Patents by Inventor David BOLDUC

David BOLDUC has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230026271
    Abstract: We provide compounds that may be useful as CPS1 inhibitors. These compounds may be useful, for example, in the treatment of cancer.
    Type: Application
    Filed: November 20, 2020
    Publication date: January 26, 2023
    Applicant: Eisai R&D Management Co., Ltd.
    Inventors: Alan ROLFE, David BOLDUC, Nicholas LARSEN, Andrew S. COOK, Kiyoyuki OMOTO
  • Patent number: 10731400
    Abstract: A patio door or at least a door panel or a door panel frame for a patio door is provided. The patio door has two panels, wherein one is an “active panel” (i.e. a sliding panel) and another one is a “stationary panel” (i.e. a fixed panel). The door panels include at least four elongated door frame members configurable to define rectangular door panels frame with a longitudinal axis and a transversal axis. There is also provided a tightening connector assembly, a connector body with a weatherstrip receiving channel and a door panel connection assembly. The tightening connector assembly includes a connector body having a first and second frame segments extending along a tightening axis and an insert receiving cavity defined therein, the first and second frame segments being engageable with two of the at least four elongated door frame members. The tightening connector assembly also includes a tightening insert engageable in the insert receiving cavity of the connector body.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: August 4, 2020
    Assignee: PORTES PATIO NOVATECH IINC.
    Inventors: Louis-David Bolduc, Erick Giroux
  • Publication number: 20180128034
    Abstract: A patio door or at least a door panel or a door panel frame for a patio door is provided. The patio door has two panels, wherein one is an “active panel” (i.e. a sliding panel) and another one is a “stationary panel” (i.e. a fixed panel). The door panels include at least four elongated door frame members configurable to define rectangular door panels frame with a longitudinal axis and a transversal axis. There is also provided a tightening connector assembly, a connector body with a weatherstrip receiving channel and a door panel connection assembly. The tightening connector assembly includes a connector body having a first and second frame segments extending along a tightening axis and an insert receiving cavity defined therein, the first and second frame segments being engageable with two of the at least four elongated door frame members. The tightening connector assembly also includes a tightening insert engageable in the insert receiving cavity of the connector body.
    Type: Application
    Filed: November 8, 2017
    Publication date: May 10, 2018
    Inventors: Louis-David BOLDUC, Erick GIROUX
  • Patent number: 6402012
    Abstract: A method for forming solder bumps and solder connections for surface-mount devices. The invention utilizes a solder jetting technique by which a controlled amount of solder is accurately deposited to yield solder bumps on the bond pads of a device, which upon reflow form solder connections having sufficient stand-off height to promote stress relief during thermal cycling, and achieve the necessary electrical and thermal capabilities required of the solder connections. The method generally entails solder jetting multiple solder droplets onto a surface to form a two-dimensional base pattern. An additional solder droplet may be solder jetted onto the base droplets of the two-dimensional base pattern so that the additional droplet contacts at least two of the base droplets and yields a three-dimensional structure overlying the bond pad. The solder droplets are then reflowed to form a single coalesced solder bump on the bond pad.
    Type: Grant
    Filed: November 8, 1999
    Date of Patent: June 11, 2002
    Assignee: Delphi Technologies, Inc.
    Inventor: Timothy David Bolduc