Patents by Inventor David BONNICI

David BONNICI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages having dual encapsulation material
    Patent number: 10431514
    Abstract: One or more embodiments are directed to a semiconductor package that includes transparent encapsulation material and an opaque encapsulation material. In one embodiment, the opaque encapsulation material is thicker than the transparent encapsulation material; however, the outer surfaces of the opaque and the transparent encapsulation materials are coplanar with each other.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: October 1, 2019
    Assignee: STMicroelectronics (Malta) Ltd
    Inventors: David Bonnici, Brenda Farrugia
  • SEMICONDUCTOR PACKAGES HAVING DUAL ENCAPSULATION MATERIAL
    Publication number: 20190157176
    Abstract: One or more embodiments are directed to a semiconductor package that includes transparent encapsulation material and an opaque encapsulation material. In one embodiment, the opaque encapsulation material is thicker than the transparent encapsulation material; however, the outer surfaces of the opaque and the transparent encapsulation materials are coplanar with each other.
    Type: Application
    Filed: November 20, 2017
    Publication date: May 23, 2019
    Inventors: David BONNICI, Brenda FARRUGIA