Patents by Inventor David Benjaminson
David Benjaminson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11776822Abstract: Embodiments described herein relate a cleaning fixture and method to prevent chemical solutions from contacting the various substrate supporting member features and penetrating into the holes and the metal plate of the substrate supporting surface. The cleaning fixture includes a mounting plate having a plurality of thru-holes arranged on a bolt circle and configured to align with a plurality of thread holes disposed in an electrostatic chuck, a recess formed in the mounting plate, and a gas port formed through the mounting plate. A sealed plenum is formed between the recess of the mounting plate and a lower surface of the electrostatic chuck when the electrostatic chuck is coupled to the mounting plate. The gas port is fluidly coupled to the sealed plenum.Type: GrantFiled: May 2, 2019Date of Patent: October 3, 2023Assignee: Applied Materials, Inc.Inventors: Tuochuan Huang, Gang Peng, David W. Groechel, Vijay D. Parkhe, Shinnosuke Kawaguchi, David Benjaminson
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Patent number: 11217462Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.Type: GrantFiled: March 30, 2020Date of Patent: January 4, 2022Assignee: Applied Materials, Inc.Inventors: David Benjaminson, Dmitry Lubomirsky, Ananda Seelavanth Math, Saravanakumar Natarajan, Shubham Chourey
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Patent number: 11158527Abstract: A workpiece holder includes a puck having a cylindrical axis, a radius about the cylindrical axis, and a thickness. At least a top surface of the puck is substantially planar, and the puck defines one or more thermal breaks. Each thermal break is a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck. The radial recess has a thermal break depth that extends through at least half of the puck thickness, and a thermal break radius that is at least one-half of the puck radius. A method of processing a wafer includes processing the wafer with a first process that provides a first center-to-edge process variation, and subsequently, processing the wafer with a second process that provides a second center-to-edge process variation that substantially compensates for the first center-to-edge process variation.Type: GrantFiled: November 4, 2019Date of Patent: October 26, 2021Assignee: Applied Materials, Inc.Inventors: David Benjaminson, Dmitry Lubomirsky
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Publication number: 20210249280Abstract: Embodiments described herein relate a cleaning fixture and method to prevent chemical solutions from contacting the various substrate supporting member features and penetrating into the holes and the metal plate of the substrate supporting surface. The cleaning fixture includes a mounting plate having a plurality of thru-holes arranged on a bolt circle and configured to align with a plurality of thread holes disposed in an electrostatic chuck, a recess formed in the mounting plate, and a gas port formed through the mounting plate. A sealed plenum is formed between the recess of the mounting plate and a lower surface of the electrostatic chuck when the electrostatic chuck is coupled to the mounting plate. The gas port is fluidly coupled to the sealed plenum.Type: ApplicationFiled: May 2, 2019Publication date: August 12, 2021Inventors: Tuochuan HUANG, Gang PENG, David W. GROECHEL, Vijay D. PARKHE, Shinnosuke KAWAGUCHI, David BENJAMINSON
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Patent number: 11062887Abstract: Semiconductor processing systems are described, which may include a substrate support assembly having a substrate support surface. Exemplary substrate support assemblies may include a ceramic heater defining the substrate support surface. The assemblies may include a ground plate on which the ceramic heater is seated. The assemblies may include a stem with which the ground plate is coupled. The assemblies may include an electrode embedded within the ceramic heater at a depth from the substrate support surface. The chambers or systems may also include an RF match configured to provide an AC current and an RF power through the stem to the electrode. The RF match may be coupled with the substrate support assembly along the stem. The substrate support assembly and RF match may be vertically translatable within the semiconductor processing system.Type: GrantFiled: September 17, 2018Date of Patent: July 13, 2021Assignee: Applied Materials, Inc.Inventors: Soonam Park, David Benjaminson, Xikun Wang, Dmitry Lubomirsky
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Patent number: 11049755Abstract: Exemplary support assemblies may include a top puck defining a substrate support surface, where the top puck is also characterized by a height. The assemblies may include a stem coupled with the top puck on a second surface of the top puck opposite the substrate support surface. The assemblies may include an RF electrode embedded within the top puck proximate the substrate support surface. The assemblies may include a heater embedded within the top puck. The assemblies may also include a ground shield embedded within the top puck. The ground shield may be characterized by an inner region extending radially through the top puck. The ground shield may further be characterized by an outer region extending perpendicular to the inner region.Type: GrantFiled: September 14, 2018Date of Patent: June 29, 2021Assignee: Applied Materials, Inc.Inventors: David Benjaminson, Michael Grace, Soonam Park, Dmitry Lubomirsky, Jaeyong Cho, Nikolai Kalnin, Don Channa K Kaluarachchi
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Publication number: 20200273728Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.Type: ApplicationFiled: March 30, 2020Publication date: August 27, 2020Applicant: Applied Materials, Inc.Inventors: David Benjaminson, Dmitry Lubomirsky, Ananda Seelavanth Math, Saravanakumar Natarajan, Shubham Chourey
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Patent number: 10607867Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.Type: GrantFiled: December 4, 2018Date of Patent: March 31, 2020Assignee: Applied Materials, Inc.Inventors: David Benjaminson, Dmitry Lubomirsky, Ananda Seelavanth Math, Saravanakumar Natarajan, Shubham Chourey
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Publication number: 20200090972Abstract: Exemplary support assemblies may include a top puck defining a substrate support surface, where the top puck is also characterized by a height. The assemblies may include a stem coupled with the top puck on a second surface of the top puck opposite the substrate support surface. The assemblies may include an RF electrode embedded within the top puck proximate the substrate support surface. The assemblies may include a heater embedded within the top puck. The assemblies may also include a ground shield embedded within the top puck. The ground shield may be characterized by an inner region extending radially through the top puck. The ground shield may further be characterized by an outer region extending perpendicular to the inner region.Type: ApplicationFiled: September 14, 2018Publication date: March 19, 2020Applicant: Applied Materials, Inc.Inventors: David Benjaminson, Michael Grace, Soonam Park, Dmitry Lubomirsky, Jaeyong Cho, Nikolai Kalnin, Don Channa K. Kaluarachchi
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Publication number: 20200090912Abstract: Semiconductor processing systems are described, which may include a substrate support assembly having a substrate support surface. Exemplary substrate support assemblies may include a ceramic heater defining the substrate support surface. The assemblies may include a ground plate on which the ceramic heater is seated. The assemblies may include a stem with which the ground plate is coupled. The assemblies may include an electrode embedded within the ceramic heater at a depth from the substrate support surface. The chambers or systems may also include an RF match configured to provide an AC current and an RF power through the stem to the electrode. The RF match may be coupled with the substrate support assembly along the stem. The substrate support assembly and RF match may be vertically translatable within the semiconductor processing system.Type: ApplicationFiled: September 17, 2018Publication date: March 19, 2020Applicant: APPLIED MATERIALS, INC.Inventors: Soonam Park, David Benjaminson, Xikun Wang, Dmitry Lubomirsky
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Publication number: 20200066556Abstract: A workpiece holder includes a puck having a cylindrical axis, a radius about the cylindrical axis, and a thickness. At least a top surface of the puck is substantially planar, and the puck defines one or more thermal breaks. Each thermal break is a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck. The radial recess has a thermal break depth that extends through at least half of the puck thickness, and a thermal break radius that is at least one-half of the puck radius. A method of processing a wafer includes processing the wafer with a first process that provides a first center-to-edge process variation, and subsequently, processing the wafer with a second process that provides a second center-to-edge process variation that substantially compensates for the first center-to-edge process variation.Type: ApplicationFiled: November 4, 2019Publication date: February 27, 2020Applicant: Applied Materials, Inc.Inventors: David Benjaminson, Dmitry Lubomirsky
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Publication number: 20190371577Abstract: Implementations described herein provide a substrate support assembly which enables temperature uniformity across a workpiece surface. In one embodiment, a substrate support assembly is provided that includes a body. The body made from ceramic. The body having a workpiece support surface and a mounting surface. The workpiece support surface and the bonding chuck body surface having a flatness of less than 10 microns. A first heater is disposed on the bottom surface outside the body. A bonding layer is disposed over the first heater, wherein the bonding layer is electrically insulating and a cooling base having a body made from a metal. The cooling body having an upper cooling body surface and a lower cooling body surface wherein the upper cooling body surface is less than about 10 microns flat.Type: ApplicationFiled: May 3, 2019Publication date: December 5, 2019Inventors: David BENJAMINSON, Vijay D. PARKHE, Onkara Swamy KORA SIDDARAMAIAH, Kirby H. FLOYD, Justin WANG, Mehmet Tugrul SAMIR, Dmitry LUBOMIRSKY
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Patent number: 10468276Abstract: A workpiece holder includes a puck having a cylindrical axis, a radius about the cylindrical axis, and a thickness. At least a top surface of the puck is substantially planar, and the puck defines one or more thermal breaks. Each thermal break is a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck. The radial recess has a thermal break depth that extends through at least half of the puck thickness, and a thermal break radius that is at least one-half of the puck radius. A method of processing a wafer includes processing the wafer with a first process that provides a first center-to-edge process variation, and subsequently, processing the wafer with a second process that provides a second center-to-edge process variation that substantially compensates for the first center-to-edge process variation.Type: GrantFiled: April 28, 2017Date of Patent: November 5, 2019Assignee: Applied Materials, Inc.Inventors: David Benjaminson, Dmitry Lubomirsky
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Publication number: 20190109025Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.Type: ApplicationFiled: December 4, 2018Publication date: April 11, 2019Applicant: Applied Materials, Inc.Inventors: David Benjaminson, Dmitry Lubomirsky, Ananda Seelavanth Math, Saravanakumar Natarajan, Shubham Chourey
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Patent number: 10233547Abstract: Provided are methods for etching films comprising transition metals which help to minimize higher etch rates at the grain boundaries of polycrystalline materials. Certain methods pertain to amorphization of the polycrystalline material, other pertain to plasma treatments, and yet other pertain to the use of small doses of halide transfer agents in the etch process.Type: GrantFiled: February 19, 2018Date of Patent: March 19, 2019Assignee: Applied Materials, Inc.Inventors: Benjamin Schmiege, Nitin K. Ingle, Srinivas D. Nemani, Jeffrey W. Anthis, Xikun Wang, Jie Liu, David Benjaminson
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Patent number: 10147620Abstract: A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.Type: GrantFiled: April 28, 2017Date of Patent: December 4, 2018Assignee: Applied Materials, Inc.Inventors: David Benjaminson, Dmitry Lubomirsky, Ananda Seelavanth Math, Saravanakumar Natarajan, Shubham Chourey
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Publication number: 20180213608Abstract: A heater assembly for a substrate support assembly includes a flexible body. The heater assembly further includes one or more resistive heating elements disposed in the flexible body. The heater assembly further includes a first metal layer disposed on the top surface of the flexible body and extending at least partially onto an outer sidewall of the flexible body. The heater assembly further includes a second metal layer disposed on a bottom surface of the flexible body and extending at least partially onto the outer sidewall of the flexible body, wherein the second metal layer is coupled to the first metal layer at the outer sidewall of the flexible body such that the first metal layer and the second metal layer enclose, and form a continuous electrically conductive path around, the outer sidewall of the flexible body.Type: ApplicationFiled: January 20, 2017Publication date: July 26, 2018Inventors: David Benjaminson, Ken Schatz, Dmitry Lubomirsky
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Publication number: 20180195179Abstract: Provided are methods for etching films comprising transition metals which help to minimize higher etch rates at the grain boundaries of polycrystalline materials. Certain methods pertain to amorphization of the polycrystalline material, other pertain to plasma treatments, and yet other pertain to the use of small doses of halide transfer agents in the etch process.Type: ApplicationFiled: February 19, 2018Publication date: July 12, 2018Inventors: Benjamin Schmiege, Nitin K. Ingle, Srinivas D. Nemani, Jeffrey W. Anthis, Xikun Wang, Jie Liu, David Benjaminson
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Patent number: 9896770Abstract: Provided are methods for etching films comprising transition metals which help to minimize higher etch rates at the grain boundaries of polycrystalline materials. Certain methods pertain to amorphization of the polycrystalline material, other pertain to plasma treatments, and yet other pertain to the use of small doses of halide transfer agents in the etch process.Type: GrantFiled: December 19, 2016Date of Patent: February 20, 2018Assignee: Applied Materials, Inc.Inventors: Benjamin Schmiege, Nitin K. Ingle, Srinivas D. Nemani, Jeffrey W. Anthis, Xikun Wang, Jie Liu, David Benjaminson
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Patent number: 9741593Abstract: A workpiece holder includes a puck having a cylindrical axis, a radius about the cylindrical axis, and a thickness. At least a top surface of the puck is substantially planar, and the puck defines one or more thermal breaks. Each thermal break is a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck. The radial recess has a thermal break depth that extends through at least half of the puck thickness, and a thermal break radius that is at least one-half of the puck radius. A method of processing a wafer includes processing the wafer with a first process that provides a first center-to-edge process variation, and subsequently, processing the wafer with a second process that provides a second center-to-edge process variation that substantially compensates for the first center-to-edge process variation.Type: GrantFiled: August 6, 2015Date of Patent: August 22, 2017Assignee: Applied Materials, Inc.Inventors: David Benjaminson, Dmitry Lubomirsky