Patents by Inventor David Barwig

David Barwig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to provide die attach stress relief using gold stud bumps
    Patent number: 9754914
    Abstract: An integrated circuit is attached to a substrate with a controlled stand-off height, by mounting a plurality of stud bumps of the controlled stand-off height to the substrate at predetermined locations, placing adhesive dots over the stud bumps, placing the integrated circuit on the substrate over the adhesive dots, and applying downward pressure on the integrated circuit until the integrated circuit is in mechanical contact with the stud bumps.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: September 5, 2017
    Assignee: Rosemount Aerospace Inc.
    Inventors: Jim Golden, David Barwig