Patents by Inventor David B. Tuckerman

David B. Tuckerman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10763013
    Abstract: Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: September 1, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Burton J. Smith, David B. Tuckerman
  • Publication number: 20200243743
    Abstract: Methods and structures corresponding to superconducting apparatus including superconducting layers and traces are provided. A method for forming a superconducting apparatus includes forming a first dielectric layer on a substrate by depositing a first dielectric material on the substrate and curing the first dielectric material at a first temperature. The method further includes forming a first superconducting layer comprising a first set of patterned superconducting traces on the first dielectric layer. The method further includes forming a second dielectric layer on the first superconducting layer by depositing a second dielectric material on the first superconducting layer and curing the second dielectric material at a second temperature, where the second temperature is lower than the first temperature. The method further includes forming a second superconducting layer comprising a second set of patterned superconducting traces on the second dielectric layer.
    Type: Application
    Filed: April 7, 2020
    Publication date: July 30, 2020
    Inventors: Richard P. Rouse, David B. TUCKERMAN
  • Patent number: 10651362
    Abstract: Methods and structures corresponding to superconducting apparatus including superconducting layers and traces are provided. A method for forming a superconducting apparatus includes forming a first dielectric layer on a substrate by depositing a first dielectric material on the substrate and curing the first dielectric material at a first temperature. The method further includes forming a first superconducting layer comprising a first set of patterned superconducting traces on the first dielectric layer. The method further includes forming a second dielectric layer on the first superconducting layer by depositing a second dielectric material on the first superconducting layer and curing the second dielectric material at a second temperature, where the second temperature is lower than the first temperature. The method further includes forming a second superconducting layer comprising a second set of patterned superconducting traces on the second dielectric layer.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: May 12, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Richard P. Rouse, David B. Tuckerman
  • Publication number: 20190341174
    Abstract: Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 7, 2019
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Burton J. Smith, David B. Tuckerman
  • Publication number: 20190341173
    Abstract: Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.
    Type: Application
    Filed: May 7, 2018
    Publication date: November 7, 2019
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Burton J. Smith, David B. Tuckerman
  • Patent number: 10453592
    Abstract: Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: October 22, 2019
    Assignee: Microsoft Technology Licensing LLC
    Inventors: Burton J. Smith, David B. Tuckerman
  • Patent number: 10348884
    Abstract: A method of customizing hardware by an end user for a mobile phone is provided. The method includes receiving from an end-user a selection of a mobile phone shell from a set of mobile phone shells, sending to the end-user a subset of interchangeable hardware components having different functions, and receiving from the end-user a selection of at least one hardware component from the subset of interchangeable hardware components. The subset of interchangeable hardware components is generated based on a compatibility between the selected mobile phone shell and the set of available interchangeable hardware components.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: July 9, 2019
    Assignee: Elwha LLC
    Inventors: Alistair K. Chan, Philip A. Eckhoff, Roderick A. Hyde, Jordin T. Kare, David B. Tuckerman, Lowell L. Wood, Jr.
  • Publication number: 20190145877
    Abstract: A helmet testing apparatus includes a sensor configured to be selectively positionable within an interior head cavity of a helmet to acquire compliance data regarding a liner of the helmet and a processing circuit configured to determine a rating for the helmet based on the compliance data and predetermined compliance parameters for the helmet.
    Type: Application
    Filed: December 19, 2018
    Publication date: May 16, 2019
    Applicant: Elwha LLC
    Inventors: Alistair K. Chan, Geoffrey F. Deane, William D. Duncan, Philip A. Eckhoff, Bran Ferren, William Gates, W. Daniel Hillis, Roderick A. Hyde, Muriel Y. Ishikawa, Edward K.Y. Jung, Jordin T. Kare, John Latham, Max N. Mankin, Nathan P. Myhrvold, Robert C. Petroski, Clarence T. Tegreene, David B. Tuckerman, Thomas A. Weaver, Charles Whitmer, Lowell L. Wood, JR., Victoria Y.H. Wood
  • Publication number: 20190124207
    Abstract: A system for monitoring a building having one or more microphones coupled to a telephone includes a detector configured to detect a triggering event within the building and transmit an activating signal when the triggering event is detected, and a control module configured to receive the activating signal from the detector. The control module is programmed to activate at least one of the one or more microphones to monitor sound when the activating signal is received.
    Type: Application
    Filed: December 20, 2018
    Publication date: April 25, 2019
    Inventors: EDWARD S. BOYDEN, JESSE R. CHEATHAM, III, WILLIAM D. DUNCAN, BRAN FERREN, RODERICK A. HYDE, MURIEL Y. ISHIKAWA, JORDIN T. KARE, STEPHEN L. MALASKA, NATHAN P. MYHRVOLD, DAVID B. TUCKERMAN, LOWELL L. WOOD, Jr.
  • Publication number: 20190097118
    Abstract: Methods and structures corresponding to superconducting apparatus including superconducting layers and traces are provided. A method for forming a superconducting apparatus includes forming a first dielectric layer on a substrate by depositing a first dielectric material on the substrate and curing the first dielectric material at a first temperature. The method further includes forming a first superconducting layer comprising a first set of patterned superconducting traces on the first dielectric layer. The method further includes forming a second dielectric layer on the first superconducting layer by depositing a second dielectric material on the first superconducting layer and curing the second dielectric material at a second temperature, where the second temperature is lower than the first temperature. The method further includes forming a second superconducting layer comprising a second set of patterned superconducting traces on the second dielectric layer.
    Type: Application
    Filed: September 26, 2017
    Publication date: March 28, 2019
    Inventors: Richard P. Rouse, David B. Tuckerman
  • Publication number: 20190072956
    Abstract: Described embodiments include a self-propelled vehicle, method, and system. The self-propelled vehicle includes an autonomous driving system configured to dynamically determine maneuvers operating the vehicle along a route in an automated mode without continuous input from a human driver. The vehicle includes an input device configured to receive a real-time request for a specific dynamic maneuver by the vehicle operating along the route from the human driver. The vehicle includes a decision circuit configured to select a real-time dynamic maneuver by arbitrating between (i) the received real-time request for the specific dynamic maneuver from the human driver and (ii) a real-time determination relative to the specific dynamic maneuver received from the autonomous driving system. The vehicle includes an implementation circuit configured to output the selected real-time dynamic maneuver to an operations system of the vehicle.
    Type: Application
    Filed: November 1, 2018
    Publication date: March 7, 2019
    Inventors: ALISTAIR K. CHAN, JESSE R. CHEATHAM, III, HON WAH CHIN, WILLIAM DAVID DUNCAN, RODERICK A. HYDE, DAVID B. TUCKERMAN, THOMAS ALLAN WEAVER
  • Patent number: 10184867
    Abstract: A helmet testing apparatus including a movable member, a sensor coupled to the movable member and configured to acquire compliance data regarding a liner disposed within a shell of a helmet through engagement of the sensor with the liner, and a processing circuit configured to determine a rating for the helmet based on the compliance data and predetermined compliance parameters for the helmet.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: January 22, 2019
    Assignee: Elwha LLC
    Inventors: Alistair K. Chan, Geoffrey F. Deane, William D. Duncan, Philip A. Eckhoff, Bran Ferren, William Gates, W. Daniel Hillis, Roderick A. Hyde, Muriel Y. Ishikawa, Edward K. Y. Jung, Jordin T. Kare, John Latham, Max N. Mankin, Nathan P. Myhrvold, Robert C. Petroski, Clarence T. Tegreene, David B. Tuckerman, Thomas A. Weaver, Charles Whitmer, Lowell L. Wood, Jr., Victoria Y. H. Wood
  • Patent number: 10171677
    Abstract: A system for monitoring a building having one or more microphones coupled to a telephone includes a detector configured to detect a triggering event within the building and transmit an activating signal when the triggering event is detected, and a control module configured to receive the activating signal from the detector. The control module is programmed to activate at least one of the one or more microphones to monitor sound when the activating signal is received.
    Type: Grant
    Filed: October 9, 2017
    Date of Patent: January 1, 2019
    Inventors: Edward S. Boyden, Jesse R. Cheatham, III, William D. Duncan, Bran Ferren, Roderick A. Hyde, Muriel Y. Ishikawa, Jordin T. Kare, Stephen L. Malaska, Nathan P. Myhrvold, David B. Tuckerman, Lowell L. Wood, Jr.
  • Patent number: 10146222
    Abstract: Described embodiments include a self-propelled vehicle, method, and system. The self-propelled vehicle includes an autonomous driving system configured to dynamically determine maneuvers operating the vehicle along a route in an automated mode without continuous input from a human driver. The vehicle includes an input device configured to receive a real-time request for a specific dynamic maneuver by the vehicle operating along the route from the human driver. The vehicle includes a decision circuit configured to select a real-time dynamic maneuver by arbitrating between (i) the received real-time request for the specific dynamic maneuver from the human driver and (ii) a real-time determination relative to the specific dynamic maneuver received from the autonomous driving system. The vehicle includes an implementation circuit configured to output the selected real-time dynamic maneuver to an operations system of the vehicle.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: December 4, 2018
    Inventors: Alistair K. Chan, Jesse R. Cheatham, III, Hon Wah Chin, William David Duncan, Roderick A. Hyde, David B. Tuckerman, Thomas Allan Weaver
  • Patent number: 10141493
    Abstract: An interconnect may have a first end coupled to a superconducting system and a second end coupled to a non-superconducting system. The interconnect may include a superconducting element having a critical temperature. During operation of the superconducting system and the non-superconducting system, a first portion of the interconnect near the first end may have a first temperature equal to or below the critical temperature of the superconducting element, a second portion of the interconnect near the second end may have a second temperature above the critical temperature of the superconducting element, and the interconnect may further be configured to reduce a length of the second portion such that temperature substantially over an entire length of the interconnect is maintained at a temperature equal to or below the critical temperature of the superconducting element.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: November 27, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventor: David B. Tuckerman
  • Patent number: 10136437
    Abstract: An automatically adjustable radiofrequency link system includes a radiofrequency transmitter configured to transmit a signal at a frequency of transmission within an extremely high frequency (EHF) band. The system further includes a receiving device configured to receive the transmitted signal and provide feedback to a processing circuit communicatively coupled to the transmitter and the receiving device, wherein the feedback is related to the received signal. The processing circuit is configured to determine required signal properties based on the feedback and determine signal loss properties including an effect of atmospheric absorption, as a function of frequency; determine a modification to the transmitted signal using the signal loss properties and the required signal properties; and adjust the frequency of transmission to obtain a desired transmission signal using the modification.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: November 20, 2018
    Assignee: Elwha LLC
    Inventors: Jeffrey A. Bowers, Alistair K. Chan, Russell J. Hannigan, Roderick A. Hyde, Jordin T. Kare, Nathan Kundtz, Nathan P. Myhrvold, John Brian Pendry, David R. Smith, Clarence T. Tegreene, David B. Tuckerman, Charles Whitmer, Lowell L. Wood, Jr.
  • Patent number: 10135302
    Abstract: A mobile device includes a shell; a first replaceable hardware component received within the shell; and a second replaceable hardware component received within the shell, the second replaceable hardware component configured to receive a wireless power signal from a remote device and convert the power signal into electrical energy usable by the mobile device.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: November 20, 2018
    Assignee: Elwha LLC
    Inventors: Alistair K. Chan, Philip A. Eckhoff, Roderick A. Hyde, Jordin T. Kare, David B. Tuckerman, Lowell L. Wood, Jr.
  • Patent number: 10119592
    Abstract: A vehicle drivetrain includes a magnetic bearing. The vehicle drivetrain includes a motor configured to provide a rotational driving force. The rotational driving force is received by a shaft, and the magnetic bearing is configured to support the shaft. The shaft is configured to drive a wheel of the vehicle.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: November 6, 2018
    Assignee: Elwha LLC
    Inventors: Geoffrey F. Deane, Philip A. Eckhoff, Bran Ferren, William Gates, W. Daniel Hillis, Roderick A. Hyde, Muriel Y. Ishikawa, Edward K. Y. Jung, Jordin T. Kare, John Latham, Nathan P. Myhrvold, Robert C. Petroski, Clarence T. Tegreene, David B. Tuckerman, Thomas A. Weaver, Charles Whitmer, Lowell L. Wood, Jr., Victoria Y. H. Wood
  • Publication number: 20180294401
    Abstract: An interconnect may have a first end coupled to a superconducting system and a second end coupled to a non-superconducting system. The interconnect may include a superconducting element having a critical temperature. During operation of the superconducting system and the non-superconducting system, a first portion of the interconnect near the first end may have a first temperature equal to or below the critical temperature of the superconducting element, a second portion of the interconnect near the second end may have a second temperature above the critical temperature of the superconducting element, and the interconnect may further be configured to reduce a length of the second portion such that temperature substantially over an entire length of the interconnect is maintained at a temperature equal to or below the critical temperature of the superconducting element.
    Type: Application
    Filed: December 8, 2017
    Publication date: October 11, 2018
    Inventor: David B. Tuckerman
  • Publication number: 20180261932
    Abstract: One embodiment includes a computer interconnect system. The system includes a first cable comprising a first superconducting signal line formed from a superconductor material to propagate at least one signal and a second cable comprising a second superconducting signal line formed from the superconductor material to propagate the respective at least one signal. The system also includes an interconnect structure configured to contact each of the first and second cable and comprising a third superconducting signal line formed from the superconductor material and configured to propagate the respective at least one signal between the respective first and second superconducting signal line. The system further includes at least one interconnect contact disposed on the first, second, and third at least one superconducting signal line at a contact portion between each of the at least one first and third superconducting signal lines and the at least second and third superconducting signal lines.
    Type: Application
    Filed: March 8, 2018
    Publication date: September 13, 2018
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventor: DAVID B. TUCKERMAN