Abstract: A system for dynamic cleaning of remnant material from a product, such as densely packaged electrical assemblies, employs a receptacle for containing cleaning fluid and a rack rotatably mounted in the receptacle for holding the product to be cleaned. The receptacle is divided by an upright transverse wall into first and second reservoirs, with the product being rotatably mounted by the rack in the first reservoir. A pair of conduits having openings facing upwardly toward a side of the product are mounted in the first reservoir adjacent to one another and extend transversely across the receptacle below the product. A blower forces a pressurized flow of a gaseous medium through a first one of the conduits and the openings therein toward the product side, while a pump forces a pressurized flow of cleaning liquid through a second one of the conduits and the openings therein toward the same product side.