Abstract: A FOS is provided for electrically connecting a data transfer head with a PCCA. The FOS comprises a polymeric layer supporting an electrical trace. The electrical trace comprises an uninsulated pad surface configured for electrically engaging a solder interconnect of the PCCA. The polymeric layer comprises a continuous portion covering the pad and opposing the pad surface. A method is provided comprising providing the FOS comprising the electrical trace and the polymeric covering, contactingly engaging the pad surface portion of the trace with the solder interconnect portion of the PCCA, and conducting heat through the polymeric covering to reflow the solder interconnect, thereby electrically connecting the FOS to the PCCA.

Abstract: Apparatus and method for adhesively attaching a first member to a second member, such as components of a data storage device. Preferably, an adhesive is applied to the first member and exposed to ultraviolet light. The second member is placed onto the adhesive, and heat is applied to finalize curing. The adhesive is subsequently cooled to a temperature below a glass transition temperature (Tg) of the adhesive to detach the first and second members. Respective mating surfaces of the first and second members are preferably provided with different adhesive coupling characteristics, such as by provision of a surface adhesive promotor or a micro-texturized pattern to only one member. In this way, upon detachment of the first and second members, substantially all of the adhesive is removed from the other member. A filler material further establishes adhesive thickness and enhances structural unity of the adhesive during detachment of the respective members.