Patents by Inventor David B. Wurm

David B. Wurm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10588846
    Abstract: A method for dyeing hair includes applying a polyvinyl amine copolymer solution to the hair; and applying a hair dye composition to the hair. A hair dye composition includes an aqueous base fluid; a polyvinyl amine copolymer; and an anionic or cationic hair dye. A method of making a hair dye composition includes mixing a polyvinyl amine copolymer and an anionic or cationic hair dye into an aqueous base fluid.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: March 17, 2020
    Assignee: Sekisui Specialty Chemicals America, LLC
    Inventor: David B. Wurm
  • Publication number: 20180021239
    Abstract: A method for dyeing hair includes applying a polyvinyl amine copolymer solution to the hair; and applying a hair dye composition to the hair. A hair dye composition includes an aqueous base fluid; a polyvinyl amine copolymer; and an anionic or cationic hair dye. A method of making a hair dye composition includes mixing a polyvinyl amine copolymer and an anionic or cationic hair dye into an aqueous base fluid.
    Type: Application
    Filed: July 19, 2017
    Publication date: January 25, 2018
    Inventor: David B. Wurm
  • Patent number: 9217118
    Abstract: Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: December 22, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Linda Yi-Ping Zhu, Wanglin Yu, Fang Li, Daniel A. Aguilar, David B. Wurm
  • Publication number: 20120214385
    Abstract: Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.
    Type: Application
    Filed: October 16, 2009
    Publication date: August 23, 2012
    Inventors: Linda Yi-Ping Zhu, Wanglin Yu, Fang Li, Daniel A. Aguilar, David B. Wurm
  • Publication number: 20100288167
    Abstract: Provided is a process for preparing low diol content monofunctional polyalkylene glycols. The process includes introducing the initiator feed in two portions (a first and second initiator) and drying only the first initiator to remove water. The first and second initiators can be the same or different. Also provided are new monofunctional polyalkylene glycol compositions.
    Type: Application
    Filed: January 7, 2009
    Publication date: November 18, 2010
    Inventors: David B. Wurm, Robert H. Whitmarsh, Peirre T. Varineau, Bruce A. Barner, John G. Pendergast, JR., Kirk R. Thompson
  • Publication number: 20100286277
    Abstract: A method to enhance solubility of an active compound comprises combining an active compound, having an aqueous solubility that is less than or equal to about 10 mg/mL, and an amount of methoxypolyethylene glycol that is sufficient to increase the aqueous solubility of the active compound. Enhancement of aqueous solubility for this combination may be significantly greater than that of an active compound in combination with an equivalent amount of polyethylene glycol. Particularly enhanced solubility is shown where a small amount of water is also included. The invention may be used in a wide variety of applications, such as for pharmaceutical, agricultural, antimicrobial, and personal care products.
    Type: Application
    Filed: January 5, 2009
    Publication date: November 11, 2010
    Inventors: David B. Wurm, David A. Wilson, Bruce A. Barner, Cynthia L. Rand, Matthew D. Miller, Michael J. Johnson