Patents by Inventor David Benning

David Benning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor
    Patent number: 12581983
    Abstract: Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for forming a contact surface for an electrical conductor, wherein the shaped metal body is bent or folded. A method is also described for establishing electrical contacting of an electrical conductor on a semiconductor, said method including the steps of: fastening a bent or folded shaped metal body of a constant thickness to the semiconductor by means of a first fastening method and then fastening the electrical conductor to the shaped metal body by means of a second fastening method.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: March 17, 2026
    Assignee: DANFOSS SILICON POWER GMBH
    Inventors: André Bastos Abibe, Frank Osterwald, Jacek Rudzki, Martin Becker, Ronald Eisele, David Benning
  • Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other
    Patent number: 12125817
    Abstract: Semiconductor module having a first substrate, a second substrate and a spacer distancing the substrates from each other, wherein the spacer is formed by at least one elastic shaped metal body.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: October 22, 2024
    Assignee: DANFOSS SILICON POWER GMBH
    Inventors: Martin Becker, André Bastos Abibe, Ronald Eisele, Jacek Rudzki, Frank Osterwald, David Benning
  • SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND A SPACER SEPARATING THE SUBSTRATES FROM EACH OTHER
    Publication number: 20220302073
    Abstract: Semiconductor module having a first substrate, a second substrate and a spacer distancing the substrates from each other, wherein the spacer is formed by at least one elastic shaped metal body.
    Type: Application
    Filed: May 6, 2020
    Publication date: September 22, 2022
    Inventors: Martin Becker, André Bastos Abibe, Ronald Eisele, Jacek Rudzki, Frank Osterwald, David Benning
  • SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SHAPED METAL BODY THAT IS ELECTRICALLY CONTACTED BY THE SEMICONDUCTOR
    Publication number: 20220302072
    Abstract: Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for forming a contact surface for an electrical conductor, wherein the shaped metal body is bent or folded. A method is also described for establishing electrical contacting of an electrical conductor on a semiconductor, said method including the steps of: fastening a bent or folded shaped metal body of a constant thickness to the semiconductor by means of a first fastening method and then fastening the electrical conductor to the shaped metal body by means of a second fastening method.
    Type: Application
    Filed: April 30, 2020
    Publication date: September 22, 2022
    Inventors: André Bastos Abibe, Frank Osterwald, Jacek Rudzki, Martin Becker, Ronald Eisele, David Benning
  • Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
    Patent number: 10622331
    Abstract: One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic component A substrate is provided with a first side and a second side. A contact material layer is applied to the first side of the substrate. A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: April 14, 2020
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Andreas Hinrich, Susanne Duch, Anton Miric, Michael Schäfer, Christian Bachmann, Holger Ulrich, Frank Osterwald, David Benning, Jacek Rudzki, Lars Paulsen, Frank Schefuss, Martin Becker