Abstract: A MEMS microforce sensor for high temperature nanoindentation is used for determining a mechanical property of a sample by sensing a deflection and measuring a force. The MEMS microforce sensor includes at least a cold movable body, a heatable movable body, a heating resistor and capacitor electrodes. The cold movable body and the heatable movable body are mechanically connected by at least one bridge and the capacitor electrodes measure a force applied on the sample by sensing the deflection of the cold movable body relative to the outer frame by a change of electrical capacitance.

Abstract: A MEMS-nanoindenter chip performs nanoindentation on a specimen. The MEMS-nanoindenter chip has an intender probe joined with an indenter tip. The indenter tip indents into the specimen. A reference probe is joined with a reference tip, the reference tip touches the specimen. Sensing capabilities are provided to measure the position of the indenter probe relative to the reference probe. The MEMS-nanoindenter chip enables highly accurate measurements since the frame stiffness is not part of the measurement chain any more. Furthermore, thermal drift during the nanoindentation is considerably reduced.

Abstract: A MEMS microforce sensor for high temperature nanoindentation is used for determining a mechanical property of a sample by sensing a deflection and measuring a force. The MEMS microforce sensor includes at least a cold movable body, a heatable movable body, a heating resistor and capacitor electrodes. The cold movable body and the heatable movable body are mechanically connected by at least one bridge and the capacitor electrodes measure a force applied on the sample by sensing the deflection of the cold movable body relative to the outer frame by a change of electrical capacitance.

Abstract: According to an aspect of the invention, a computerised system, in particular control system is provided, which is configured, from an input vector (In) which represents a discrete number of input variables and from a state vector (Zn) which represents a discrete number of state variables, to determine a new state vector (Zn+1) whose state variables are updated, as well as an output vector (On) which represents a discrete number of output variables, wherein the output variables are provided for controlling at least one appliance and/or for outputting information. The system comprises a plurality of computation units which in parallel determine the new state vector and the output vector from the input vector and the state vector. According to the invention, the system is configured such that at least all news state vectors are exchanged between the computation units after each cycle.

Abstract: A MEMS-nanoindenter chip performs nanoindentation on a specimen. The MEMS-nanoindenter chip has an intender probe joined with an indenter tip. The indenter tip indents into the specimen. A reference probe is joined with a reference tip, the reference tip touches the specimen. Sensing capabilities are provided to measure the position of the indenter probe relative to the reference probe. The MEMS-nanoindenter chip enables highly accurate measurements since the frame stiffness is not part of the measurement chain any more. Furthermore, thermal drift during the nanoindentation is considerably reduced.

Abstract: According to an aspect of the invention, a computerised system, in particular control system is provided, which is configured, from an input vector (In) which represents a discrete number of input variables and from a state vector (Zn) which represents a discrete number of state variables, to determine a new state vector (Zn+1) whose state variables are updated, as well as an output vector (On) which represents a discrete number of output variables, wherein the output variables are provided for controlling at least one appliance and/or for outputting information. The system comprises a plurality of computation units which in parallel determine the new state vector and the output vector from the input vector and the state vector. According to the invention, the system is configured such that at least all news state vectors are exchanged between the computation units after each cycle.

Abstract: A system for testing MEMS-structures includes a microforce sensor, two or more multi-axis micropositioning units, at least one electrical probe and a sample holder on which a MEMS-structure is mounted. At least one of the multi-axis micropositioning units is motorized and at least one additional micropositioning unit is equipped with at least one electrical probe to apply electrical signals or to measure electrical signals at one or multiple locations on the MEMS structure. The system with the aforementioned components allows a combined electrical and probe-based mechanical testing of MEMS-structures.

Abstract: A system for testing MEMS-structures includes a microforce sensor, two or more multi-axis micropositioning units, at least one electrical probe and a sample holder on which a MEMS-structure is mounted. At least one of the multi-axis micropositioning units is motorized and at least one additional micropositioning unit is equipped with at least one electrical probe to apply electrical signals or to measure electrical signals at one or multiple locations on the MEMS structure. The system with the aforementioned components allows a combined electrical and probe-based mechanical testing of MEMS-structures.