Patents by Inventor David Beatson

David Beatson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070210815
    Abstract: A blade probe card includes a plurality of blades that each includes a first end connected to a printed circuit board and a second end. A probe member is attached to the second end of each blade and extends outward to make contact with a device under test. A ground member is attached to the second end of each blade. The blade probe card also includes a common ground member that is separate from the printed circuit board and coupled to the ground member of each blade. Each blade may also include a first conductive signal trace and two or more conductive ground traces formed on a surface of each blade. The first conductive signal trace electrically connects the probe member to a contact on the printed circuit board. The two or more conductive ground traces are adjacent to the conductive signal trace and reduce crosstalk between the blades.
    Type: Application
    Filed: February 26, 2007
    Publication date: September 13, 2007
    Inventors: Habib Kilicaslan, David McDevitt, Bahadir Tunaboylu, David Beatson
  • Publication number: 20070089551
    Abstract: A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.
    Type: Application
    Filed: September 29, 2006
    Publication date: April 26, 2007
    Inventors: Scott Williams, Edward Laurent, David Beatson, Bahadir Tunaboylu, Edward Malantonio
  • Patent number: 7173441
    Abstract: A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and separate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: February 6, 2007
    Assignee: SV Probe Pte., Ltd.
    Inventors: January Kister, David Beatson, Edward Laurent
  • Publication number: 20070026574
    Abstract: Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of the underlying conductive material while providing the basis for a high conductivity bond. The copper nitride bonding surface provides a relatively non-conductive, corrosion-resistant bonding surface while at the same time being readily transformed into a conductive layer at or just prior to the time of bonding.
    Type: Application
    Filed: April 8, 2004
    Publication date: February 1, 2007
    Applicant: KULICKE & SOFFA INVESTMENTS INC.
    Inventors: David Beatson, Horst Clauderg, Kenneth Dury
  • Publication number: 20060219754
    Abstract: A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 5, 2006
    Inventors: Horst Clauberg, Ronald Focia, David Beatson, Kenneth Dury
  • Publication number: 20060060631
    Abstract: A motion control device for controlling rotary and linear motion which includes a first linear actuator having a first fixed member and a first moveable drive member, the first moveable drive member being driven for motion relative to the first fixed member along a first longitudinal axis. The device also includes a second linear actuator having a second fixed member and a second moveable drive member, the second movable drive member being driven for motion relative to the second fixed member along a second longitudinal axis. A drive assembly is configured to be driven by the first and second moveable drive members for (a) linear motion along an axis substantially parallel to the first and second longitudinal axes, and (b) rotation about an axis of rotation. A position of each of the moveable drive members is separately controllable to control rotational and linear positions of the drive assembly.
    Type: Application
    Filed: September 20, 2005
    Publication date: March 23, 2006
    Inventors: E. Frasch, David Beatson
  • Publication number: 20060027747
    Abstract: A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material.
    Type: Application
    Filed: August 3, 2005
    Publication date: February 9, 2006
    Applicant: K&S Interconnect, Inc.
    Inventors: Bahadir Tunaboylu, Edward Malantonio, David Beatson, Andrew Hmiel
  • Publication number: 20050284914
    Abstract: A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.
    Type: Application
    Filed: June 9, 2005
    Publication date: December 29, 2005
    Inventors: David Beatson, Deepak Sood, Norman Lucas, Zhijie Wang
  • Publication number: 20050286060
    Abstract: A system for determining wire bonding tool placement for use with a wire bonder and an optical imager is provided. The system includes a prism disposed below the optical imager and the wire bonding tool. The system also includes at least one lens positioned between the prism and a lower portion of the wire bonding tool along a first optical axis. The at least one lens and the prism define an object plane between the at least one lens and the lower portion of the wire bonding tool. The at least one lens is positioned between the prism and the optical imager along a second optical axis. The at least one lens and the prism define an image plane between the at least one lens and the optical imager.
    Type: Application
    Filed: June 9, 2005
    Publication date: December 29, 2005
    Inventors: David Beatson, Deepak Sood, Norman Lucas
  • Publication number: 20050284915
    Abstract: An apparatus for manipulating a work piece in connection with a wire bonding machine including at least one magazine handler is provided. The apparatus includes a first conveyor system configured to receive work pieces from the at least one magazine handler, and a second conveyor system configured to receive work pieces from the at least one magazine handler. The apparatus is adapted such that the second conveyor system prepares a work piece for a wire bonding operation by a wire bonding tool concurrent with the first conveyor system supporting another work piece during a wire bonding operation of the another work piece using the wire bonding tool.
    Type: Application
    Filed: June 14, 2005
    Publication date: December 29, 2005
    Inventors: David Beatson, Richard Sadler, Mohamad Aziz, Arindam Sinharoy
  • Publication number: 20050260791
    Abstract: A method of processing a semiconductor device is provided. The method includes providing a semiconductor device supported by a carrier structure. The carrier structure defines a plurality of vias from a first surface of the carrier structure adjacent the semiconductor device to a second surface of the carrier structure. The method also includes extending a conductor through one of the vias such that a first end of the conductor at least partially extends below the second surface. The method also includes electrically coupling another portion of the conductor to a portion of the semiconductor device.
    Type: Application
    Filed: May 5, 2005
    Publication date: November 24, 2005
    Applicant: Kulicke and Soffa Investments, Inc.
    Inventors: David Beatson, Jamin Ling
  • Publication number: 20050253140
    Abstract: A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor dies, at least a portion of the semiconductor dies including contact pads for testing the respective semiconductor die. The method also includes positioning conductive bumps on the contact pads prior to completing wafer testing of the semiconductor wafer and prior to the singulation of the plurality of semiconductor dies from the semiconductor wafer. At least a portion of the conductive bumps are configured to be electrical paths during wafer testing of the semiconductor wafer.
    Type: Application
    Filed: May 3, 2005
    Publication date: November 17, 2005
    Applicant: Kulicke and Soffa Investments, Inc.
    Inventor: David Beatson
  • Patent number: 6965245
    Abstract: A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and seperate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: November 15, 2005
    Assignee: K&S Interconnect, Inc.
    Inventors: January Kister, David Beatson, Edward Laurent
  • Publication number: 20050247758
    Abstract: A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance system translates the bonding tool in a vertical direction and translates the bonding tool along a first horizontal axis. A work table supports at least one semiconductor device to be wire bonded. A work table conveyance system translates the semiconductor device along a second horizontal axis.
    Type: Application
    Filed: March 29, 2005
    Publication date: November 10, 2005
    Inventors: David Beatson, E. Frasch
  • Publication number: 20050184133
    Abstract: A wire bonding system for attaching a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system includes a frame and a bonding head attached to the frame and adapted to attach a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system also includes a laser cleaning mechanism mounted to the frame, the laser cleaning mechanism including a laser for emitting laser light adapted to irradiate contaminants on a bonding pad, the laser mechanism located on the frame so as to emit light onto a bonding pad of at least one of the semiconductor device and the substrate prior to the bonding head attaching the wire thereto.
    Type: Application
    Filed: February 24, 2005
    Publication date: August 25, 2005
    Inventors: Horst Clauberg, Ronald Focia, David Beatson, Kenneth Dury
  • Publication number: 20050052194
    Abstract: A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and separate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal.
    Type: Application
    Filed: October 12, 2004
    Publication date: March 10, 2005
    Inventors: January Kister, David Beatson, Edward Laurent
  • Publication number: 20050046969
    Abstract: A method and system for providing different images representing plural depths of field of an electronic device. The vision system has a beamsplitter for receiving an image of the device illuminated by the at least one light source, the beamsplitter providing one of the plurality of images of the device based in a wavelength of the light source; an aperture having a plurality of effective diameters based on the wavelength of light from the at least one light source, the aperture determining a depth of field of the image of the device; and an optical element for receiving the image of the device, the optical element magnifying the image by a predetermined magnification factor to produce a magnified image having the determined depth of field.
    Type: Application
    Filed: September 29, 2004
    Publication date: March 3, 2005
    Inventors: David Beatson, Christian Hoffman
  • Publication number: 20050046968
    Abstract: A method and system for providing different images representing plural depths of field of an electronic device. The vision system has a beamsplitter for receiving an image of the device illuminated by the at least one light source, the beamsplitter providing one of the plurality of images of the device based in a wavelength of the light source; an aperture having a plurality of effective diameters based on the wavelength of light from the at least one light source, the aperture determining a depth of field of the image of the device; and an optical element for receiving the image of the device, the optical element magnifying the image by a predetermined magnification factor to produce a magnified image having the determined depth of field.
    Type: Application
    Filed: September 29, 2004
    Publication date: March 3, 2005
    Inventors: David Beatson, Christian Hoffman
  • Publication number: 20040217768
    Abstract: A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and seperate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal.
    Type: Application
    Filed: May 1, 2003
    Publication date: November 4, 2004
    Inventors: January Kister, David Beatson, Edward Laurent