Patents by Inventor David Bilton

David Bilton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of assembling substrates and electronic components
    Patent number: 6313412
    Abstract: A method of assembling a substrate and an electrical or electronic component, the component having electrically conductive leads with surfaces of an alloy from the list consisting of tin, nickel, tin copper, tin silver, nickel palladium, gold palladium, and silver palladium, and the leads being soldered to copper-based terminals of the substrate by a solder alloy, the solder alloy comprising, by weight, 99.3% tin and 0.7% copper. The soldering takes place in a chamber having a nitrogen inert atmosphere. Lead solder is thus avoided.
    Type: Grant
    Filed: August 6, 1998
    Date of Patent: November 6, 2001
    Assignee: Nortel Networks Limited
    Inventors: William P. Trumble, Murray W. Hamilton, David Bilton