal when the triggering event is detected, and a control module configured to receive the activating signal from the detector. The control module is programmed to activate at least one of the one or more microphones to monitor sound when the activating signal is received.

Abstract: Described embodiments include a self-propelled vehicle, method, and system. The self-propelled vehicle includes an autonomous driving system configured to dynamically determine maneuvers operating the vehicle along a route in an automated mode without continuous input from a human driver. The vehicle includes an input device configured to receive a real-time request for a specific dynamic maneuver by the vehicle operating along the route from the human driver. The vehicle includes a decision circuit configured to select a real-time dynamic maneuver by arbitrating between (i) the received real-time request for the specific dynamic maneuver from the human driver and (ii) a real-time determination relative to the specific dynamic maneuver received from the autonomous driving system. The vehicle includes an implementation circuit configured to output the selected real-time dynamic maneuver to an operations system of the vehicle.

Abstract: An interconnect may have a first end coupled to a superconducting system and a second end coupled to a non-superconducting system. The interconnect may include a superconducting element having a critical temperature. During operation of the superconducting system and the non-superconducting system, a first portion of the interconnect near the first end may have a first temperature equal to or below the critical temperature of the superconducting element, a second portion of the interconnect near the second end may have a second temperature above the critical temperature of the superconducting element, and the interconnect may further be configured to reduce a length of the second portion such that temperature substantially over an entire length of the interconnect is maintained at a temperature equal to or below the critical temperature of the superconducting element.